|
TLP5701
|
|
Toshiba Electronic Devices & Storage Corporation
|
Photocoupler (photo-IC output), IOP=+/-0.6 A, 5000 Vrms, SO6L |
|
|
|
69057-012TCLF
|
|
Amphenol Communications Solutions
|
Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 4 Positions, 2.00mm (0.079in) Pitch.. |
|
|
|
10130570-101LF
|
|
Amphenol Communications Solutions
|
AirMax VSe®, Backplane Connectors, 5-Pair, 120 -position, 2mm pitch, 8 column, 4 Walls, Right Angle Header, small press-fit, 2 side plating. |
|
|
|
55701-001
|
|
Amphenol Communications Solutions
|
GIG-Array®, Mezzanine Connectors, 5mm Receptacle 296 Position. |
|
|
|
69057-014TC
|
|
Amphenol Communications Solutions
|
Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 14 Positions, 2.00mm (0.079in) Pitch.. |
|
|
