50MIL Search Results

TLA-6T121

Abstract: TLA-6T102-T TLA-6T103 TLA-6T118 6T115 78Q2120 DP83843 ICS1890 LXT970A ML6673
Contextual Info: 1/18 001-01 / 20020221 / ed415_tla6t.fm LAN Components TLA-6T102/103/106/107/109/110/111/112/115/116/117/ 118/119/120/121/122/124/401/402/403/404/405 10/100BASE-TX Pulse Transformers TLA-6T102 FEATURES • 16-pin SOP package(1.27mm=50mil pin pitch). • Excellent common-mode noise suppression.

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 32 PIN PLASTIC FPT-32P-M02 EIAJ code : ∗SOP032-P-0450-1 32-pin plastic SOP Lead pitch 50mil Nominal dimensions 50mil Standard Conforms with EIAJ:TYPE IV Lead shape Gullwing Sealing method Plastic mold FPT-32P-M02 32-pin plastic SOP

Contextual Info: SMALL OUTLINE PACKAGE 24 PIN CERAMIC FPT-24C-A01 24-pin ceramic SOP Lead pitch 50mil Lead shape Straight Sealing method Metal seal FPT-24C-A01 24-pin ceramic SOP (FPT-24C-A01) 0.25(.010)MIN 6.99±0.64 (.275±.025) 10.16±0.18 (.400±.007) 7.11(.280) 23.04(.907)

LCC 44

Abstract: CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1
Contextual Info: LEADLESS CHIP CARRIER 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 Lead pitch 50mil Package width x package length 650 × 50mil Sealing method Frit seal 44-pad ceramic LCC LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01) R0.23(.009)TYP (44 PLCS)

991066

Contextual Info: SMALL OUTLINE PACKAGE 18 PIN CERAMIC FPT-18C-C01 18-pin ceramic SOP Lead pitch 50mil Lead shape Straight Sealing method Cerdip FPT-18C-C01 18-pin ceramic SOP (FPT-18C-C01) +0.33 11.10 –0.05 +.013 .437 –.002 0.64(.025)MAX 0.97±0.18 (.038±.007) 7.06±0.51

a06 transistor

Abstract: PGA-441C-A06 441pin 441-pin
Contextual Info: PIN GRID ARRAY PACKAGE 441 PIN CERAMIC PGA-441C-A06 441-pin ceramic PGA Lead pitch 50mil Pin matrix 27 Sealing method Metal seal PGA-441C-A06 441-pin ceramic PGA (PGA-441C-A06) 0.20 ± 0.05 DIA. (.008 ± .002) C 0.50 (.020) TYP. (3 PLCS) 25.40 ± 0.50 SQ

PGA257-C-S19U-1

Abstract: 256c 256-PIN
Contextual Info: PIN GRID ARRAY PACKAGE 256 PIN CERAMIC PGA-256C-A01 EIAJ code : ∗PGA257-C-S19U-1 256-pin ceramic PGA Number of pins 257 pins includes extra index pin Lead pitch 50mil Pin matrix 19 Sealing method Metal seal (PGA-256C-A01) 256-pin ceramic PGA (PGA-256C-A01)

TSOP032-P-0400-1

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 32 PIN PLASTIC FPT-32P-M17 EIAJ code : TSOP032-P-0400-1 Lead pitch 50mil Package width 400mil Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold 32-pin plastic TSOP II (FPT-32P-M17) * : Resin protrusion. (Each side : 0.15 (.006) Max)

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 26 PIN PLASTIC FPT-26P-M02 Lead pitch 50mil Package width 300mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold 26-pin plastic TSOP II (FPT-26P-M02) * : Resin protrusion. (Each side : 0.15 (.006) Max)

209MIL

Contextual Info: SMALL OUTLINE PACKAGE 16 PIN CERAMIC FPT-16C-C02 16-pin ceramic SOP Lead pitch 50mil Row spacing 209mil Lead shape Gullwing Sealing method Cerdip FPT-16C-C02 16-pin ceramic SOP (FPT-16C-C02) 0.43±0.05 (.0170±.002) 2.41(.095) MAX 0.05(.002) MIN 0.76(.030)

LCC 18 Pin Package

Abstract: QFJ044-P-S653-2
Contextual Info: PLASTIC LEADED CHIP CARRIER 44 PIN PLASTIC LCC-44P-M02 EIAJ code : ∗QFJ044-P-S653-2 Lead pitch 50mil Package width x package length 653 × 653mil Lead shape J bend Sealing method Plastic mold 44-pin plastic QFJ PLCC (LCC-44P-M02) 44-pin plastic QFJ (PLCC)

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 16 PIN PLASTIC FPT-16P-M03 EIAJ code : ∗SOP016-P-0375-1 16-pin plastic SOP Lead pitch 50mil Nominal dimensions 375mil Standard Conforms with EIAJ:TYPE III Lead shape Gullwing Sealing method Plastic mold FPT-16P-M03 16-pin plastic SOP

FPT-24P-M01

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 24 PIN PLASTIC FPT-24P-M01 EIAJ code : ∗SOP024-P-0300-1 Lead pitch 50mil Nominal dimensions 300mil Standard Conforms with EIAJ:TYPE II Lead shape Gullwing Sealing method Plastic mold 24-pin plastic SOP FPT-24P-M01 24-pin plastic SOP

m7207

Contextual Info: SINGLE IN-LINE TYPE MODULE 72 PIN PLASTIC MSS-72P-P76 Lead pitch 50mil Motherboard material Plastic Mounted package material Plastic Pin plating Gold 72-pin plastic SIMM socket type (MSS-72P-P76) 72-pin plastic SIMM (socket type) (MSS-72P-P76) 107.95±0.13

Contextual Info: SINGLE IN-LINE TYPE MODULE 72 PIN PLASTIC MSS-72P-P74 Lead pitch 50mil Motherboard material Plastic Mounted package material Plastic Pin plating Gold 72-pin plastic SIMM socket type (MSS-72P-P74) 72-pin plastic SIMM (socket type) (MSS-72P-P74) 107.95±0.13

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE 32 PIN PLASTIC LCC-32P-M03 EIAJ code : ∗SOJ032-P-0400-1 32-pin plastic SOJ Lead pitch 50mil Package width 400mil Lead shape J bend Sealing method Plastic mold LCC-32P-M03 32-pin plastic SOJ (LCC-32P-M03) * : Resin protrusion. (Each side : 0.15 (.006) max)

diode s453

Abstract: QFJ028-P-S453-2 LCC-28P-M03
Contextual Info: PLASTIC LEADED CHIP CARRIER 28 PIN PLASTIC LCC-28P-M03 EIAJ code : ∗QFJ028-P-S453-2 Lead pitch 50mil Package width x package length 453 × 453mil Lead shape J bend Sealing method Plastic mold 28-pin plastic QFJ PLCC (LCC-28P-M03) 28-pin plastic QFJ (PLCC)

SIMM 30-pin

Abstract: p03 transistor MSS-30P-P03 30-pin
Contextual Info: SINGLE IN-LINE TYPE MODULE 30 PIN PLASTIC MSS-30P-P03 Lead pitch 50mil Motherboard material Plastic Mounted package material Plastic Pin plating Solder 30-pin plastic SIMM socket type (MSS-30P-P03) 30-pin plastic SIMM (socket type) (MSS-30P-P03) 88.90 ±0.13(3.500 ±.005)

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 24 PIN PLASTIC FPT-24P-M02 EIAJ code : ∗SOP024-P-0375-1 24-pin plastic SOP Lead pitch 50mil Nominal dimensions 375mil Standard Conforms with EIAJ:TYPE III Lead shape Gullwing Sealing method Plastic mold FPT-24P-M02 24-pin plastic SOP

Contextual Info: SINGLE IN-LINE TYPE MODULE 72 PIN PLASTIC MSS-72P-P24 Lead pitch 50mil Motherboard material Plastic Mounted package material Plastic Pin plating Solder 72-pin plastic SIMM socket type (MSS-72P-P24) 72-pin plastic SIMM (socket type) (MSS-72P-P24) 107.95±0.13(4.250±.005)

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 20 PIN PLASTIC FPT-20P-M05 EIAJ code : ∗SOP020-P-0375-2 20-pin plastic SOP Lead pitch 50mil Nominal dimensions 375mil Standard Conforms with EIAJ:TYPE III Lead shape Gullwing Sealing method Plastic mold FPT-20P-M05 20-pin plastic SOP

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 16 PIN PLASTIC FPT-16P-M04 EIAJ code : ∗SOP016-P-0225-1 Lead pitch 50mil Nominal dimensions 225mil Standard Conforms with EIAJ: TYPE I Lead shape Gullwing Sealing method Plastic mold 16-pin plastic SOP FPT-16P-M04 16-pin plastic SOP

CERAMIC LEADLESS CHIP CARRIER

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 52 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC LCC-16C-F01
Contextual Info: LEADLESS CHIP CARRIER 16 PAD CERAMIC LCC-16C-F01 EIAJ code : ∗QFN016-G-S250-1 16-pad ceramic LCC Lead pitch 50mil Package width x package length 250 × 50mil Sealing method Frit seal LCC-16C-F01 *Shape of PIN NO.1 INDEX : Subject to change without notice.

quad flat j-leaded package

Abstract: QFJ-44C-C01
Contextual Info: QUAD FLAT J-LEADED PACKAGE 44 PIN CERAMIC QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50mil Package width x package length 650 × 50mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01 44-pin ceramic QFJ (QFJ-44C-C01) 17.53±0.13SQ (.690±.005) +0.25