35DEG. Search Results
35DEG. Price and Stock
SPC Multicomp MPKHS-D110-F24DC 0.35DEGC/WRelay Heat Sink, 96Mm X 106Mm X 110Mm Rohs Compliant: Yes |Multicomp Pro MPKHS-D110-F24DC 0.35DEGC/W |
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MPKHS-D110-F24DC 0.35DEGC/W | Bulk | 1 |
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SPC Multicomp MPKHS-J93-B24DC-A 0.35DEGCWRelay Heat Sink, 55Mm X 59Mm X 92.4Mm Rohs Compliant: Yes |Multicomp Pro MPKHS-J93-B24DC-A 0.35DEGCW |
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MPKHS-J93-B24DC-A 0.35DEGCW | Bulk | 1 |
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35DEG. Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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LBWA1
Abstract: LBWA1ZZVK7-539 cc3000 WLAN ieee 802.11 murata
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11b/g LBWA1ZZVK7-539 LBWA1 LBWA1ZZVK7-539 cc3000 WLAN ieee 802.11 murata | |
Contextual Info: SiFLEX02-R2 TRANSCEIVER MODULE DATASHEET Integrated Transceiver Modules for ZigBee / 802.15.4 900 MHz Development Kit Available FEATURES DESCRIPTION • 250mW output power Long range: 2 miles Up to 1Mbps RF data rate Miniature footprint: 0.9” x 1.63” |
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SiFLEX02-R2 250mW ATXMEGA256A3U 330-0152-R1 | |
SC33
Abstract: sc-33 MARKING M marking 1796 SMD sSG
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898MHz 35deg 960MHz) 15max. SC33 sc-33 MARKING M marking 1796 SMD sSG | |
AW24TH-C
Abstract: AW24TH-U AW24TH-SR
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-138dB 24dBm CFR47 STD-T-66 256-KB DSAW24TH AW24TH-C AW24TH-U AW24TH-SR | |
Contextual Info: TiWi-SL MODULE DATASHEET Integrated 802.11 b/g WLAN Module FEATURES DESCRIPTION •IEEE 802.11 b/g compliant. Typical WLAN Transmit Power: o +18.0 dBm, 1 Mbps, CCK b o +13.9 dBm, 54 Mbps, OFDM (g) Typical WLAN Sensitivity: o - 88 dBm, 8% PER,11 Mbps |
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330-0085-R4 | |
TI WL1271L
Abstract: WL1271L WL1271BYFVR wl1271b WL1271 330-0087-R2 IPCA610D automotive 802.11n Ethertronics 802.11n transceiver
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-89dBm, -76dBm, -73dBm, 330-0087-R2 TI WL1271L WL1271L WL1271BYFVR wl1271b WL1271 IPCA610D automotive 802.11n Ethertronics 802.11n transceiver | |
c5201
Abstract: VOLTAGE DEPENDENT RESISTOR Resistor R002 R003
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151-RJM-E01MM c5201 VOLTAGE DEPENDENT RESISTOR Resistor R002 R003 | |
wl1271Contextual Info: Preliminary Specification Number: SP-ZSTN-C P. 1/34 W-LAN + Bluetooth Combo Module Data Sheet 802.11b/g/n and Bluetooth v4.0 module Product Part Number: LBEE5ZSTNC-523 Preliminary Specification Number: SP-ZSTN-C P. 2/34 Revision History Revision Code Date |
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11b/g/n LBEE5ZSTNC-523 21Aug wl1271 | |
Contextual Info: ProFLEX01-SOC TRANSCEIVER MODULE DATASHEET Integrated Transceiver Modules for ZigBee / 802.15.4 2.4 GHz ZigBee Light Link (ZLL) Module FEATURES • DESCRIPTION 100mW output power Long range: 4000 feet Miniature footprint: 0.9” x 1.63” Integrated PCB F antenna or U.FL |
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ProFLEX01-SOC 100mW 330-0049-R1 | |
wlan transmitter
Abstract: transmitter QAM schematic diagram TQM679002A 2450AT43B100 64 state ofdm receiver circuit diagram transmitter qpsk schematic diagram ofdm transceiver 928 TFB-TIWISL01 CC3000 circuit diagram 2.4ghz video transmitter and receiver
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CC3000 330-0085-R2 wlan transmitter transmitter QAM schematic diagram TQM679002A 2450AT43B100 64 state ofdm receiver circuit diagram transmitter qpsk schematic diagram ofdm transceiver 928 TFB-TIWISL01 circuit diagram 2.4ghz video transmitter and receiver | |
LBMA1BGUG2-TEMPContextual Info: Bluetooth TM HCI module Data Sheet Texas Instruments Chipset for Bluetooth 4.0 + FM Tx/Rx Tentative P/N : LBMA1BGUG2-TEMP Preliminary Specification Number: SP-BGUG P. 1 / 23 The revision history of the product specification Issued Date Revision Code 2012/Oct/16 |
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2012/Oct/16 LBMA1BGUG2-TEMP | |
450-0103-R1Contextual Info: TiWi-uB1 Module DATASHEET TiWi-uB1 Bluetooth Smart BLE Module FEATURES • DESCRIPTION Built in CC2541 single-chip Bluetooth Smart (BLE 4.0) System-On-Chip (SOC). RF Output Power: 0 dBm (Class 3) RF Receive Sensitivity: -94 dBm |
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CC2541 AES-128 330-0132-R1 450-0103-R1 | |
FPBS-82A
Abstract: A E 82A
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FPBS-04A FPBS-82A FPBS-82A to120sec. 10sec. 30sec. A E 82A | |
KBt kyocera
Abstract: EQM08 KBT-33SB-2T-2 sound level meter piezoelectric pressure measurement SPL EQM08-4KC-D3BX720E KYOCERA OSCILLATOR
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EQM08-4KC-D3BX720E KBT-33SB-2T-2 30deg 30minuts, 70deg 30minuts. 15minuts 12hours KBt kyocera EQM08 KBT-33SB-2T-2 sound level meter piezoelectric pressure measurement SPL EQM08-4KC-D3BX720E KYOCERA OSCILLATOR | |
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Contextual Info: TiWi-uB1 Module DATASHEET TiWi-uB1 Bluetooth Smart BLE Module FEATURES • DESCRIPTION Built in CC2541 single-chip Bluetooth Smart (BLE 4.0) System-On-Chip (SOC). RF Output Power: 0 dBm (Class 3) RF Receive Sensitivity: -94 dBm |
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CC2541 AES-128 330-0132-R1 | |
ofdm transceiverContextual Info: TiWi5 TRANSCEIVER MODULE DATASHEET Integrated Transceiver Modules for WLAN 802.11 a/b/g/n, Bluetooth, Bluetooth Low Energy BLE , and ANT FEATURES DESCRIPTION •IEEE 802.11 a,b,g,n,d,e,I compliant Typical WLAN Transmit Power: o 18.3 dBm, 11 Mbps, CCK (b) |
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330-0042-R2 ofdm transceiver | |
msp430 microcontroller based water level controller circuit
Abstract: PROFLEX01-R2 5969A-PROFLEX1 cc2520 zigbee transceiveR BLOCK DIAGRAM msp430f5437a spi
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ProFLEX01-R2 100mW MSP430 CC2520 CC2591) MSP430F5437A) 330-0098-R1 msp430 microcontroller based water level controller circuit 5969A-PROFLEX1 cc2520 zigbee transceiveR BLOCK DIAGRAM msp430f5437a spi | |
Contextual Info: NEW Thin Film High Value SMD Resistor Ceramic Package Features • Realized excellent stability and moisture-proof performance using hermetically sealed ceramic package with new developed thin film element. ■ High resistance value available (100kΩ to 10MΩ) with small package |
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25deg 125deg AC200V, 50ppm 200deg 1000hrs. DC100V, 100ppm 260deg | |
Contextual Info: TiWi-uB2 Module DATASHEET TiWi-uB2 Bluetooth Module FEATURES • DESCRIPTION Built in CC2564 single-chip Bluetooth fully supports BT 2.1 + EDR, BLE 4.0. RF Output Power: +10 dBm Class 1.5 RF Receive Sensitivity: -94 dBm |
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CC2564 330-0100-R1 | |
GSC-0129Contextual Info: Control No. : GSC-0129-B Established on Aug 25, 2011 Product Information 1.200MHz Band 90deg Chip Hybrid Coupler 1.1 TYPE No. : GSC129-HYB0200 RoHS correspondence article 2. Appearance and Construction 2.1 Dimension Unit: mm 12.0 3 G 4 1 2 1.0 10.0 GSC129 |
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GSC-0129-B 200MHz 90deg GSC129-HYB0200 GSC129 25degC) 35deg 125deg, GSC-0129 | |
atmel Reflow soldering
Abstract: AT86RF212 PCB xmega device board SiFLEX02HP J-STD-020 atmel 906 XMEGA Application Notes SiFLEX02-HP ATXMEGA256A3
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SiFLEX02-HP 750mW ATXMEGA256A3 900MHz AT86RF212 ATXMEGA256A3) 330-0047-R1 atmel Reflow soldering AT86RF212 PCB xmega device board SiFLEX02HP J-STD-020 atmel 906 XMEGA Application Notes | |
Contextual Info: Subject No. ESD Suppressor 151-ZA-EEG2-00B Part No. PAGE EZAEG2A 9-1 1. Dimension W a 1 (2) (3) (4) (5) (6) a L (2) (1) (3) (4) (5) Substrate : Alumina Protective Coating : Resin ESD Absorbent Material Gap Electrode Ni Termination(Plating) Sn Termination(Plating) |
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151-ZA-EEG2-00B 25degC -55deg 125deg | |
Contextual Info: SiFLEX02-HP TRANSCEIVER MODULE DATASHEET Integrated Transceiver Modules for ZigBee / 802.15.4 900 MHz Development Kit Available FEATURES DESCRIPTION • 750mW output power Long range Up to 1Mbps RF data rate Miniature footprint: 0.9” x 1.63” |
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SiFLEX02-HP 750mW ATXMEGA256A3 330-0047-R1 | |
WL1271
Abstract: WL1271L TI WL1271L wl1271 application note Wl1271 specification Wl1271 WLAN specification 772C-LBTN TI 1271 fm wlan wl1271 PCM LBEE5ZSTNC-523
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11b/g/n LBEE5ZSTNC-523 21Aug WL1271 WL1271L TI WL1271L wl1271 application note Wl1271 specification Wl1271 WLAN specification 772C-LBTN TI 1271 fm wlan wl1271 PCM LBEE5ZSTNC-523 |