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    676 BGA PACKAGE TRAY Search Results

    676 BGA PACKAGE TRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    676 BGA PACKAGE TRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    E700G

    Abstract: No abstract text available
    Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF DS577G E700G

    transistor nec 8772

    Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 transistor nec 8772 nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry

    NXR-1400

    Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 AN1231/D* NXR-1400 nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG112 UG072, UG075, XAPP427, BFG95

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    MC0628R

    Abstract: 40373 74hc14n equivalent 4046 application note philips HCF4060BE HCF4017BE SN74121 application note MC74HC373DW mc0628 HCF4053BE
    Text: R E L I A B L E . L O G I C . I N N O V A T I O N . Logic Cross-Reference Logic Cross-Reference 2003 Texas Instruments Printed in the U.S.A. by Texoma Business Forms, Durant, Oklahoma Printed on recycled paper. SCYB017A NEW First Revision Logic Cross-Reference


    Original     		PDF SCYB017A T74ALVC32374 74CBTLV16211 SN74CBTD16211 SN74SSTV16859 SN74CBTLV16211GRDR SN74ALVC16245AGRDR -SN74SSTV16859GKER MC0628R 40373 74hc14n equivalent 4046 application note philips HCF4060BE HCF4017BE SN74121 application note MC74HC373DW mc0628 HCF4053BE

    LE79Q2281

    Abstract: 1N6761-1 2N2369AU 2N2907AUB BR17 datasheet transistor SI 6822 Dimming LED aplications Dimming LED Driver aplications GC4600 IC ZL70572
    Text: Product Portfolio 2013-2014 ng-edge Embed Power Matters. About Microsemi Microsemi Corporation is a leading provider of semiconductor solutions differentiated by power, security, reliability and performance. The company concentrates on providing solutions for applications where power matters, security


    Original     		PDF

    MT 5388 BGA

    Abstract: Broadcom 7019 BTS 6000 ericsson alcatel 1511 mux mobile switching center msc ericsson bts 6000 2x4 TTL demultiplexer cisco 2801 ericsson bts Technical specification alcatel 1511
    Text: IDT Product Selector Guide Accelerated Thinking SM Table of Contents Integrated Processors Flow-Control Management Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13


    Original     		PDF 12-03/DS/DL/BAY/10K CORP-PSG-00123 MT 5388 BGA Broadcom 7019 BTS 6000 ericsson alcatel 1511 mux mobile switching center msc ericsson bts 6000 2x4 TTL demultiplexer cisco 2801 ericsson bts Technical specification alcatel 1511

    Untitled

    Abstract: No abstract text available
    Text: T E X A S I N S T R U M E N T S - P R O D U C T I ON D ATA Stellaris LM3S6537 Microcontroller DATA SH E E T DS - LM 3S 6537 -1 2 7 4 6 .2 5 1 5 S P M S 131H C opyri ght 2007- 2012 Texas Instruments Incorpor at ed Copyright Copyright © 2007-2012 Texas Instruments Incorporated All rights reserved. Stellaris and StellarisWare® are registered trademarks of Texas Instruments


    Original     		PDF LM3S6537

    REGULATOR IC 8212

    Abstract: wireless current sensor 438be
    Text: TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S6537 Microcontroller D ATA SHE E T D S -LM3S 6537 - 1 2 7 4 6 . 2 5 1 5 S P M S 131H C o p yri g h t 2 0 07-2012 Te xa s In stru me n ts In co rporated Copyright Copyright © 2007-2012 Texas Instruments Incorporated All rights reserved. Stellaris and StellarisWare® are registered trademarks of Texas Instruments


    Original     		PDF LM3S6537 REGULATOR IC 8212 wireless current sensor 438be

    SERVICE MANUAL OF FLUKE 175

    Abstract: SHARP IC 701 I X11 dot led display large size with circuit diagram IR power mosfet switching power supply The 555 Timer Applications Sourcebook interfacing cpld xc9572 with keyboard distributed control system of power plant 100352 XC3090-100PG175 xc95144 pinout
    Text: R , XILINX, XACT, XC2064, XC3090, XC4005, XC-DS501, FPGA Architect, FPGA Foundry, NeoCAD, NeoCAD EPIC, NeoCAD PRISM, NeoROUTE, Plus Logic, Plustran, P+, Timing Wizard, and TRACE are registered trademarks of Xilinx, Inc. , all XC-prefix product designations, XACTstep, XACTstep Advanced, XACTstep Foundry, XACT-Floorplanner,


    Original     		PDF XC2064, XC3090, XC4005, XC-DS501, SERVICE MANUAL OF FLUKE 175 SHARP IC 701 I X11 dot led display large size with circuit diagram IR power mosfet switching power supply The 555 Timer Applications Sourcebook interfacing cpld xc9572 with keyboard distributed control system of power plant 100352 XC3090-100PG175 xc95144 pinout

    Untitled

    Abstract: No abstract text available
    Text: T E X A S I N S T R U M E N T S - P R O D U C T I ON D ATA Stellaris LM3S1F11 Microcontroller DATA SH E E T DS - LM 3S 1F 11 -11 4 2 5 C opyri ght 2007- 2012 Texas Instruments Incorpor at ed Copyright Copyright © 2007-2012 Texas Instruments Incorporated All rights reserved. Stellaris and StellarisWare® are registered trademarks of Texas Instruments


    Original     		PDF LM3S1F11

    Untitled

    Abstract: No abstract text available
    Text: NRND: Not recommended for new designs. TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S1H11 Microcontroller D ATA SHE E T D S -LM3S 1H 11 - 1 3 4 4 0 . 2 5 4 9 S P M S 235B C o p yri g h t 2 0 07-2012 Te xa s In stru me n ts In co rporated


    Original     		PDF LM3S1H11

    Untitled

    Abstract: No abstract text available
    Text: NRND: Not recommended for new designs. TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S1C21 Microcontroller D ATA SHE E T D S -LM3S 1C 21 - 1 3 4 4 0 . 2 5 4 9 S P M S 275B C o p yri g h t 2 0 07-2012 Te xa s In stru me n ts In co rporated


    Original     		PDF LM3S1C21

    Untitled

    Abstract: No abstract text available
    Text: NRND: Not recommended for new designs. TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S1H11 Microcontroller D ATA SHE E T D S -LM3S 1H 11 - 1 3 4 4 0 . 2 5 4 9 S P M S 235B C o p yri g h t 2 0 07-2012 Te xa s In stru me n ts In co rporated


    Original     		PDF LM3S1H11

    Untitled

    Abstract: No abstract text available
    Text: NRND: Not recommended for new designs. TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S1H11 Microcontroller D ATA SHE E T D S -LM3S 1H 11 - 1 3 4 4 0 . 2 5 4 9 S P M S 235B C o p yri g h t 2 0 07-2012 Te xa s In stru me n ts In co rporated


    Original     		PDF LM3S1H11

    usb eeprom programmer simple schematic

    Abstract: No abstract text available
    Text: NRND: Not recommended for new designs. TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S1D21 Microcontroller D ATA SHE E T D S -LM3S 1D 21 - 1 3 4 4 0 . 2 5 4 9 S P M S 264B C o p yri g h t 2 0 07-2012 Te xa s In stru me n ts In co rporated


    Original     		PDF LM3S1D21 usb eeprom programmer simple schematic

    Untitled

    Abstract: No abstract text available
    Text: NRND: Not recommended for new designs. TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S1C21 Microcontroller D ATA SHE E T D S -LM3S 1C 21 - 1 3 4 4 0 . 2 5 4 9 S P M S 275B C o p yri g h t 2 0 07-2012 Te xa s In stru me n ts In co rporated


    Original     		PDF LM3S1C21

    Untitled

    Abstract: No abstract text available
    Text: NRND: Not recommended for new designs. TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S1D21 Microcontroller D ATA SHE E T D S -LM3S 1D 21 - 1 3 4 4 0 . 2 5 4 9 S P M S 264B C o p yri g h t 2 0 07-2012 Te xa s In stru me n ts In co rporated


    Original     		PDF LM3S1D21

    Untitled

    Abstract: No abstract text available
    Text: NRND: Not recommended for new designs. TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S1H11 Microcontroller D ATA SHE E T D S -LM3S 1H 11 - 1 3 4 4 0 . 2 5 4 9 S P M S 235B C o p yri g h t 2 0 07-2012 Te xa s In stru me n ts In co rporated


    Original     		PDF LM3S1H11

    Untitled

    Abstract: No abstract text available
    Text: OMAP3515/03 Applications Processor www.ti.com SPRS505C – FEBRUARY 2008 – REVISED FEBRUARY 2009 1 OMAP3515/03 Applications Processor • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • 600-MHz ARM Cortex™-A8 Core


    Original     		PDF OMAP3515/03 SPRS505C 600-MHz OMAP3515

    cbb60

    Abstract: ic 6116 ram
    Text: OMAP3515/03 Applications Processor www.ti.com SPRS505C – FEBRUARY 2008 – REVISED FEBRUARY 2009 1 OMAP3515/03 Applications Processor • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • 600-MHz ARM Cortex™-A8 Core


    Original     		PDF OMAP3515/03 SPRS505C 600-MHz OMAP3515 cbb60 ic 6116 ram