441 BALL BGA Search Results

HXC125

Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296
Contextual Info: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The

Contextual Info: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and

construction of photo diode

Abstract: BGA 441 EH11 au 81 441 ball bga flip chip bga 0,8 mm
Contextual Info: Multi Chip Module MCMC SP Chip size package Advanced semiconductor mounting CSP is realized by Hybrid IC technology Realize high accumulation and a low price by fine printed substrate. CSP Features Single / Multi layer printed substates with minimum line width

E700G

Contextual Info: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

441 ball bga

Abstract: eh11 BGA 441 bga 0,8 mm
Contextual Info: マルチチップモジュール MCM・CSP（チップサイズパッケージ） 究極の半導体実装CSPと, MCMをハイブリッドIC 技術で実現し 高集積化と低コスト化をファイン印刷基板で実現しました。 ▲ 特 長

BGA-56 DATASHEET

Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
Contextual Info: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3

Contextual Info: CS2111 MADRID – Dual-Ring RPR MAC IC OVERVIEW MADRID is an integrated dual-ring RPR MAC. It provides an efficient solution for high-density line cards in ADMs, MSPPs, Switches and Routers. FEATURES Functionality ƒ ƒ ƒ ƒ ƒ ƒ ƒ ƒ Compliant with 802.17 standard

Contextual Info: CS2111 MADRID – Dual-Ring RPR MAC IC OVERVIEW MADRID is an integrated dual-ring RPR MAC. It provides an efficient solution for high-density line cards in ADMs, MSPPs, Switches and Routers. FEATURES Functionality ƒ ƒ ƒ ƒ ƒ ƒ ƒ ƒ Compliant with 802.17 standard

Contextual Info: 3M Textool Test and Burn-In Sockets ™ 1 3Innovation 3M Textool Test and Burn-In Sockets ™ ™ Table of Contents BGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 PGA/IPGA/SPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

footprint 8M1-A

Abstract: 196-pin bga footprint
Contextual Info: BGA Footprints Arranged by Pitch and Ball Count See www.bgasockets.com for updates or call for latest Footprints supplement. 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com

cu pillar

Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

HL832N

Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

uaa 3100

Abstract: uaa 4003 s0315 v 3700 bga
Contextual Info: ADVANCED BGA Footprints A rranged by Pitch and Ball Count . INTERCONNECTIONS. See www.bgasockets.com for updates or call for latest Footprints supplement. 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com

BGA reflow guide

Abstract: "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile
Contextual Info: Note Number AN-RC1-RW-A Development Tools And Methods RC BGA REWORK PROCEDURE APPLICATION NOTE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using

SG-BGA-6046

Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
Contextual Info: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.

electrolytic capacitor, 1000 microfarad

Abstract: JTAG series termination resistors stackup 0.1 microfarad electrolytic capacitor 1500 microfarad capacitor datasheet FG676 UG002 hyperlynx
Contextual Info: R Chapter 4: PCB Design Considerations Printed Circuit Board Considerations Layout Considerations The PC board is no longer just a means to hold ICs in place. At today’s high clock rates and fast signal transitions, the PC board performs a vital function in feeding stable supply

"sd1v4

Abstract: Fusion-MPT Message Passing Interface Specification LSI53C1020A LSI53C1000
Contextual Info: TECHNICAL MANUAL LSI53C1020/1020A PCI-X to Ultra320 SCSI Controller February 2004 Version 2.3 DB14-000176-05 This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties

LSI53C1020A

Abstract: LSI53C1020 DB14-000176-06 Fusion-MPT Message Passing Interface Specification LSI53C1000
Contextual Info: TECHNICAL MANUAL LSI53C1020/1020A PCI-X to Ultra320 SCSI Controller February 2004 Version 2.4 DB14-000176-06 This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties

XC95216-20PQG160I

Abstract: XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500
Contextual Info: XC95216 In-System Programmable CPLD R 5 Note: The 352-pin BGA packages are being discontinued for XC95216 devices. You cannot order these packages after May 14, 2008. Xilinx recommends replacing XC95216 in 352-pin BGA packages with XC95288 devices in 352-pin BGA packages in all designs as soon as possible. Recommended replacements are pin compatible, but

atmel 946

Abstract: atmel 946 8 pin MH1RT QML military mcm 1553 0.6 um cmos process atmel 27 Series
Contextual Info: 200 ASICs for Aerospace i n t e g r a t i o n s o l u t i o n s System Level Integration for the space market R aerospace S y s t e m Meeting communication satellite challenges tmel Wireless & Microcontollers A the way for System Level Integration. hardened VLSI products for space

LSI53C1020A

Abstract: ARM966E-S CRC-32 LSI53C1000R LSI53C1020 PAR64 KY 719 "sd1v4 SD1V Fusion-MPT Message Passing Interface Specification
Contextual Info: TECHNICAL MANUAL LSI53C1020 PCI-X to Ultra320 SCSI Controller June 2002 Version 2.0 DB14-000176-02 This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties

of 1000 microfarad electrolytic capacitor

Abstract: JTAG series termination resistors
Contextual Info: R Printed Circuit Board Considerations Layout Considerations The PC board is no longer just a means to hold ICs in place. At today’s high clock rates and fast signal transitions, the PC board performs a vital function in feeding stable supply voltages to the IC and in maintaining signal integrity between devices.

diagrams hitachi ecu

Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
Contextual Info: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble

35 x 35 PBGA, 580 100 balls

Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Contextual Info: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8