35 MICRO-X CERAMIC PACKAGE Search Results

Contextual Info: Features 35 micro-X Package1 Cascadable 50 LI Gain Block • Low Operating Voltage 3.5 V typical Vd • 3 dB Bandwidth: DC to 0.9 GHz • High Gain: 19.0 dB typical at 0.5 GHz • Low Noise Figure: 2.8 dB typical at 0.5 GHz • Cost Effective Ceramic Microstrip Package

avantek

Abstract: micro-x 64135 Avantek amplifier 167 MGA-64135 Avantek rf amplifier
Contextual Info: MG A-64135 2-6 GHz Cascadable GaAs MMIC Amplifier avantek Avantek 35 Micro-X Package Features • • • • Cascadable 50 Ci Gain Block Broadband Performance: 2-6 GHz 12.0dB typical Gain ± 0.8 dB Gain Flatness 12.0 dBm Pi dB Single Supply Bias Cost Effective Ceramic Microstrip Package

A08 monolithic amplifier MMIC MAR-8

Contextual Info: O MG A-64135 2-6 GHz Cascadable GaAs MMIC Amplifier avkntek Avantek 35 Micro-X Package Features • • • • Cascadable 50 Cl Gain Block Broadband Performance: 2-6 GHz 12.0 dB typical Gain ± 0.8 dB Gain Flatness 12.0 dBm Pi dB Single Supply Bias Cost Effective Ceramic M icrostrip Package

Contextual Info: M128S32 128K x 32 Fast SRAM Issue 2.1 December 2007 General Description Features The M128S32 is a high reliability 4Mbit fast static ram housed in high temperature co-fired ceramic. Access times are 20, 25 or 35ns, with 15 & 17ns in development. The high reliability 68 CQFP package

Kostat tray

Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Contextual Info: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher

SME2470-021

Abstract: SMD2420 SMD2440-001 SME2470-001 SMD2420-001 SMD2440-011 lens photodiode phototransistor micro wave oven
Contextual Info: Infrared Components Ceramic Discrete Surface Mount Emitters and Detectors FEATURES • Small package size • Glass lensed optics for efficient optical coupling • Upright or inverted mounting capability • Low profile, small size for flexible layout of multiple

AME5170

Contextual Info: AME Low Cost Micro Power Boost DC/DC Converter AME5170 n General Description The AME5170 is a fixed off-time step-up DC/DC converter in a small SOT-25/TSOT-25A package.The AME5170 is ideal for LCD panels requiring low current and high efficiency as well as LED application for cellular

AME5170

Abstract: AME5170AEEV AME5170AEEVADJY AME5170AEEVADJZ
Contextual Info: AME Low Cost Micro Power Boost DC/DC Converter AME5170 n General Description The AME5170 is a fixed off-time step-up DC/DC converter in a small SOT-25 package. The AME5170 is ideal for LCD panels requiring low current and high efficiency as well as LED application for cellular phone backlighting,

AME5170AAEEVADJZ

Abstract: marking code l sot-25 step-up AME5170 AME5170A AME5170AAEEV 015BL
Contextual Info: AME Low Cost Micro Power Boost DC/DC Converter AME5170A n General Description The AME5170A is a fixed off-time step-up DC/DC converter in a small SOT-25 package. The AME5170A is ideal for LCD panels requiring low current and high efficiency as well as LED application for cellular phone backlighting, PDAs, and other hand-held devices. The low

AME5170

Abstract: AME5170AEEV AME5170AEEVADJY AME5170AEEVADJZ OC810 marking code l sot-25 step-up
Contextual Info: AME, Inc. Low Cost Micro Power Boost DC/DC Converter AME5170 n General Description The AME5170 is a fixed off-time step-up DC/DC converter in a small SOT-25 package. The AME5170 is ideal for LCD panels requiring low current and high efficiency as well as LED application for cellular phone backlighting,

Contextual Info: MICRO POWER SYSTEMS INC LIE D • bGT74M4 0G04b32 b47 ■ MPS MP7686 m CMOS 6-Bit High Speed Analog-to-Digital Converter Micro Power Systems • ESD Protection: 4000 Volts Minimum • Latch-Up Free • CDIP, PDIP & SOIC Packages Available FEATURES • •

socket AM2

Abstract: AM2 31117 AM2 Processor Functional Data Sheet socket 940 pin package AM2 Processor Functional Socket am2 Processor Functional 31117 amd publication 31117 socket 940 am2 pin Processor model 2006
Contextual Info: AMD Opteron Processor Product Data Sheet • Compatible with Existing 32-Bit Code Base 940-Pin Package Specific Features – Including support for SSE, SSE2, SSE3*, MMX™, 3DNow!™ technology and legacy x86 instructions • Refer to the AMD Functional Data Sheet,

amd athlon 64 socket 939

Abstract: AM2 Processor Functional Data Sheet socket 939 DDR2 SDRAM sstl_18 socket 940 am2 pin 31117 Socket AM2 Processor Functional AM2 31117 AM2 processor socket AM2
Contextual Info: AMD Athlon 64 FX Processor Product Data Sheet • Compatible with Existing 32-Bit Code Base Including support for SSE, SSE2, SSE3*, MMX™, 940-Pin Package Specific Features 3DNow!™ technology and legacy x86 instructions * • Refer to the AMD Functional Data Sheet,

Contextual Info: MP7686 CM OS 6-Bit High Speed Analog-to-Digital Converter m . Micro Power Systems • ESD Protection: 4000 Volts Minimum • Latch-Up Free • CDIP, PDIP & SOIC Packages Available FEATURES • • • • • • • • • Sampling Rates from 0.001 to 25 MHz MSPS

TCXO mtbf

Contextual Info: MONITOR PRODUCTS CO INC M7E D bEcl clQ7b 0 0 0 0 2 7 7 MONITOR PRODUCTS MONITOR « SM-990 MICRO MINIATURE CERAMIC SURFACE MOUNT HCMOS OSCILLATOR PACKAGE DIMENSIONS PM _ÉT E - “ 1 I 0 .2 0 0 ± .0 0 7 0.276 ± .0 0 7 FEATURES 0.197 ± .0 0 7 0 .1 0 2 ± .0 0 7

ABM7

Contextual Info: CERAMIC SMD MICRO MINIATURE MICROPROCESSOR CRYSTAL ABM7 Pb in Glass exempt per RoHS 2002/95/EC Annex (5 FEATURES: • Low in height (1.3 mm max.) • Ceramic package assures high reliability • Small size SMD, suitable for high density applications • Superior heat-resistant glass sealing

ABM7

Contextual Info: CERAMIC SMD MICRO MINIATURE MICROPROCESSOR CRYSTAL ABM7 Pb in Glass exempt per RoHS 2002/95/EC Annex (5 FEATURES: • Low in height (1.3 mm max.) • Ceramic package assures high reliability • Small size SMD, suitable for high density applications • Superior heat-resistant glass sealing

AN-1112

Abstract: LP3983 5-pin smd Voltage Regulators
Contextual Info: LP3983 Micropower, Low Quiescent Current, CMOS Voltage Regulator in micro SMD Package General Description Key Specifications The LP3983 is a fixed voltage low current regulator. n n n n n n n n The LP3983 is ideally suited to standby type applications in battery powered equipment, it allows the lifetime of the battery to be maximized. The device can be controlled via an

ABM7

Contextual Info: CERAMIC SMD MICRO MINIATURE MICROPROCESSOR CRYSTAL ABM7 Pb in Glass exempt per RoHS 2002/95/EC Annex (5 FEATURES: • Low in height (1.3 mm max.) • Ceramic package assures high reliability • Small size SMD, suitable for high density applications • Superior heat-resistant glass sealing

Micro Crystal CC1A-T1A

Abstract: b4 smd diode t1A transistor smd CH-2540 24.000 mhz
Contextual Info: CC1A-T1A AT Crystal 8 MHz – 30 MHz DIMENSIONS Package: Recommended Solder Pad: 8,0 1,2 2,7 2,3 4,0 2,3 4,2 max.1,75 3,7 1,2 All dimensions in mm typical Small ceramic package Package height 1.75 mm Fundamental mode frequencies SMD-package in Tape and Reel

TL-505

Abstract: tl505
Contextual Info: MP7686 m CM OS 6-Bit High Speed Analog-to-Digitaf Converter Micro Power Systems • ESD Protection: 4000 Volts Minimum • Latch-Up Free • CDIP, PDIP & SOIC Packages Available FEATURES • • • • • • • • • Sampling Rates from 0.001 to 25 MHz MSPS

ABM7

Contextual Info: CERAMIC SMD MICRO MINIATURE MICROPROCESSOR CRYSTAL ABM7 Pb in Glass exempt per RoHS 2002/95/EC Annex (5 FEATURES: • Low in height (1.3 mm max.) • Ceramic package assures high reliability • Small size SMD, suitable for high density applications RoHS

ABM7

Contextual Info: CERAMIC SMD MICRO MINIATURE MICROPROCESSOR CRYSTAL ABM7 Pb in Glass exempt per RoHS 2002/95/EC Annex (5 FEATURES: • Low in height (1.4 mm max.) • Ceramic package assures high reliability • Small size SMD, suitable for high density applications RoHS

MQFP Shipping Trays

Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
Contextual Info: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are