400MIL18 Search Results

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 1 P E F detail of lead end 14 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

TRAY TSOP

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 15 28 F P E detail of lead end 14 1 A D M M C L B G K N I J H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 1 P E F detail of lead end 14 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 E 3°±3° F detail of lead end 1 22 A H I K G J N C D B L M M S44G5-80-7JF-1 NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at

S28G5-50-7JD2-1

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 E 5°±5° F detail of lead end 1 14 A H I K G J N B C D M L M S28G5-50-7JD2-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

tsop 0038

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 44 pin TSOP (II) (400 mil) 44 23 F E 3°±3° detail of lead end 1 22 A D M M C N L G K B I J H S44G5-80-7KF-1 NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at

TSOP TRAY

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 +4° F E 2° –2° detail of lead end 1 22 A D M M C L B G K N I J H S44G5-80-7KF1-1 NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 F E 5°±5° detail of lead end 1 14 A D M M C B L G K N I H J S28G5-50-7KD2-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

TRAY TSOP

Contextual Info: Packing NEC Tray JEDEC Tray Name LA-1006B-1 TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 E 3°±3° F detail of lead end 1 14 A H I K G J N C D B L M M S28G5-50-7JD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 F E P detail of lead end 1 22 A D M M C L B G K N I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

TSOP package tray

Abstract: TRAY DIMENSIONS TSOP 62 Package TSOP TRAY tray tsop 1220 JEDEC tray standard tsop
Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF 7 12.20 18.80 A' 20.42 14.56 285.88 315.0 322.6 SECTION A-A' 18.80 5.62 (6.35) 15.00 7.62 135.9 PPE NEC 135°C MAX 13.67 13.27 TSOP(2)400MIL18 109.36 9x15=135 A Applied Package Quantity (pcs) 28-pin Plastic TSOP (II)

44PINTSOP

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 44 pin TSOP (II) (400 mil) 44 23 E P F detail of lead end 1 22 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 P F E detail of lead end 1 22 A D M M N L B G K C I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 28 pin TSOP (II) (400 mil) 28 15 detail of lead end F P E 1 14 A H I G B C N D M S S J L K M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 E P F detail of lead end 1 22 A H I K G J C D N M B L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 28 pin TSOP (II) (400 mil) 28 15 detail of lead end F E 1 14 A D M P M S N C S B K L G I J H NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 44 pin TSOP (II) (400 mil) 44 23 detail of lead end F P E 1 22 A H G I S N C D M L S B M K NOTE 1. Controlling dimension J millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 F E 3°±3° detail of lead end 1 14 A D M M C B L G K N I J H S28G5-50-7KD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 28 pin TSOP (II) (400 mil) 28 15 E 3°±3° F detail of lead end 1 14 A H I K G J N C D B L M M S28G5-50-7JD-2 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

TRAY TSOP

Abstract: S44G5-80-7JF1-1
Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 1 +4° 2° –2° E F detail of lead end 22 A H I K G J N C D B L M M S44G5-80-7JF1-1 NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at

A 1837

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 44 pin TSOP (II) (400 mil) 44 23 detail of lead end F E 1 P 22 A D M B M N C K S L S I G J H NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 1 P E F detail of lead end 22 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

JEDEC tray standard tsop

Abstract: TSOP 28 Package TSOP package tray JEDEC TRAY DIMENSIONS
Contextual Info: UNIT : mm HEAT PROOF 7 109.36 PPE NEC 135°C MAX 13.67 13.27 TSOP 2 400MIL18 18.8 A' 20.42 14.56 285.88 315.0 (322.6) SECTION A-A' 18.8 5.62 (6.35) 15.0 7.62 135.9 9x15=135 12.2 A Applied Package Quantity (pcs) 28-pin Plastic TSOP(II)(400mil) MAX. 135 Material

S44G5-80-7KF2

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 44 pin TSOP (II) (400 mil) 44 23 P F E detail of lead end 1 22 A D M M N L B G K C I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.