3M PADDLE CARD Search Results

3m paddle card

Contextual Info: 8 7 6 5 4 3 2 1 3MTM CABLE ASSEMBLIES FOR QSFP+ APPLICATIONS VISIT http://www.3Mconnectors.com 1 50 D C 3 TOP SIDE POS 19 10 50 D 10 POS 38 POS 20 18.35 POS 1 POS 1 9QA0-112-XX-X.XX WWYY -SN:XXXXXXXX POS 20 POS 38 P1 5 108.5 7 18.75 POS 19 P2 BEZEL EDGE OF

789101

Abstract: AWM 21008 PS-0079
Contextual Info: 3M Twin Axial Cable SL8800 Series Your system should be built around performance, not around your cables. The 3M Internal Twin Axial Ribbon Cable SL8800 Series is a new ultra low-profile, high-speed, high signal density cable. The products in the SL8800 Series are only the

QSFP PCB design

Abstract: SFF-8436 QSFP FDR sldasm infiniband 40GBASE-CR
Contextual Info: 8 7 6 5 4 3 2 1 3MTM CABLE ASSEMBLIES FOR QSFP+ APPLICATIONS www.3Mtwinax.com 1 50 D C 3 TOP SIDE POS 19 10 50 D 10 POS 38 POS 20 18.35 POS 1 POS 1 9QA0-111-XX-X.XX WWYY -SN:XXXXXXXX POS 20 POS 38 P1 5 108.5 7 18.75 POS 19 P2 BEZEL EDGE OF BOARDMOUNT EMI CAGE.

Contextual Info: 8 7 6 5 4 3 2 1 3MTM CABLE ASSEMBLIES FOR QSFP+ APPLICATIONS www.3Mtwinax.com 1 50 D C 3 TOP SIDE POS 19 10 50 D 10 POS 38 POS 20 18.35 POS 1 POS 1 9QA0-111-XX-X.XX WWYY -SN:XXXXXXXX POS 20 POS 38 P1 5 108.5 7 18.75 POS 19 P2 BEZEL EDGE OF BOARDMOUNT EMI CAGE.

SFF-8643 pinout

Abstract: SAS SFF-8643 SAS SFF-8087 signal mini sas sff-8087 connector SFF-8643 78510 PCIe cable pinout MiniSAS SFF 8087 789101 AWM 21008
Contextual Info: 3M Twin Axial Cable SL8800 Series Your system should be built around performance, not around your cables. The 3M Internal Twin Axial Ribbon Cable SL8800 Series is a revolutionary ultra low-profile, high-speed, high signal density cable. 3M offers a broad line of available

DG1R025HS

Abstract: InfiniBand 4x smt 50198 DG1R073HS D28-3 D029-50197
Contextual Info: COMPONENTS PRODUCT INFORMATION NEW Interface connector conforming to InfiniBand Standard CONNECTOR DG1 Series MB-0097-2 July 2006 RoHS Compliant This product is a high-speed signal connector for balance transmission compliant to high-speed serial signal transmission of servers, routers, switches, external storage

SFF-8644

Abstract: SFF-8449 TurboTwin MINISAS Mini SAS HD Cage SFF 8449 8644
Contextual Info: Introducing Mini SAS HD Interconnect TE’s Mini SAS HD receptacle assembly is the next-generation SAS high-density high-speed IO interface. This interface was adopted for the SAS 2.1 standard and proposed for SAS 3.0 standard, and is designed to support 6G and future 12G SAS applications. The assembly is offered in 4x, 8x,

SFF-8470

Abstract: CX4 connector 10G CX4 CX4 connector mechanical drawing SFF-8470 optical SAS sata connector card fci ELXEYEMAX0608ELT 58369-112110LF CX4 RECEPTACLE
Contextual Info: INPUT/OUTPUT CONNECTORS / CABLE ASSEMBLIES EYEMAX 4X HIGH-SPEED SERIAL I/O LINKS for Infiniband®, 10G Fibre Channel, 10G Base-CX4 Ethernet IEEE 802.3ak , and SFF-8470 Multilane SATA/SAS DESCRIPTION The EyeMax® 4X cable assembly, right-angle PCB receptacle, and plug kit offering from FCI enables

SFf-8431

Abstract: TBD CABLE SFF-8083 EIA-364-65 SFF-8461 SFP/SFF-8432 SFF8431 SFF-8432 SFP Connectors and Cages SFP ACTIVE COPPER CABLE
Contextual Info: CABLE ASSEMBLIES SFP+ Connectors, Cages and Copper Cable Assemblies For 10Gigabit-Ethernet 10GbE , 8G Fibre Channel and 10G Fibre Channel over Ethernet applications DESCRIPTION FCI’s SFP+ connector, cage and cable assembly I/O system offerings are designed to meet data center,

SFF-8086

Abstract: SAS SFF-8086 SFF-8088 SFF 8088 SFF8088 FCI Mini SAS EIA-364-65 SAS Connector impedance 10098870 SAS SFF-8086 datasheet
Contextual Info: CABLE ASSEMBLIES MINI SAS / SATA Connectors, Cages & Cable Assemblies For High-Speed Serial Mini SAS or Mini SATA 4x Links DESCRIPTION FCI’s external mini-SAS / SATA connector, cage and cable assembly system solution addresses the storage industry’s demand for more compact, high-speed

TurboTwin

Abstract: madison cable 30AWG 10Gb Ethernet sfp copper cable 1-1773456-2 "network interface cards"
Contextual Info: Quick Reference Guide SFP+ High Speed Copper Cable Assemblies Tyco Electronics’ SFP+ direct attach copper cable assemblies are a high speed, cost effective alternative to fiber optics in 10Gb Ethernet, 8Gb Fibre Channel and InfiniBand applications. SFP+ copper cable assemblies enable hardware OEMs and data center operators to achieve high

Contextual Info: 1 2 Product number DESCRIPTION 10123443-XXXXHLF HALOGEN FREE HF SEE SHT. 3 3 4 NOTES A A LABEL 2 SEE NOTE 14 LABEL 2 SEE NOTE 14 LABEL B LABEL LABEL PULL TAB LABEL 2X 108 10 B (2X 60.50REF.) SR (2X), SEE NOTE 13 (2X 8.40) 45.00 0.15 0.60 0.08 "DIM L" (SEE P/N TABLE)

33830100

Abstract: cxp host connector m 7401 SFF-8642 Rx2N
Contextual Info: Methode Electronics DM-338-GG-XXXX Up to 120 Gbps CXP Passive Cable Assembly •      Compliant with Infiniband Architecture Specification Annex 6 Hot-pluggable footprint Supports Serial ID write protected Robust Die Cast Housing for EMI Shielding

FB1206

Abstract: DGS SMD TRANSISTOR how to reset 24lC04 mosfet pj1 smd FMMT2222ATR fb0805 radio panasonic r63 digikey CIRCUIT EQUALIZER BASS TREBLE MOSFET PS2 JACK
Contextual Info: DAREF105 TAS3002/TAS3004 Reference Design Board User’s Guide June 2001 Digital Audio Products SLEU004 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information

relais reed celduc

Contextual Info: Pro d i u e G t c u d www.celduc-relais.com celduc MADE IN FRANCE relais 1964-2014 YEARS REED RELAYS AND SWITCHES SOLID STATE RELAYS MAGNETIC SENSORS Dear customers, dear readers, At celduc® we are very proud to be celebrating our 50th anniversary in 2014!

FMCW

Contextual Info: m o c . o c l e v i n . w w 2012/2 w PRODUCT CATALOGUE PRODUCT CATALOGUE 2012/2 SUBSIDIARY AND DISTRIBUTION NETWORK To find a local NIVELCO representation, please check distribution page on NIVELCO website! CONTACT NIVELCO To contact NIVELCO, please use contact page on NIVELCO website!

LOCTITE 384

Abstract: ECCOBOND 281 melcor 705TC Emerson Cuming tellurex abletherm E629 E710 mastersil
Contextual Info: ATE-A2 Cooling High Density, High Power Pin Electronics TEST AND MEASUREMENT PRODUCTS Overview With IC’s ever-increasing speeds and pin counts, the power density inside Automated Test Equipment is also increasing. Keeping the high-speed pin drivers and other

Contextual Info: 12-Bit, 500MSPS A/D Converter ISLA112P50 Features The ISLA112P50 is a low-power, high-performance, 500MSPS analog-to-digital converter designed with Intersil’s proprietary FemtoCharge technology on a standard CMOS process. The ISLA112P50 is part of a pin-compatible portfolio of 8, 10 and

6601d

Abstract: 6601-D 6210D
Contextual Info: 12-Bit, 500MSPS A/D Converter ISLA112P50 Features The ISLA112P50 is a low-power, high-performance, 500MSPS analog-to-digital converter designed with Intersil’s proprietary FemtoCharge technology on a standard CMOS process. The ISLA112P50 is part of a pin-compatible portfolio of 8, 10 and

7007S

Abstract: BARb TRANSISTOR SMD Diode HER 507
Contextual Info: WOW! Catalogue World of Weller Inhalt 2 Page 06 – Seite 219 Soldering, Microtools, Desoldering, Hot Air, Rework, Fume Extraction, Electronic Screwdrivers, Dispensing Systems, Accessories, etc. Page 220 – Seite 323 Tweezers, Cutters, Pliers, EROP, Stripping Tools, Kits, etc.

xilinx topside marking

Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

xilinx part marking

Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

qfn 3x3 tray dimension

Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

BFG95

Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL