68 LEAD CQFJ Search Results

Contextual Info: WE256K32-XG2TXE HI-RELIABILITY PRODUCT 256Kx32 EEPROM MODULE PRELIMINARY* FEATURES • Access Times of 150, 200, 250, 300ns ■ Packaging: • 68 lead, Hermetic CQFP G2T , 22.4mm (0.880") square, 4.57mm (0.180") high (Package 509). Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 1)

acs150

Contextual Info: WE128K32-XG2TXE HI-RELIABILITY PRODUCT 128Kx32 EEPROM MODULE ADVANCED* FEATURES • Access Times of 150, 200, 250, 300ns ■ Packaging: • 68 lead, Hermetic CQFP G2T , 22.4mm (0.880") square, 4.57mm (0.180") high (Package 509). Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 1)

WS128K32-XG2TXE

Contextual Info: White Electronic Designs WS128K32-XG2TXE ADVANCED* 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT FEATURES „ Access Times of 35, 45, 55ns „ TTL Compatible Inputs and Outputs „ Packaging • 68 lead, 22.4mm CQFP G2T , 4.57mm (0.180"), (Package 509)

WF4M32-XXX5

Contextual Info: White Electronic Designs WF4M32-XXX5 PRELIMINARY* 4Mx32 5V FLASH MODULE FEATURES Access Times of 100, 120, 150ns Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . • 68 lead, 40mm Low Profile CQFP (Package 502), 3.5mm (0.140") height.

WS128K32-XG2TXE

Contextual Info: White Electronic Designs WS128K32-XG2TXE ADVANCED* 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT FEATURES Access Times of 35, 45, 55ns TTL Compatible Inputs and Outputs Packaging • 68 lead, 22.4mm CQFP G2T , 4.57mm (0.180"), (Package 509) Built in Decoupling Caps and Multiple Ground Pins

WF4M32-XXX5

Contextual Info: WF4M32-XXX5 White Electronic Designs PRELIMINARY* 4Mx32 5V FLASH MODULE FEATURES „ „ „ „ „ Access Times of 100, 120, 150ns Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . • 68 lead, 40mm Low Profile CQFP (Package

O28 Package

Contextual Info: WS128K32-15XX 128Kx32 SRAM MODULE ADVANCED* FEATURES • Access Times of 15nS ■ Packaging • 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic HIP Package 400 • 68 lead, 40mm Low Profile CQFP, 3.5mm (0.140") (Package 502), Package to be developed

Contextual Info: WS128K32-XG2TXE ADVANCED* 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT FEATURES  Built in Decoupling Caps and Multiple Ground Pins for Low Noise Operation  Access Times of 35, 45, 55ns  Packaging • 68 lead, 22.4mm CQFP G2T , 4.57mm (0.180"),

WF2M32-XXX5

Contextual Info: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square

WS128K32-XG2TXE

Contextual Info: WS128K32-XG2TXE HI-RELIABILITY PRODUCT 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLERANT FEATURES • 5 Volt Power Supply ■ Access Times of 35, 45, 55ns ■ Packaging • 68 lead, 22.4mm CQFP G2T , 4.57mm (0.180"), (Package 509) ■ Organized as 128Kx32; User Configurable as 256Kx16

WF1M32B-XXX3

Contextual Info: a WF1M32B-XXX3 WHITE /MICROELECTRONICS 1Mx323.3V FLASH M O DULE PRELIMINARY* FEATURES • Access Times of 100,120, 150ns ■ F&ckaging • 66-pin, PGA Type, 1.185 inch square, Hermetic Ceramic HIP Package 401 • 68 lead, Low Profile CQFP(G2T), 4.6mm (0.180 inch)

Contextual Info: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square

smd A018

Abstract: top mark smd A12 CQFP top mark smd A9 smd A018 3 pin A13 smd Mark A12 SMD smd a7 transistor smd transistor a4 smd transistor A8
Contextual Info: WS512K32-XXX 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 17, 20, 25, 35, 45, 55nS ■ Packaging • 66 pin, PGA Type, 1.385 inch square, Hermetic Ceramic HIP Package 402 , SMD Number 5962-94611 • 68 lead, 40mm Hermetic Low Capacitance CQFP, 5.1mm

WEDF1M32B-XG2TX5

Abstract: WEDF1M32B-XHX5 WEDF1M32B-XXX5 1m 0880
Contextual Info: WEDF1M32B-XXX5 HI-RELIABILITY PRODUCT 1Mx32 5V FLASH MODULE ADVANCED* FEATURES • ■ ■ ■ ■ ■ ■ Access Times of 70, 90, 120ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 • 68 lead, 22mm Low Profile CQFP, 4.6mm (0.180"),

Contextual Info: WSF512K32V-29G2TX 512KX32 SRAM/FLASH 3.3V MODULE PRELIMINARY* FEATURES FLASH MEMORY FEATURES • Access Times of 25ns SRAM and 90ns (FLASH) ■ 10,000 Erase/Program Cycles ■ Packaging • 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880 inch) square (Package 509) 4.57mm (0.180 inch) height. Designed to fit

WE32K32-XXX

Contextual Info: White Electronic Designs WE32K32-XXX 32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES „ Access Times of 80*, 90, 120, 150ns „ Data Retention at 25°C, 10 Years „ MIL-STD-883 Compliant Devices Available „ Write Endurance, 10,000 Cycles Packaging: „ • 68 lead, Hermetic CQFP G2U , 122.4mm

Contextual Info: WED8LM32513C HI-RELIABILITY PRODUCT 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 15*, 17, 20, 25, 35, 45, 55ns ■ Low Power CMOS ■ Packaging ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation • 68 lead, 23.88mm Low Profile CQFP, 3.56mm 0.140"

Contextual Info: a WE128K32-XG2TXE WHITE /MICROELECTRONICS 128Kx32 EEPROM MODULE ADVANCED* FEATURES • Access Tim es of 150, 200, 250, 300ns ■ Autom atic Page W rite Operation ■ Packaging: ■ Page W rite Cycle Time: 10ms M ax • 68 lead, Herm etic CQFP G2T , 22.4mm (0.880 inch) square,

Contextual Info: a WE128K32-XG2TXE WHITE /MICROELECTRONICS 128Kx32 EEPROM MODULE ADVANCED* FEATURES • Access Tim es of 150, 200, 250, 300ns ■ Autom atic Page W rite Operation ■ Packaging: ■ Page W rite Cycle Time: 10ms M ax • 68 lead, Herm etic CQFP G2T , 22.4mm (0.880 inch) square,

WSF512K32-XXX

Contextual Info: White Electronic Designs WSF512K32-XXX 512KX32 SRAM / FLASH MODULE „ FEATURES „ „ Access Times of 25ns SRAM and 70, 90ns (FLASH) Packaging • 66 pin, PGA Type, 1.385" square HIP, Hermetic Ceramic HIP (Package 402) „ FLASH MEMORY FEATURES „ „ • 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880")

Contextual Info: a WE256K32-XG2TXE WHITE /MICROELECTRONICS 256Kx32 EEPROM MODULE ADVANCED* FEATURES • Access Tim es of 150, 200, 250, 300ns ■ Page W rite Cycle Time: 10ms M ax ■ Packaging: ■ Data Polling for End of W rite Detection • 68 lead, Herm etic CQFP G2T , 22.4mm (0.880 inch) square,

Contextual Info: a WE256K32-XG2TXE WHITE /MICROELECTRONICS 256Kx32 EEPROM MODULE ADVANCED* FEATURES • Access Tim es of 150, 200, 250, 300ns ■ Page W rite Cycle Time: 10ms M ax ■ Packaging: ■ Data Polling for End of W rite Detection • 68 lead, Herm etic CQFP G2T , 22.4mm (0.880 inch) square,

Contextual Info: a WSF128K32V-XG2TX WHITE /MICROELECTRONICS 128Kx32 SRAM/FLASH 3.3V MODULE ADVANCED* FEATURES FLASH M EM ORY FEATURES • Access Times of 25ns SRAM and 120ns (FLASH) ■ 10,000 Erase/Program Cycles ■ Access Times of 25ns (SRAM ) and 90ns (FLASH) ■ • 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880 inch) square

Contextual Info: ç M/HITE /MICROELECTRONICS a 1Mx32 3.3V FLASH MODULE WF1M32B-XXX3 PRELIMINARY* FEATURES • A cce ss Times of 1 0 0 ,1 2 0 ,150ns ■ Packaging ■ • 66-pin, PGA Type, 1.185 inch square, Hermetic Ceramic HIP Package 401 • 68 lead, Low Profile CQFP (G2T), 4.6mm (0.180 inch)