583.1 Search Results

Contextual Info: HC1361 • Quartz Frequency Stability • Excellent Jitter and Sym m etry Performance • Rugged, Hermetic M etal DIP Case The HC1361 digital clock is designed for use with high speed CPUs operating at 116.62, 145.775, 194.3667 or 291.55 MHz. The 583.1 MHz fundamental oscillation

OPI 1169

Abstract: TAA480 PLCC32 1N4148 DIR10 HF88M08 LC1 DC
Contextual Info: Command Interface 8M-Bit Ma HF88M08 ROM with Expansion I/O Preliminary Product Specification Product Name KB Doc. No. Command Interface 8M-Bit Mask ROM with Expansion I/O HF88M08 KB Product. No. HF88M08 - Table of Contents – 1 FUNCTION

HJK-212H

Contextual Info: Frequency Mixer HJK-212H+ Typical Performance Data RF IN (MHz) 780.0 830.0 880.0 930.0 980.0 1030.0 1080.0 1130.0 1180.0 1230.0 1280.0 1330.0 1380.0 1430.0 1480.0 1530.0 1580.0 1630.0 1690.0 1740.0 1800.0 1850.0 1910.0 1960.0 2020.0 2070.0 2130.0 2180.0

8205 datasheet

Abstract: 8205 A 9583 AN609 si84
Contextual Info: Si8465DB_RC Vishay Siliconix R-C Thermal Model Parameters DESCRIPTION The parametric values in the R-C thermal model have been derived using curve-fitting techniques. R-C values for the electrical circuit in the Foster/tank and Cauer/filter configurations are included. When implemented in P-SPICE,

epcos 565-2

Abstract: B57540G0103F000 B57540G0104F000 565-2 EPCOS EPCOS B25 160 131850 263640 EPCOS b57540 B57540G0502F000 10311
Contextual Info: NTC thermistors for temperature measurement Glass-encapsulated sensors, standard type Series/Type: Date: B57540 March 2006 EPCOS AG 2006. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

B57550G0103F000

Abstract: 13844 B57550G0104H000 B57550G0202G000 B57550G0202F000 263640 33260 B57550 B57550G0103J000 533390
Contextual Info: NTC thermistors for temperature measurement Glass-encapsulated sensors, standard type Series/Type: Date: B57550 March 2006 EPCOS AG 2006. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

bauelemente DDR

Abstract: SPF 455 Teltow Mechanische Filter VEB Kombinat zf filter rft katalog SPF 10700 49004 SPF455 490.2159 Kombinat VEB Elektronische Bauelemente
Contextual Info: Passive elektronische Bauelemente O Widerstände Q Kondensatoren 0 Kinlaklfcaüelemenle 2 Suidererzeognisse Passive elektronische Bauelemente Auf allen G ebieten der Elektronik und Elektrotechnik werden an Leistungsfähigkeit, Lebensdauer und Zu­ verlässigkeit elektronischer Bauelemente ständig

50479

Contextual Info: Mini-Circuits - Specification for Voltage Controlled Oscillator - ROS-EDR5812/1 Voltage Controlled Oscillator Notes: • For Surface Mount Environmental Specifications, please click here. Re-flow soldering information is available in "Surface Mount" article.

iso 5459

Contextual Info: Mini-Circuits - Specification for Frequency Mixer - TUF-3MH Frequency Mixers Notes: • +13 dBm LO, up to +9 dBm RF • Absolute maximum power, voltage and current ratings: a. RF power, 200mW b. Peak IF current, 40mA print this page LO Power Level 13 dBm Pin Configuration

Contextual Info: Mini-Circuits - Specification for Frequency Mixer - TUF-3MHSM Frequency Mixers Notes: • For Surface Mount Environmental TUF-3MHSM Specifications, please click here. • General Quality Control Procedures and print this page LO Power Level 13 dBm Environmental Specifications are given in MiniCircuits Guarantees Quality.

BY393

Abstract: BY339 I32005 t3 055e 40555 6628e 12JAN 6819e BY294 SP320
Contextual Info: Product Characterization Report for the SP320 Family of Products Prepared By: Salvador Wu & Greg West Date: March 1, 2007 SP320 Product Family Characterization Report Table of Contents Section Introduction Characterization Procedure Data Summary for Key Parameters

AN609

Abstract: Si2314EDS
Contextual Info: Si2314EDS_RC Vishay Siliconix R-C Thermal Model Parameters DESCRIPTION The parametric values in the R-C thermal model have been derived using curve-fitting techniques. These techniques are described in "A Simple Method of Generating Thermal Models for a Power MOSFET"[1].

AN609

Abstract: Si2307BDS
Contextual Info: Si2307BDS_RC Vishay Siliconix R-C Thermal Model Parameters DESCRIPTION The parametric values in the R-C thermal model have been derived using curve-fitting techniques. These techniques are described in "A Simple Method of Generating Thermal Models for a Power MOSFET"[1].

AN609

Abstract: Si2312DS
Contextual Info: Si2312DS_RC Vishay Siliconix R-C Thermal Model Parameters DESCRIPTION The parametric values in the R-C thermal model have been derived using curve-fitting techniques. These techniques are described in "A Simple Method of Generating Thermal Models for a Power MOSFET"[1].

C3502

Abstract: C2201 C3002 MPC3302 SP1200SF
Contextual Info: Consolidated Results for the 6 months ended September 30, 2012 October 30, 2012 Zenji Miura, Director, Deputy President & CFO Ricoh Company, Ltd. A large screen signage, made up of three Ricoh ultra-short-throw projectors connected together at the 2012 Annual Meetings of

SG2100

Abstract: MPC3302 WX4130 WX-32 MP4002
Contextual Info: Consolidated Results for the year ended March 31, 2012 April 26, 2012 Zenji Miura Director, Deputy President & CFO Ricoh Company, Ltd. *Color MFP “MP C5002” with new design, new user interface and enhanced eco-efficiency Forward-looking statements The plans, prospects, strategies and other statements, except for the historical events, mentioned in

HJK-212H

Contextual Info: Frequency Mixer HJK-212H+ Typical Performance Data RF IN (MHz) 780.0 830.0 880.0 930.0 980.0 1030.0 1080.0 1130.0 1180.0 1230.0 1280.0 1330.0 1380.0 1430.0 1480.0 1530.0 1580.0 1630.0 1690.0 1740.0 1800.0 1850.0 1910.0 1960.0 2020.0 2070.0 2130.0 2180.0

schematic diagram atx Power supply 500w

Abstract: pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 Digital Signal Processors, iCoupler , iMEMS® and iSensor . . . . . 805, 2707, 2768-2769 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-568 RF Connectors . . . . . . . . . . . . . . . . . . . . . . Pages 454-455

ROS-470-519

Contextual Info: ROS-470-519+ Voltage Controlled Oscillator Typical Performance Data V TUNE FREQUENCY POWER OUTPUT TUNE SENS MHz/V (MHz) (dBm) 0.0 0.3 0.5 0.8 1.0 1.3 1.5 1.8 2.0 2.3 2.5 2.8 3.0 3.3 3.5 3.8 4.0 4.3 4.5 4.8 5.0 5.3 5.5 5.8 6.0 58.26 55.80 56.50 58.89 58.45

ADE-30

Contextual Info: Frequency Mixer ADE-30+ Typical Performance Data RF IN (MHz) 150.1 250.8 351.6 452.3 553.1 653.8 754.6 855.3 956.1 1056.8 1157.5 1258.3 1359.0 1459.8 1560.5 1661.3 1762.0 1862.7 1963.5 2064.2 2165.0 2265.7 2366.5 2467.2 2568.0 2668.7 2769.4 2870.2 2991.1

60492

Abstract: AT/ct+58340+diode
Contextual Info: Mini-Circuits - Specification for Voltage Controlled Oscillator - ROS-EDR6139 Voltage Controlled Oscillator Notes: • For Surface Mount Environmental Specifications, please click here. Re-flow soldering information is available in "Surface Mount" article.

58050

Contextual Info: Mini-Circuits - Specification for Frequency Mixer - ZP-3MH Frequency Mixers Notes: • +13 dBm LO, up to +9 dBm RF • Absolute maximum power, voltage and • General Quality Control Procedures and LO Power Level 13 dBm Environmental Specifications are given in

ADE-30

Contextual Info: Frequency Mixer ADE-30 Typical Performance Data RF IN (MHz) 150.1 250.8 351.6 452.3 553.1 653.8 754.6 855.3 956.1 1056.8 1157.5 1258.3 1359.0 1459.8 1560.5 1661.3 1762.0 1862.7 1963.5 2064.2 2165.0 2265.7 2366.5 2467.2 2568.0 2668.7 2769.4 2870.2 2991.1

2547h

Abstract: chipkill 82801CA 82870P2 E7500 P64H2 82802b 152364
Contextual Info: Intel E7500 Chipset Datasheet Intel® E7500 Memory Controller Hub MCH February 2002 Document Number: 290730-001 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual