484-PIN BGA Search Results

Contextual Info: Product Number: 587-10-484-13-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 484-13-005 26 X 26 # Of Pins Mill-Max Part Number 484 587-10-484-13-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737

Contextual Info: Product Number: 599-10-484-11-000429 Description: BGA Header 0.8mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 484-11-000 22 X 22 # Of Pins Mill-Max Part Number 484 599-10-484-11-000429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929

ep2c20

Abstract: EPC2 EP1C12 EP2C5 EP2C15A EP2C35 EP2C50 EPC16 EPCS16 EPCS64
Contextual Info: Thin Quad Flat Pack T Plastic Quad Flat Pack (Q) FineLine BGA (F) 100-Pin TQFP 144-Pin TQFP 208-Pin PQFP 240-Pin PQFP 256-Pin FBGA 324-Pin FBGA 400-Pin FBGA 484-Pin FBGA 484-Pin UFBGA2 672-Pin FBGA 896-Pin FBGA 1 “A” devices differ only in reduced

BGA-484P-M09

Contextual Info: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 484 PIN PLASTIC BGA-484P-M09 484-pin plastic TEBGA Ball pitch 1.00 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.36 mm Max

PBGA 484P

Abstract: BGA484PM07 BGA-484P-M07 2400010
Contextual Info: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 484 PIN PLASTIC BGA-484P-M07 484-pin plastic PBGA Ball pitch 1.00 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.36 mm Max

AF14

Abstract: AC22 AE23 EPF10K200S AE10-AE11 AE20-AE21 AJ43
Contextual Info: EPF10K200S Device Pin-Outs ver. 1.0 Pin Name 1 240-Pin RQFP 356-Pin FineLine BGA 484-Pin FineLine BGA 599-Pin PGA 600-Pin BGA 672-Pin FineLine BGA MSEL0 (2) MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4)

t25 4 J9

Abstract: t25 4 j5 T25 4 E8 t25 4 F6 EPF10K200S T25 4 E5 t35 4 c8 af14 ba43 bf44
Contextual Info: EPF10K200S Device Pin-Outs ver. 1.0 Pin Name 1 240-Pin RQFP 356-Pin FineLine BGA 484-Pin FineLine BGA 599-Pin PGA 600-Pin BGA 672-Pin FineLine BGA MSEL0 (2) MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4)

t25 4 J9

Abstract: be37 AR-17 BA41 AA43 t25 4 L9 BA43 t25 4 F6 t25 4 H9 BE43
Contextual Info: EPF10K200S Device Pin-Outs ver. 1.1 Pin Name 1 240-Pin RQFP 356-Pin FineLine BGA 484-Pin FineLine BGA 599-Pin PGA 600-Pin BGA 672-Pin FineLine BGA MSEL0 (2) MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4)

am3 pins

Abstract: diode t25 4 F6 am3 Pin Package Ac32 g4 diode t25 4 H9 AC32 AD32 AC22 AE23 AF14
Contextual Info: EPF10K100A Device Pin-Outs ver. 1.0 Pin Name 240-Pin PQFP/RQFP 356-Pin BGA 484-Pin FineLine BGA 600-Pin BGA MSEL0 2 MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4) nCS (4) CS (4) RDYnBSY (4) CLKUSR (4)

337 BGA

Abstract: U212-25 AA10 AA23 EP20K200C E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
Contextual Info: EP20K200C I/O Pin-Outs ver. 1.0 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA 652-Pin BGA 672-Pin FineLine BGA 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 –

AA23

Abstract: AC25 EP20K160E
Contextual Info: EP20K160E I/O Pins ver. 1.3 I/O & Pad Pin/Pad VREF Number Function Bank Orientation 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 356-Pin BGA 484-Pin FineLine BGA 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8

AA23

Abstract: AC25 EP20K160E
Contextual Info: EP20K160E I/O Pins ver. 1.4 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 356-Pin BGA 484-Pin FineLine BGA 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8

AA15

Abstract: AB14 AB16 AB17 EP1M120
Contextual Info: EP1M120 I/O Pins ver. 2.0 Table 1 shows all pins for the EP1M120 484-pin FineLine BGA package. Table 1. EP1M120 Device Pin-Outs I/O and VREF Maximum GTL+ Pin Name/Function Bank Current Subgroup 1 1 I/O 1 I/O 1 I/O 1 I/O 1 HSDI_CLK1p 1 I/O 1 I/O 1 I/O 1 I/O

EP1M120

Abstract: AA15 AB14 AB16 AB17 VCCIO13
Contextual Info: EP1M120 I/O Pins ver. 4.1 Table 1 shows all pins for the EP1M120 484-pin FineLine BGA package. Table 1. EP1M120 Device Pin-Outs Maximum GTL+ I/O and VREF Pin Name/Function Current Bank Subgroup 1 1 I/O 1 I/O 1 I/O 1 I/O 1 HSDI_CLK1p 1 I/O 1 I/O 1 I/O 1 I/O

AA10

Abstract: AA23 EP20K200E E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
Contextual Info: EP20K200E I/O Pins ver. 1.0 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – Pad Number Orientation Pin/Pad Function 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA

C4228

Contextual Info: 7.15mm [0.281"] A1 7.15mm [0.281"] 26X26X5 + 8X8 ARRAY 25mm 39.3mm [0.984"] [1.547"] 41.9mm [1.650"] 1mm [0.039"] Top View 41.9mm [1.650"] DETAIL A Lead coplanarity 0.005" max. 2.78mm [0.109"] 0.5mm Side View Description: BGA to QFP package converter 484 position BGA surface mount pads to 256 QFP, 0.5mm gull-wing leads. Pin assignment as per Actel requirements.

QFP Package 80 lead

Abstract: C4002 256-QFP 256QFP
Contextual Info: 7.15mm [0.281"] A1 7.15mm [0.281"] 26X26X5 + 8X8 ARRAY 25mm 39.3mm [0.984"] [1.547"] 41.9mm [1.650"] 1mm [0.039"] Top View 41.9mm [1.650"] DETAIL A Lead coplanarity 0.005" max. 2.78mm [0.109"] 0.5mm Side View Description: BGA to QFP package converter 484 position BGA surface mount pads to 256 QFP, 0.5mm gull-wing leads. Pin assignment as per Actel requirements.

EQFP 144 PACKAGE

Abstract: BGA and eQFP Package TQFP 144 PACKAGE altera micro fineline BGA eQFP EPC16
Contextual Info: Package dimensions selector guide FineLine BGA FBGA ; Hybrid FineLine BGA (HFBGA) as noted 1,932 1,760 45.00 x 45.00 1.00 1,517 43.00 x 43.00 1.00 1,020 40.00 x 40.00 1.00 896 33.00 x 33.00 1.00 1,508 780 31.00 x 31.00 1.00 40.00 x 40.00 1.00 35.00 x 35.00

7075-T6 aluminum

Abstract: 7075-T6 high current pogo pin aluminium 7075 180C SBT-BGA-7000 high current high temperature pogo pin
Contextual Info: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features 10 14 9 7 8 6 • • • • • • 5 13 12 4 15 3 1 2 11 Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches from true position

SG-BGA-6046

Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
Contextual Info: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.

Contextual Info: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and

bga 484 0.8mm pitch

Abstract: land pattern 484 BGA SF-BGA484B-B-11 BGA484B
Contextual Info: D Package Code: BGA484B C .0225" dia. tooling holes X2 non plated (optional) 0.624mm See BGA pattern code to the right for actual pattern layout Y 0.878mm 0.025" dia. pad X 31.75mm Top View (reference only) 2 1.27mm [0.050"] 0.36mm [0.014"] dia. 0.635mm

land pattern 484 BGA

Abstract: 0.4mm pitch BGA pitch 0.4mm BGA 22X22 SF-BGA484C-B-11
Contextual Info: C Package Code: BGA484C D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 21.00mm [0.827"] 1.00mm pitch typ. X Top View (reference only) 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]

HXC125

Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296
Contextual Info: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The