471-1 METAL Search Results

Contextual Info: PART NUMBER UNCONTROLLED DOCUMENT SSI —LXR481 5YD1 471 3 REV, A B - 10.00 E0.394H , S I 1 REV. 1 1 B E.C.N. NUMBER AND REVISION COMMENTS CORRECTED WIRE STRIP LENGTH. E.C.N. # 1 0 6 7 4 . #10BRDR. DATE 11.1 7.94 10.3 0.00 5,00 [0 ,1 9 7 ] ELECTRO-OPTICAL CHARACTERISTICS Ta = 25'C

Silicon Diode DT-470

Abstract: LR 207 DT-470-SD-13 DT-470-CU-13 DT-470-SD-12A transistor BR 471 A dt 420 DT-470 DT-470-CY-13 DT-471-SD
Contextual Info: 1-6 Silicon Diodes 1987 COMPE R DT-470 and DT-471 Features and Description Silicon Diodes DT-470 Features • Advanced, hermetic ceramic and sapphire packaging with the lowest self-heating errors • Monotonic temperature response over its useful range from 1.4 K to 475 K

Contextual Info: PART NUMBER REV. SSI — LXR481 5GD1 471 3 B U N C O N T R O LLED D O C U M EN T REV, - 10.00 , S I 5 ,0 0 1 E 0 .3 9 4 H 1 1 E.C.N. NUMBER AND REVISION COMMENTS DATE A CORRECTED WIRE STRIP LENGTH. 1 1 .1 7 .9 4 B E.C.N. # 1 0 6 7 4 . #10BRDR. 1 0 .3 0 .0 0

224 K capacitor

Abstract: kemet capacitor C0603 EIA481-1 j 182 capacitor 334 ceramic U 821 B C0402 C0805 561 6.3v C1206
Contextual Info: KEMET CERAMIC CHIP/STANDARD FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and

475 10v

Abstract: 684 k 100 224 K capacitor Mj333 473 capacitor J273K MJ-82-2
Contextual Info: 3181 text layout 4/21/01 10:41 AM Page 46 KEMET CERAMIC CHIP/STANDARD FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25

Contextual Info: KEMET CERAMIC CHIP/STANDARD FEATURES • C0G NP0 , X7R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and

D 822 M

Contextual Info: KEMET CERAMIC CHIP/STANDARD FEATURES • C0G NP0 , X7R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and

capacitor C0402 50V X7R

Contextual Info: KEMET CERAMIC CHIP/STANDARD FEATURES • C0G NP0 , X7R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and

C1005 kemet

Contextual Info: CERAMIC CHIP/STANDARD KEMET FEATURES • • • • • Twelve chip sizes COG NPO , X7R, Z5U and Y5V Dielectrics 10, 16, 25,50, 100 and 200 Volts Standard End Metalization-tin-plated nickel barrier Available Capacitance Tolerance: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±3%; ±5%; ±10%;

j 182

Abstract: K 511 K and M Electronics C0402 C0805 C0805C103K5RAC C1206 C1210 C1812 C2220
Contextual Info: KEMET CERAMIC CHIP/STANDARD FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and

cbc 547

Abstract: TRANSISTOR D 471 BF469 BF471 Q62702-F497 Q62702-F507 Q62902-B62 Q62902-B63 Transistor A 471 K3030
Contextual Info: 2SC D • ÖSBSbOS 0QQ4Men 7 ■ SIEG_,'. IMPN Silicon Planar Transistors BF 469 BF 471 SIEMENS AKTIENGESELLSCHAF BF 4 6 9 and BF 471 are epitaxial NPN silicon Planartransistors in TO 126 plastic package 12 A 3 DIN 41869, sheet 4 . The collector is conductively connected to the metallic

Contextual Info: 3181 text layout 4/21/01 10:41 AM Page 46 KEMET CERAMIC CHIP/STANDARD FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25

C0805C103K5RAC

Abstract: C1206 C1210 C1812 C1825 C2220 EIA481-1 IEC60286-6 C0402 C0805
Contextual Info: KEMET CERAMIC CHIP/STANDARD FEATURES • C0G NP0 , X7R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and

capacitor 681

Contextual Info: KEMET CERAMIC CHIP/STANDARD FEATURES • C0G NP0 , X7R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and

IC1232

Abstract: c4742 c1813 C4722 MC2212 C1B25 C2792 C-829 capacitor c829 capacitor 1C9
Contextual Info: KEMET CERAMIC CHIP/STANDARD FEATURES • • • • • Twelve chip sizes COG NPO , X7R, Z5U and Y5V Dielectrics 10, 16, 25, 50, 100 and 200 Volts Standard End Metalization-tin-plated nickel barrier Available Capacitance Tolerance: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1 %; ±2%; ±3%; ±5%; ±10%;

ST431

Abstract: CDR32BX682 CERAMIC CHIP/MIL-PRF-55681 CERAMIC CHIP/MIL-PRF-123
Contextual Info: 3181 text layout 4/21/01 10:41 AM Page 46 KEMET CERAMIC CHIP/STANDARD FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25

1R2101

Abstract: NLL4532 tdk marking code
Contextual Info: Leadless EMI Filters NLL Series FEATURES MARKINGS • A wide range of L and C values to match your requirements precisely. • High heat resistance against any soldering methods including flow, reflow and soldering iron. Metal ribbon terminals have high corrosion resistance against all

Contextual Info: Cal-Chip Electronics, Incorporated Multilayer Ceramic Chip Capacitors GMC SERIES Introduction Multilayer Surface Mount Ceramic Capacitors are constructed by screen printing alternative layers of internal metallic electrodes onto ceramic dielectric materials and firing into a concrete monolithic body, then completed by application of

2r2 CAPACITOR

Contextual Info: Cal-Chip Electronics, Incorporated Multilayer Ceramic Chip Capacitors GMC SERIES Introduction Multilayer Surface Mount Ceramic Capacitors are constructed by screen printing alternative layers of internal metallic electrodes onto ceramic dielectric materials and firing into a concrete monolithic body, then completed by application of

Contextual Info: Cal-Chip Electronics, Incorporated Multilayer Ceramic Chip Capacitors GMC SERIES Introduction Multilayer Surface Mount Ceramic Capacitors are constructed by screen printing alternative layers of internal metallic electrodes onto ceramic dielectric materials and firing into a concrete monolithic body, then completed by application of

JVR-07N431K

Abstract: 07N431K JVR-05N431K 7N22 JVR07 07N391K JVR-07N201K JVR 7N47 varistor 07N391K JVR-05N241K
Contextual Info: METAL OXIDE VARISTOR Transient V-I Characteristics Curves 5mm V-I CHARACTERISTIC CURVE for standard MOVs 3000 2000 1000 900 800 700 600 500 400 Max Clamping Voltage Max Leakage Current JVR-05N431K JVR-05N431K JVR-05N391K JVR-05N391K JVR-05N361K JVR-05N391K JVR-05N241K

cal-chip GMC21 Series

Contextual Info: Cal-Chip Electronics, Incorporated Multilayer Ceramic Chip Capacitors GMC SERIES Introduction Multilayer Surface Mount Ceramic Capacitors are constructed by screen printing alternative layers of internal metallic electrodes onto ceramic dielectric materials and firing into a concrete monolithic body, then completed by application of

GMC02

Abstract: GMC31
Contextual Info: Cal-Chip Electronics, Incorporated Multilayer Ceramic Chip Capacitors GMC SERIES Introduction Multilayer Surface Mount Ceramic Capacitors are constructed by screen printing alternative layers of internal metallic electrodes onto ceramic dielectric materials and firing into a concrete monolithic body, then completed by application of

GMC21

Abstract: GMC31 gmc32 GMC45 GMC04 GMC31 cg GMC57 GMC55 22MF cal-chip capacitor x7r
Contextual Info: Cal-Chip Electronics, Incorporated Multilayer Ceramic Chip Capacitors GMC SERIES Introduction Multilayer Surface Mount Ceramic Capacitors are constructed by screen printing alternative layers of internal metallic electrodes onto ceramic dielectric materials and firing into a concrete monolithic body, then completed by application of