DIP28H
Abstract: No abstract text available
Text: SANYO Semiconductor Dual In-line Package with Heat sink 28Pin Plastic DIP28H 500mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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28Pin
DIP28H
500mil)
ED-7303A)
DIP28H
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TSOP 54 Package
Abstract: TSOP 54 PIN 54-PIN TSOP II 54 Package
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 54 PIN PLASTIC FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80mm Package width 500mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M01) * : Resin protrusion. (Each side : 0.15 (.006) Max) 54-pin plastic TSOP (II)
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FPT-54P-M01
500mil
54-pin
FPT-54P-M01)
F54001S-2C-1
TSOP 54 Package
TSOP 54 PIN
TSOP II 54 Package
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MX23L12810MC-15
Abstract: MX23L12810 Macronix International MX23L12810MC-10 MX23L12810MC-12
Text: MX23L12810 128M-BIT 8M x 16 MASK ROM (SOP ONLY) FEATURES • Bit organization - 8M x 16 (word mode) • Fast access time - Random access: 100ns (max.) • Current - Operating:50mA - Standby:15uA • Supply voltage - 3.0~3.6V • Package - 44 pin SOP (500mil)
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MX23L12810
128M-BIT
100ns
500mil)
MX23L12810MC-15
MX23L12810
Macronix International
MX23L12810MC-10
MX23L12810MC-12
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DIP28H
Abstract: No abstract text available
Text: SANYO Semiconductor Dual In-line Package with Heat sink 28Pin Plastic DIP28H 500mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
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28Pin
DIP28H
500mil)
ED-7303A
DIP28H
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Macronix International
Abstract: MX23L3211 MX23L3211MC-10 MX23L3211MC-10G MX23L3211MC-12 MX23L3211MC-12G MX23L3211MC-70 MX23L3211MC-90
Text: MX23L3211 32M-BIT MASK ROM 8/16-BIT OUTPUT • Current - Operating:40mA - Standby:5uA • Supply voltage - 3.0V ~ 3.6V for 90ns and 70ns speed grades - 2.7V ~ 3.6V for 100ns and 120ns speed grades • Package - 44 pin SOP (500mil) - 48 pin TSOP (12mm x 20mm)
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MX23L3211
32M-BIT
8/16-BIT
100ns
120ns
500mil)
Macronix International
MX23L3211
MX23L3211MC-10
MX23L3211MC-10G
MX23L3211MC-12
MX23L3211MC-12G
MX23L3211MC-70
MX23L3211MC-90
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DIP28H
Abstract: No abstract text available
Text: SANYO Semiconductor Dual In-line Package with Heat Sink 28Pin Plastic DIP28HD 500mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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28Pin
DIP28HD
500mil)
ED-7303A)
DIP28HD
DIP28H
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T60142E
Abstract: No abstract text available
Text: Features • Operating voltage: 3.3V • Access time: 15, 20ns • Very low power consumption • • • • • • • – active: 470mW Max – standby: 165µW (Typ) Wide temperature Range: -55 to +125°C 500Mils width package TTL compatible inputs and outputs
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470mW
500Mils
T60142E
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T60142E
Abstract: No abstract text available
Text: Features • Operating voltage: 3.3V • Access time: 15, 20ns • Very low power consumption • • • • • • • – active: 470mW Max – standby: 165µW (Typ) Wide temperature Range: -55 to +125°C 500Mils width package TTL compatible inputs and outputs
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470mW
500Mils
T60142E
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MX23L12810MC-15
Abstract: MX23L12810
Text: MX23L12810 128M-BIT 8M x 16 MASK ROM (SOP ONLY) FEATURES • Bit organization - 8M x 16 (word mode) • Fast access time - Random access: 100ns (max.) • Current - Operating:50mA - Standby:15uA • Supply voltage - 3.0~3.6V • Package - 44 pin SOP (500mil)
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MX23L12810
128M-BIT
100ns
500mil)
MX23L12810MC-15
MX23L12810
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MX23L12810MC-15
Abstract: No abstract text available
Text: MX23L12810 128M-BIT 8M x 16 MASK ROM (SOP ONLY) FEATURES • Bit organization - 8M x 16 (word mode) • Fast access time - Random access: 90ns (max.) • Current - Operating:50mA - Standby:15uA • Supply voltage - 3.0~3.6V • Package - 44 pin SOP (500mil)
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MX23L12810
128M-BIT
500mil)
FEB/01/2002
JUL/19/2002
NOV/20/2002
DEC/03/2002
DEC/10/2002
PM0750
MX23L12810MC-15
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MX23L3222
Abstract: MX23L3222MC-10 MX23L3222MC-12
Text: MX23L3222 32M-BIT MASK ROM 16/32 BIT OUTPUT FEATURES • Current - Operating:60mA - Standby:50uA • Supply voltage - 3.3V±10% • Package - 70 pin SSOP (500mil) PIN CONFIGURATION PIN DESCRIPTION A0 A1 A2 A3 A4 A5 VCC D0 D16 D1 D17 VSS VCC D2 D18 D3 D19
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MX23L3222
32M-BIT
500mil)
100ns
100-pin
PM0396
MAR/25/1998
JAN/29/1999
OCT/19/2001
MX23L3222
MX23L3222MC-10
MX23L3222MC-12
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AV02-0310EN
Abstract: ACNV3130 DIP10 package
Text: ACNV3130 2.5 Amp Output Current IGBT Gate Drive Optocoupler in 500Mil DIP10 Package Data Sheet Description Features The ACNV3130 contains an AlGaAs LED, which is optically coupled to an integrated circuit with a power output stage. This optocoupler is ideally suited for driving power
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ACNV3130
500Mil
DIP10
ACNV3130
700V/100A.
AV02-3789EN
AV02-0310EN
DIP10 package
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DIP28HC
Abstract: No abstract text available
Text: SANYO Semiconductor Dual In-line Package with Heat sink 28Pin Plastic DIP28HC 500mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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28Pin
DIP28HC
500mil)
ED-7303A)
DIP28HC
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MX23L1611
Abstract: MX23L1611PC-10 MX23L1611TC-10 MX23L1611TC-10G MX23L1611TC-12 MX23L1611TI-12 MX23L1611MC-10 MX23L1611MC-10G MX23L1611MC-12 MX23L1611MC-12G
Text: MX23L1611 3.3 Volt 16-Mbit 2M x 8 / 1M x 16 Mask ROM with Page Mode FEATURES • Current - Operating:40mA - Standby:15uA • Supply voltage - 100ns @3.0V ~ 3.6V - 120ns @2.7V ~ 3.6V • Package - 44 pin SOP (500mil) - 48 pin TSOP (12mm x 20mm) - 42 pin PDIP
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MX23L1611
16-Mbit
100ns
120ns
500mil)
MX23L1611MC-10
MX23L1611MC-12
MX23L1611MC-10G
MX23L1611MC-12G
MX23L1611
MX23L1611PC-10
MX23L1611TC-10
MX23L1611TC-10G
MX23L1611TC-12
MX23L1611TI-12
MX23L1611MC-10
MX23L1611MC-10G
MX23L1611MC-12
MX23L1611MC-12G
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70-pin
Abstract: 3521a
Text: UNIT : mm 335±1.0 23.5±0.5 288±0.5 137.5±0.5 A' A SECTION A – A' 17 12.38 5.1 5.8 8.8 180±1.0 21.25±0.5 27.5±0.1 32±0.1 Applied Package Quantity pcs 70-pin Plastic Shrink SOP (500mil) MAX. 60 Tray LA-3521A-1 Material Carbon PPE Heat Proof Temp.
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70-pin
500mil)
LA-3521A-1
3521a
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Untitled
Abstract: No abstract text available
Text: 34 PIN PLASTIC SOJ 500mil 18 1 17 F E T P I H G U J C 34 D B Q K M N M S34LG-500A ITEM MILLIMETERS INCHES B 22.42 ± 0.2 0.883+0.008 –0.009 C 12.7 0.500 D 13.72 ± 0.2 0.540 ± 0.008 E 1.05 ± 0.15 0.041+0.007 –0.006 F 0.74 0.029 G 3.5 ± 0.2 0.138 ± 0.008
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500mil)
S34LG-500A
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Untitled
Abstract: No abstract text available
Text: MX23L1611 3.3 Volt 16-Mbit 2M x 8 / 1M x 16 Mask ROM with Page Mode FEATURES • Current - Operating:40mA - Standby:15uA • Supply voltage - 100ns @3.0V ~ 3.6V - 120ns @2.7V ~ 3.6V • Package - 44 pin SOP (500mil) - 48 pin TSOP (12mm x 20mm) - 42 pin PDIP
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MX23L1611
16-Mbit
100ns
120ns
500mil)
MX23L1611MC-10
MX23L1611MC-12
MX23L1611MC-10G
MX23L1611MC-12G
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MX23L12810MC-15
Abstract: MX23L12810
Text: MX23L12810 128M-BIT 8M x 16 MASK ROM (SOP ONLY) FEATURES • Bit organization - 8M x 16 (word mode) • Fast access time - Random access: 90ns (max.) • Current - Operating:50mA - Standby:15uA • Supply voltage - 3.0~3.6V • Package - 44 pin SOP (500mil)
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MX23L12810
128M-BIT
500mil)
DEC/12/2000
DEC/14/2000
AUG/28/2001
FEB/01/2002
JUL/19/2002
PM0750
MX23L12810MC-15
MX23L12810
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36P4E
Abstract: SDIP36-P-500-1
Text: 36P4E Plastic 36pin 500mil SDIP EIAJ Package Code SDIP36-P-500-1.78 Weight g 3.0 Lead Material Cu Alloy 19 1 18 E 36 e1 c JEDEC Code – Symbol L A1 A A2 D e SEATING PLANE b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.08
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36P4E
36pin
500mil
SDIP36-P-500-1
36P4E
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MX23L12810
Abstract: MX23L12810MC-15 MX23L12810MC-10 MX23L12810MC-12
Text: MX23L12810 128M-BIT 8M x 16 MASK ROM (SOP ONLY) FEATURES • Bit organization - 8M x 16 (word mode) • Fast access time - Random access: 100ns (max.) • Current - Operating:50mA - Standby:15uA • Supply voltage - 3.0~3.6V • Package - 44 pin SOP (500mil)
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MX23L12810
128M-BIT
100ns
500mil)
FEB/17/2005
MX23L12810
MX23L12810MC-15
MX23L12810MC-10
MX23L12810MC-12
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DIP20H
Abstract: No abstract text available
Text: SANYO Semiconductor Dual In-line Package with Heat sink 20Pin Plastic DIP20H 500mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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20Pin
DIP20H
500mil)
ED-7303A)
DIP20H
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Untitled
Abstract: No abstract text available
Text: MX23L3222 32M-BIT MASK ROM 16/32 BIT OUTPUT FEATURES • Current - Operating:60mA - Standby:50uA • Supply voltage - 3.3V±10% • Package - 70 pin SSOP (500mil) PIN CONFIGURATION PIN DESCRIPTION A0 A1 A2 A3 A4 A5 VCC D0 D16 D1 D17 VSS VCC D2 D18 D3 D19
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MX23L3222
32M-BIT
100ns
500mil)
D31/A-1
D129/2001
PM0396
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Untitled
Abstract: No abstract text available
Text: MX23L3211 32M-BIT MASK ROM 8/16-BIT OUTPUT • Current - Operating:40mA - Standby:5uA • Supply voltage - 3.0V ~ 3.6V for 90ns and 70ns speed grades - 2.7V ~ 3.6V for 100ns and 120ns speed grades • Package - 44 pin SOP (500mil) - 48 pin TSOP (12mm x 20mm)
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MX23L3211
32M-BIT
8/16-BIT
100ns
120ns
500mil)
D15/A1
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Untitled
Abstract: No abstract text available
Text: MX23L81OO 8M-BIT MASK ROM 8/16 BIT OUTPUT FEATURES ORDER INFORMATION Bit organization - 1 M x 8 (byte mode) - 512K x 16 (word mode) Fast access time - Random access: 100ns (max.) Current - Operating: 20mA - Standby: 5uA Supply voltage - 3.3V+10% Package - 44 pin SOP (500mil)
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MX23L81OO
100ns
500mil)
600mil)
MX23L8100MC-10
MX23L8100MC-12
120ns
MX23L8100MC-15
150ns
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