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    676 BGA PACKAGE TRAY Search Results

    676 BGA PACKAGE TRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    676 BGA PACKAGE TRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Search by Part Number Search Site by k eyword Contact IDT | Investors | Press Calculators | Cross Reference | Green Initiative | Military | Parametric Search | Search by Part Number, Keyw ord, Document, Green/Pb-Free, Package Home > Products > PCI Express Switches > I/O Expansion Switches > 89HPES24T3G2 > 89HPES24T3G2ZBBR


    Original     		PDF 89HPES24T3G2 89HPES24T3G2ZBBR 89HPES24T3G2 BR676) 30C/60 48hrs PES24T3G2

    676 BGA package tray

    Abstract: No abstract text available
    Text: Search by Part Number Search Site by k eyword Contact IDT | Investors | Press Calculators | Cross Reference | Green Initiative | Military | Parametric Search | Search by Part Number, Keyw ord, Document, Green/Pb-Free, Package Home > Products > PCI Express Switches > I/O Expansion Switches > 89HPES24T3G2 > 89HPES24T3G2ZBBR8


    Original     		PDF 89HPES24T3G2 89HPES24T3G2ZBBR8 89HPES24T3G2 BR676) 30C/60 48hrs PES24T3G2 676 BGA package tray

    BGA package tray 40 x 40

    Abstract: ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07
    Text: FUJITSU SEMICONDUCTOR DATA SHEET BGA 256, 320, 352, 420, 484, 543, 544, 554, 676 PBGA 256, 352, 416, 420, 480, 484, 496 Maximum storage capacity PKG code Maximum storage capacity PKG code pcs/tray pcs/inner box pcs/outer box BGA-484P-M07 40 400 1600 1600 BGA-484P-M09


    Original     		PDF BGA-484P-M07 BGA-484P-M09 BGA-496P-M02 BGA-543P-M01 BGA-320P-M06 BGA-544P-M01 BGA-352P-M36 BGA-544P-M02 BGA-352P-M41 BGA-544P-M04 BGA package tray 40 x 40 ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07

    E700G

    Abstract: No abstract text available
    Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF DS577G E700G

    nitto GE-100L

    Abstract: GE-100L Nitto GE 100 nitto GE CCL-HL-832 CCL-HL832 HL832 pcb material datasheet 100L CO-029 MS-034
    Text: LAMINATE data sheet MCM-PBGA Features: MCM-PBGA Packages: The MCM-PBGA Multi-Chip Module Plastic Ball Grid Array by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA


    Original     		PDF

    Regulator ICs with 10 pins can

    Abstract: ba6898s
    Text: Optical disc ICs 4-channel BTL driver for CD players BA6898S / BA6898FP The BA6898S / BA6898FP ICs contain a 4-channel BTL driver , 5V regulator which requires an externally connected PNP transistor , multi-purpose operational amplifier, and reset output for use with CD players. Also equipped with an


    Original     		PDF BA6898S BA6898FP BA6898FP SSOP-A54 O220FP RSIP13 maging\BITTING\cpl\20010105\01042001\ROHM Regulator ICs with 10 pins can

    3 band audio tone control

    Abstract: extra bass circuit diagram valve audio amplifier circuit diagram 676 BGA package tray extra bass circuit
    Text: Audio ICs Audio sound controller BH3857AFV The BH3857AFV is a signal-processing IC for controlling audio quality in CD radio-cassette players and mini-component stereo systems. Three-line serial control is available making it easy to adjust tone and volume using a microprocessor.


    Original     		PDF BH3857AFV BH3857AFV SSOP-A54 O220FP RSIP13 maging\BITTING\cpl\20010108\01052001\ROHM 3 band audio tone control extra bass circuit diagram valve audio amplifier circuit diagram 676 BGA package tray extra bass circuit

    JEDEC Jc-11 free

    Abstract: PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip Amkor CSP mold compound Amkor Wafer level mold compound 0.65mm pitch BGA mold cap
    Text: LAMINATE data sheet Package on Package PoP Family Bottom PoP Technologies: Features: After three years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA platform in the 4th quarter of 2004. The next four years saw many new


    Original     		PDF wirebon00 JEDEC Jc-11 free PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip Amkor CSP mold compound Amkor Wafer level mold compound 0.65mm pitch BGA mold cap

    fcBGA PACKAGE thermal resistance

    Abstract: FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise
    Text: FCBGA Flip Chip Ball Grid Array "Leading Future PKG Technology" NEC FCBGA Contents 1. What is an FCBGA? . 3 2. Advantages . 4 3. Line up . 5


    Original     		PDF C13902EJ1V0PF00 fcBGA PACKAGE thermal resistance FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise

    transistor nec 8772

    Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 transistor nec 8772 nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry

    transistor nec 8772

    Abstract: NXR-1400 FXS-160 nec 8772 nec 8772 transistor nicolet nxr1400 8772 P Epoxy, glass laminate 2SB444 nec 7912
    Text: Freescale Semiconductor, Inc. MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005


    Original     		PDF AN1231/D AN1231 transistor nec 8772 NXR-1400 FXS-160 nec 8772 nec 8772 transistor nicolet nxr1400 8772 P Epoxy, glass laminate 2SB444 nec 7912

    NXR-1400

    Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 AN1231/D* NXR-1400 nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG112 UG072, UG075, XAPP427, BFG95

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    MC0628R

    Abstract: 40373 74hc14n equivalent 4046 application note philips HCF4060BE HCF4017BE SN74121 application note MC74HC373DW mc0628 HCF4053BE
    Text: R E L I A B L E . L O G I C . I N N O V A T I O N . Logic Cross-Reference Logic Cross-Reference 2003 Texas Instruments Printed in the U.S.A. by Texoma Business Forms, Durant, Oklahoma Printed on recycled paper. SCYB017A NEW First Revision Logic Cross-Reference


    Original     		PDF SCYB017A T74ALVC32374 74CBTLV16211 SN74CBTD16211 SN74SSTV16859 SN74CBTLV16211GRDR SN74ALVC16245AGRDR -SN74SSTV16859GKER MC0628R 40373 74hc14n equivalent 4046 application note philips HCF4060BE HCF4017BE SN74121 application note MC74HC373DW mc0628 HCF4053BE

    LE79Q2281

    Abstract: 1N6761-1 2N2369AU 2N2907AUB BR17 datasheet transistor SI 6822 Dimming LED aplications Dimming LED Driver aplications GC4600 IC ZL70572
    Text: Product Portfolio 2013-2014 ng-edge Embed Power Matters. About Microsemi Microsemi Corporation is a leading provider of semiconductor solutions differentiated by power, security, reliability and performance. The company concentrates on providing solutions for applications where power matters, security


    Original     		PDF

    MT 5388 BGA

    Abstract: Broadcom 7019 BTS 6000 ericsson alcatel 1511 mux mobile switching center msc ericsson bts 6000 2x4 TTL demultiplexer cisco 2801 ericsson bts Technical specification alcatel 1511
    Text: IDT Product Selector Guide Accelerated Thinking SM Table of Contents Integrated Processors Flow-Control Management Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13


    Original     		PDF 12-03/DS/DL/BAY/10K CORP-PSG-00123 MT 5388 BGA Broadcom 7019 BTS 6000 ericsson alcatel 1511 mux mobile switching center msc ericsson bts 6000 2x4 TTL demultiplexer cisco 2801 ericsson bts Technical specification alcatel 1511

    interfacing cpld xc9572 with keyboard

    Abstract: VERIFY 93K template 34992 XC95288XL evaluation board schematic XCR3032C XcxxX xilinx logicore core dds XC2S15-VQ100 creative labs model 3400 FXS-100
    Text: The Programmable Logic Data Book 2000 R R , XC2064, NeoCAD PRISM, XILINX Block Letters , XC-DS501, NeoROUTE, XC3090, FPGA Architect, XC4005, FPGA Foundry, XC5210, Timing Wizard, NeoCAD, TRACE, NeoCAD EPIC, XACT are registered trademarks of Xilinx, Inc. , all XC-prefix product designations, AllianceCore, Alliance Series, BITA, CLC, Configurable Logic Cell, CoolRunner, Dual Block, EZTag, Fast CLK, FastCONNECT,


    Original     		PDF XC2064, XC-DS501, XC3090, XC4005, XC5210, interfacing cpld xc9572 with keyboard VERIFY 93K template 34992 XC95288XL evaluation board schematic XCR3032C XcxxX xilinx logicore core dds XC2S15-VQ100 creative labs model 3400 FXS-100

    Untitled

    Abstract: No abstract text available
    Text: NRND: Not recommended for new designs. TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S6537 Microcontroller D ATA SHE E T D S -LM3S 6537 - 1 2 7 4 6 . 2 5 1 5 S P M S 131H C o p yri g h t 2 0 07-2012 Te xa s In stru me n ts In co rporated


    Original     		PDF LM3S6537

    Untitled

    Abstract: No abstract text available
    Text: T E X A S I N S T R U M E N T S - P R O D U C T I ON D ATA Stellaris LM3S6537 Microcontroller DATA SH E E T DS - LM 3S 6537 -1 2 7 4 6 .2 5 1 5 S P M S 131H C opyri ght 2007- 2012 Texas Instruments Incorpor at ed Copyright Copyright © 2007-2012 Texas Instruments Incorporated All rights reserved. Stellaris and StellarisWare® are registered trademarks of Texas Instruments


    Original     		PDF LM3S6537

    REGULATOR IC 8212

    Abstract: wireless current sensor 438be
    Text: TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S6537 Microcontroller D ATA SHE E T D S -LM3S 6537 - 1 2 7 4 6 . 2 5 1 5 S P M S 131H C o p yri g h t 2 0 07-2012 Te xa s In stru me n ts In co rporated Copyright Copyright © 2007-2012 Texas Instruments Incorporated All rights reserved. Stellaris and StellarisWare® are registered trademarks of Texas Instruments


    Original     		PDF LM3S6537 REGULATOR IC 8212 wireless current sensor 438be

    Untitled

    Abstract: No abstract text available
    Text: NRND: Not recommended for new designs. TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S6537 Microcontroller D ATA SHE E T D S -LM3S 6537 - 1 2 7 4 6 . 2 5 1 5 S P M S 131H C o p yri g h t 2 0 07-2012 Te xa s In stru me n ts In co rporated


    Original     		PDF LM3S6537