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L17HTNES4R4C
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Right Angle PCB Thru Hole, High Temp Std Density, FP=8.08mm (0.318in), 09 Socket, Bright Tin Shell, 0.76m (30 in) Gold, 4-40 Rear Insert, Ground Tab& Boardlock, Plastic Tray, Closed Back |
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L17HTHBS4R4C
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Right Angle PCB Thru Hole, High Temp High Density, FP=8.89mm (0.350in), 44 Socket, Bright Tin Shell, 0.76m (30 in) Gold, 4-40 Rear Insert, Ground Tab& Boardlock, Plastic Tray, Closed Back |
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L17HTNBS4R4C
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Right Angle PCB Thru Hole, High Temp Std Density, FP=8.08mm (0.318in), 25 Socket, Bright Tin Shell, 0.76m (30 in) Gold, 4-40 Rear Insert, Ground Tab& Boardlock, Plastic Tray, Closed Back |
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L17HTHES4R4C
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Right Angle PCB Thru Hole, High Temp High Density, FP=8.89mm (0.350in), 15 Socket, Bright Tin Shell, 0.76m (30 in) Gold, 4-40 Rear Insert, Ground Tab& Boardlock, Plastic Tray, Closed Back |
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L17HTNCS4R4C
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Right Angle PCB Thru Hole, High Temp Std Density, FP=8.08mm (0.318in), 37 Socket, Bright Tin Shell, 0.76m (30 in) Gold, 4-40 Rear Insert, Ground Tab& Boardlock, Plastic Tray, Closed Back |
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