40 LEAD CERAMIC FLATPACK Search Results

68-PIN

Contextual Info: 4.10 Package Diagrams 64-Pin Thin Quad Flat Pack A64 4-40 Package Diagrams 68-Pin Grid Array Cavity Up G68 4-41 Package Diagrams 64-Lead Plastic Thin Quad Flatpack N65 4-42 Package Diagrams 64-Lead Ceramic Quad Flatpack (Cavity Up) U65 4-43

Contextual Info: HS-80C85RH HARRIS S E M I C O N D U C T O R Radiation Hardened 8-Bit CMOS Microprocessor September 1995 Features Pinouts 40 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T40 TOP VIEW U xi [T m VD D • Radiation Hardened EPI-CMOS

5962-96902

Contextual Info: WMS256K16-XXX HI-RELIABILITY PRODUCT 256Kx16 MONOLITHIC SRAM, SMD 5962-96902 FEATURES • Access Times 17, 20, 25, 35ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging •44 pin Ceramic SOJ Package 102 • 44 lead Ceramic Flatpack (Package 225)

TBA 129-5

Abstract: WMS256K16L-XXX WMS256K16-XXX
Contextual Info: WMS256K16-XXX White Electronic Designs 256Kx16 MONOLITHIC SRAM, SMD 5962-96902 FEATURES PIN CONFIGURATION FOR WMS256K16-XXX • Access Times 17, 20, 25, 35ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging 44 FlatpacK • 44 pin Ceramic SOJ Package 102

WMS256K16L-XXX

Abstract: WMS256K16-XXX
Contextual Info: WMS256K16-XXX HI-RELIABILITY PRODUCT 256Kx16 MONOLITHIC SRAM, SMD 5962-96902 FEATURES • Access Times 17, 20, 25, 35ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging •44 pin Ceramic SOJ Package 102 • 44 lead Ceramic Flatpack (Package 225)

TBA 129-5

Abstract: WMS256K16L-XXX WMS256K16-XXX
Contextual Info: White Electronic Designs WMS256K16-XXX 256Kx16 MONOLITHIC SRAM, SMD 5962-96902 FEATURES • Access Times 17, 20, 25, 35ns ■ MIL-STD-883 Compliant Devices Available ■ PIN CONFIGURATION FOR WMS256K16-XXX 44 CSOJ Packaging 44 FlatpacK • 44 pin Ceramic SOJ Package 102

Contextual Info: WMS256K16-XXX 256Kx16 MONOLITHIC SRAM, SMD 5962-96902 PIN CONFIGURATION FOR WMS256K16-XXX FEATURES  Access Times 17, 20, 25, 35ns  MIL-STD-883 Compliant Devices Available 44 CSOJ  Packaging • 44 pin Ceramic SOJ Package 102 44 FlatpacK

5962-89598

Abstract: EDI88128CS
Contextual Info: White Electronic Designs EDI88128CS 128Kx8 Monolithic SRAM, SMD 5962-89598 FEATURES Access Times of 15*, 17, 20, 25, 35, 45, 55ns • 32 pad Ceramic LCC Package 141 CS# and OE# Functions for Bus Control • 32 lead Ceramic Flatpack (Package 142) 2V Data Retention (EDI88128LPS)

5962-89598

Abstract: EDI88128CS
Contextual Info: White Electronic Designs EDI88128CS 128Kx8 Monolithic SRAM, SMD 5962-89598 FEATURES „ Access Times of 15*, 17, 20, 25, 35, 45, 55ns • 32 pad Ceramic LCC Package 141 „ CS# and OE# Functions for Bus Control • 32 lead Ceramic Flatpack (Package 142) „

Z84C0010PEC

Abstract: MIL-STD-883C CPS95CO0125 84C00 10X10 Z84C90 64 CERAMIC LEADLESS CHIP CARRIER LCC ceramic QFP Package 100 lead
Contextual Info: PACKAGE INFORMATION CPS95CO0125 CUSTOMER P ROCUREMENT S PECIFICA TION PACKAGE INFORMATION ORDERING CODES IC PACKAGE CODES TEMPERATURE A = VQFP Very Small QFP C = Ceramic Sidebrazed D = Cerdip E = Ceramic Window F = Plastic Quad Flatpack G = Ceramic PGA (Pin Grid Array)

Contextual Info: WMS256K16-XXX 256Kx16 MONOLITHIC SRAM, SMD 5962-96902 PIN CONFIGURATION FOR WMS256K16-XXX FEATURES  Access Times 17, 20, 25, 35ns  MIL-STD-883 Compliant Devices Available 44 CSOJ  Packaging • 44 pin Ceramic SOJ Package 102 44 FlatpacK

Contextual Info: yjj S u p er t e x inc. Preliminary 32 + 22 Channel Matrix Printhead Driver Ordering Information Package Options Device 68 J - Lead Ceramic Quad Flatpack 68 J - Lead Plastic Quad Flatpack Die 68 J - Lead Ceramic Quad Flatpack MIL-STD-883 Processed* HV33

Contextual Info: b lE SUPERTEX INC T> m 07732*15 0 0 0 3 3 4 7 Û13 * S T X HV33 Preliminary 32 + 22 Channel Matrix Printhead Driver Ordering Information_ _ Package Options Device 66 J - Lead Ceramic Quad Flatpack 68 J - Lead Plastic Quad Flatpack

Contextual Info: SUPERTEX 3SE D INC • 07732=15 Q D G 2 5 G 0 1 B I S T X Preliminary ~T-5f~/5 32 + 22 Channel Matrix Printhead Driver Ordering Information Package Options * Device 68 J - Lead Ceramic Quad Flatpack 68 J - Lead Plastic Quad Flatpack Die 68 J - Lead Ceramic Quad Flatpack

CERAMIC QUAD FLATPACK CQFP

Abstract: CQFP 240
Contextual Info: CQFP.FRM Page 1 Tuesday, February 9, 1999 4:20 PM CQFP Packaging Capabilities Surface Mount Description The Ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher lead count and smaller lead pitch than most

xc68360

Contextual Info: Pomona Model 5998AL, 5998AL-1 & 5998AL-2 240 Lead QFP Locking Test Clip 0.50 mm Lead Pitch These new locking test clips provide the user with an easy and reliable means to connect instrumentation to the SMT leads of 240 pin plastic, metal and ceramic quad flatpack QFP chips.

L1A4474

Abstract: L1A4 k1698
Contextual Info: Pomona Model 5998AL, 5998AL-1 & 5998AL-2 240 Lead QFP Locking Test Clip 0.50 mm Lead Pitch These new locking test clips provide the user with an easy and reliable means to connect instrumentation to the SMT leads of 240 pin plastic, metal and ceramic quad flatpack QFP chips.

MO-143

Abstract: 172-CQFP 256-CQFP DIMENSIONS PQFP 132 CPGA132 CERAMIC QUAD FLATPACK CQFP
Contextual Info: Package Characteristics and Mechanical Drawings Package Thermal Characteristics Package Type Plastic Leaded Chip Carrier PLCC Plastic Quad Flatpack (PQFP) Pin Count θjc θja θja Still Air 300 ft/min Unit 44 16 43 31 °C/W 68 13 36 25 °C/W 84 12 32 22

2 010 073 007

Abstract: cqfp package outline CERAMIC QUAD FLATPACK CQFP CQFP 172 PIN
Contextual Info: AMI A M I S E M IC O N D U C T O R %s CQFP Packaging Capabilities Description Surface Mount The ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher leaad count and smaller lead pitch than most other ceramic packages. It has been provided in a

1010-1018

Abstract: MO-078AA OM8500SC OM8500SCH OM8500SCP OM8500SF OM8500SFH OM8500SFP
Contextual Info: PD-94465A Low Dropout Linear Regulator Hermetic Package OM8500SC OM8500SF +3.3Vin to +1.8Vout at 3.0A Product Summary Part Number OM8500SC OM8500SF IO 3.0A 3.0A Vin 3.3V 3.3V Vout 1.8V 1.8V Package MO-078AA 8-lead Flatpack MO-078AA Features: The OM8500 is a low dropout linear regulator designed

1010-1018

Abstract: MO-078AA OM8503SC OM8503SCH OM8503SCP OM8503SF OM8503SFH OM8503SFP
Contextual Info: PD-94468A Ultra Low Dropout Linear Regulator Hermetic Package OM8503SC OM8503SF +7.4Vin to +6.8Vout at 3.0A Product Summary Part Number OM8503SC OM8503SF Dropout 0.4 V 0.4 V IO 3.0A 3.0A Vin 7.4V 7.4V Vout 6.8V 6.8V Package MO-078AA 8-lead Flatpack MO-078AA

MO-078AA

Abstract: OM8501SC OM8501SCH OM8501SCP OM8501SF OM8501SFH OM8501SFP
Contextual Info: PD-94466A Ultra Low Dropout Linear Regulator Hermetic Package OM8501SC OM8501SF +3.3Vin to +2.5Vout at 3.0A Product Summary Part Number OM8501SC OM8501SF Dropout 0.4 V 0.4 V IO 3.0A 3.0A Vin 3.3V 3.3V Vout 2.5V 2.5V Package MO-078AA 8-lead Flatpack MO-078AA

MO-078AA

Abstract: OM8504SFP 1010-1018 OM8504SC OM8504SCH OM8504SCP OM8504SF OM8504SFH
Contextual Info: PD-94469A Ultra Low Dropout Positive Adjustable Linear Regulator Hermetic Package OM8504SC OM8504SF + 3.3Vin at 3.0A Product Summary Part Number OM8504SC OM8504SF Dropout 0.4 V 0.4 V IO 3.0A 3.0A Vin Package 3.3V MO-078AA 3.3V 8-lead Flatpack MO-078AA Features:

MO-078AA

Abstract: OM8506SC OM8506SCH OM8506SCP OM8506SF OM8506SFH
Contextual Info: PD-94471A Ultra Low Dropout Adjustable Linear Regulator Hermetic Package OM8506SC OM8506SF +7.5Vin / +6.1 to +7.0Vout at 3.0A Product Summary Part Number OM8506SC OM8506SF Dropout 0.4 V 0.4 V IO 3.0A 3.0A Vin Package 7.5V MO-078AA 7.5V 8-lead Flatpack MO-078AA