42PIN Search Results

DIP42 package

Abstract: 600-MIL
Contextual Info: SANYO Semiconductor Dual In-line Package 42Pin Plastic DIP42 600mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

566 pin diagram

Abstract: bq 735 565 pin diagram micro controller bm p71 BM P60
Contextual Info: EM78567/566/565 8-BIT MICRO CONTROLLER IV.Pin Configuration P75/INT5 P76/INT6 P77/INT7 XIN XOUT PLLC GND TONE P80 P81 P82 42pin SDIP EM78567AR EM78567BR EM78566AR EM78566BR P70/INT0 P71/INT1 P72/INT2 P73/INT3 P74/INT4 P75/INT5 P76/INT6 P77/INT7 XIN XOUT PLLC

HYM564124

Abstract: HY5118164 c044 HYM5641
Contextual Info: H • { H Y U N D A I Y M 5 6 4 1 2 X 4 - S e r i e s 1M x 64-bit CMOS DRAM MODULE with EXTENDED DATA OUT DESCRIPTION TTie HYM564124 is a 1M x 64-blt EDO mode CMOS DRAM module consisting of four HY5118164B in 42/42pin SOJ, two 16-bit BiCMOS line driver in TSSOP on a 168 pin glass-epoxy printed circuit board. 0.22|iF decoupling

SSOP42-P-450-0

Contextual Info: APPENDIX 3.9 Package outline 3.9 Package outline 42P2R-A Plastic 42pin 450mil SSOP EIAJ Package Code SSOP42-P-450-0.80 Weight g 0.63 JEDEC Code – Lead Material Alloy 42/Cu Alloy e b2 22 Caution ! E HE e1 I2 42 F Symbol TBD 21 1 A D Recommended Mount Pad

42-PIN

Contextual Info: 42S1B-A Metal seal 42pin 600mil DIP EIAJ Package Code WDIP42-C-600-1.78 JEDEC Code – Weight g 1 21 e1 22 E 42 c D A1 L A A2 Symbol Z e b b1 SEATING PLANE A A1 A2 b b1 c D E e e1 L Z Dimension in Millimeters Min Nom Max – – 5.0 – – 1.0 3.44 – –

SOJ42-P-400-1

Abstract: SOJ42-P-400 SOJ42
Contextual Info: 42P0K Plastic 42pin 400mil SOJ Weight g Lead Material Alloy 42 e b2 D 42 e1 c I2 JEDEC Code – I1 EIAJ Package Code SOJ42-P-400-1.27 22 e1 HE E Recommended Mount Pad Symbol 1 21 L A A1 b1 e y b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2 I1 I2 Dimension in Millimeters

P42C

Contextual Info: 42PIN PLASTIC SHRINK DIP 600 mil 42 22 1 21 A K H G J I L F B D N R M C M NOTES 1) Each lead centerline is located within 0.17 mm (0.007 inch) of its true position (T.P.) at maximum material condition. 2) Item "K" to center of leads when formed parallel.

D01400

Abstract: 281 C 38 100 D
Contextual Info: •HYUNDAI HYM564224 X-Series 2M X 64-bit CMOS DRAM MODULE with EXTENDED DATA OUT DESCRIPTION The HYM564224 is a 2M x 64-bit EDO mode CMOS DRAM module consisting of eight HY5118164B in 42/42pin SOJ, two 16-bit BiCMOS line driver in TSSOP on a 168 pin glass-epoxy printed circuit board. 0.22nF decoupling

H 9311

Abstract: SSOP42-P-450-0
Contextual Info: Recommended 42P2R-A EIAJ Package Code SSOP42-P-450-0.80 JEDEC Code – Plastic 42pin 450mil SSOP Weight g 0.63 e b2 22 E Recommended Mount Pad F Symbol 1 21 A D G A2 e y A1 b L L1 HE e1 I2 42 Lead Material Alloy 42/Cu Alloy A A1 A2 b c D E e HE L L1 z Z1

Contextual Info: April 2007 TLCS-870 Family TLCS-870/C1 Series TMP89FH40NG 42pin TMP89FM40NG 8-bit microcontrollers delivering high functionality and performance in low-pin-count packages TLCS-870/C1 CPU Core •Operating voltage 4.5 to 5.5 V@8 MHz 2.7 to 5.5 V@4.2 MHz ·Clock gear

M37540RSS

Contextual Info: 7540 42pin pin configuration 1999/4/22 Revised by Kubo M37540RSS pin configuration P14/CNTR0 <•— k j NC NC P20/AN0 P21/AN1 * — -► 3 - I4 *— -* d NC F P23/AN3 «— * — - P24/AN4 — P25/AN5 <— -► [jm * — - P" 12 *— P22/AN2 P26/AN6 P27/AN7

Contextual Info: 42P3U-E Plastic 42pin 300mil TSOP EIAJ Package Code TSOPII 42-P-300-0.65 Weight(g) 0.29 JEDEC Code – Lead Material Alloy 42 e b2 I2 F ME 22 E Recommended Mount Pad Symbol 21 1 A D L c L1 HE 42 e b y A2 Detail F A1 A A1 A2 b c D E e HE L L1 y ME I2 b2

DIP42-P-600-2

Contextual Info: 42P4Z Plastic 42pin 600mil DIP JEDEC Code – Lead Material Alloy 42 22 1 21 E 42 e1 c EIAJ Package Code DIP42-P-600-2.54 Weight g 6.06 D L A1 A A2 Symbol SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5 0.51

Contextual Info: HYUNDAI HYM564100 X-Series IM X 64-bit CMOS DRAM MODULE DESCRIPTION The HYM564100 is a 1M x 64-bit Fast page mode CMOS DRAM module consisting of four HY5116160 in 42/42pin SOJ, two 16-bit and one 4-bit BiCMOS line driver in TSSOP on a 168 pin glass-epoxy printed circuit board. 0.22p.F

DIP42S

Abstract: DIP-42S
Contextual Info: SANYO Semiconductor Shrink Dual In-line Package 42Pin Plastic DIP42S 600mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

SSOP42-P-450-0

Abstract: 42p2r-a
Contextual Info: 42P2R-A Plastic 42pin 450mil SSOP EIAJ Package Code SSOP42-P-450-0.80 JEDEC Code – Weight g 0.63 Lead Material Alloy 42/Cu Alloy e 22 E F Recommended Mount Pad Symbol 1 21 A D y b A1 L e A2 L1 HE e1 I2 42 b2 c Detail F A A1 A2 b c D E e HE L L1 y b2 e1

42P4B

Abstract: 42-PIN
Contextual Info: 42P4B Plastic 42pin 600mil SDIP Weight g 4.1 JEDEC Code – Lead Material Alloy 42/Cu Alloy 22 1 21 E 42 e1 c EIAJ Package Code SDIP42-P-600-1.78 Symbol L A1 A A2 D e SEATING PLANE b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max

TLCS-870

Abstract: TMP86C846NG TMP86CH46ANG TMP86CM46ANG TMP86FH46ANG TMP86PH46NG TMP86PM46NG
Contextual Info: May 2008 TLCS-870 Family TLCS-870/C Series 42pin TMP86FH46ANG 8-bit microcontroller with flash memory, 10-bit AD converter and two serial interfaces TLCS-870/C CPU Core •Operating voltage: 2.7 to 5.5 V ·Minimum instruction execution time: 250 ns at 16 MHz/ 4.5 to 5.5 V

DIP42

Contextual Info: SANYO Semiconductor Dual In-line Package 42Pin Plastic DIP42 600mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

SSOP42-P-450-0

Contextual Info: APPENDIX 3.6 Package outline 3.6 Package outline MMP 42P4B EIAJ Package Code SDIP42-P-600-1.78 Plastic 42pin 600mil SDIP Weight g 4.1 Lead Material Alloy 42/Cu Alloy 22 1 21 E 42 e1 c JEDEC Code – Symbol L A1 A A2 D e b1 b2 b SEATING PLANE A A1 A2 b b1

ffc cable

Contextual Info: A B C D E G F H 60 47 . 220 20 20 20 1 3 7 6 2 90 25.5 40 2 40 1 8 3 4 1 9 8 7 6 4 3 2 4 5 4 3 2 1 5 9 5 01 RELEASED Rev.No. DESCRIPTION A B C D E 1 117-93-642-41-005 42Pin S-DIP Socket PRECI-DIP 1 1 1 1 4 1 1 1 NAC-S-FPC-294 Sheild FPC TET I-51500 FFC Cable

1903260-1

Contextual Info: 107-68323 Packaging Specification Nov.13,06 Rev H 0.635mm PITCH BAY CONN. 42PIN 1. PURPOSE 目的 Define the packaging specifiction and packaging method of 0.635mm PITCH BAY CONN. 42PIN. 订定 0.635mm PITCH BAY CONN. 42PIN 产品之包装规格及包装方式。

Contextual Info: 42P3U-F Plastic 42pin 300mil TSOP II EIAJ Package Code TSOPII 42-P-300-0.65 JEDEC Code – Weight(g) 0.29 Lead Material Alloy 42 e b2 E ME 21 1 Recommended Mount Pad Symbol 22 42 A D L c L1 HE I2 F e b y A2 A1 Detail F A A1 A2 b c D E e HE L L1 y ME I2 b2

P42C-70-600B

Contextual Info: 42PIN PLASTIC SHRINK DIP 600 mil 42 22 1 21 A K I L J F D C N R M M H B G NOTES 1) Each lead centerline is located within 0.17 mm (0.007 inch) of its true position (T.P.) at maximum material condition. 2) Item "K" to center of leads when formed parallel.