680MB Search Results

VSC6434

Abstract: VSC6433 dckn 59 ITT 6570
Contextual Info: VITESSE SEMICONDUCTOR CORPORATION Preliminary Data Sheet 18 Channel LVDS to ECL Translator 680Mb/s Operation with Re-Timing VSC6433 Features • 17 Data Channels—680Mb/s Operation • 1 Clock Channel—680MHz Operation • Data Retimed with Clock Channel

LVDS Level Translator

Abstract: VSC6434
Contextual Info: VITESSE SEMICONDUCTOR CORPORATION Preliminary Data Sheet 18 Channel ECL to LVDS Translator 680Mb/s Operation with Re-Timing VSC6434 Features • 17 Data Channels—680Mb/s Operation • Supply: 3.3V, +/-5%: -2V, +/-5% • 1 Clock Channel—680MHz Operation

Contextual Info: FRM15U621CU APD PRE-AMPLIFIER MODULE DESCRIPTION The FRM15U621CU is an APD pre-amplifier module fo r 1300 and 1550nm wavelength optical receiver front-end. It contains a planar InGaAs-APD Avalanche Photo-diode and a transimpedance type GaAs pre-amplifier IC.

omega MML400 COUTANT LAMBDA

Abstract: MML200 omega MML400 MML400 MML400X Lambda MML400 MML600 coutant power supply omega mml200 coutant lambda omega
Contextual Info: OMEGA 200-800 SERIES CATEGORY 2 SWITCHED MODE 200-800W SINGLE/MULTI OUTPUT F E AT U R E S • Flexible Modular Design ■ Compact - up to 4W/cu in ■ Over 100 000 possible output configurations ■ Complies with UL, CSA, BSI, BABT.◊ 2 ■ EMC meets EN55022

omega MML400 COUTANT LAMBDA

Abstract: MML200 omega MML400 MML400 omega 400pfc Lambda MML400 coutant power supply coutant lambda omega series omega MML400 e coutant lambda omega
Contextual Info: OMEGA 200-800 SERIES CATEGORY 2 SWITCHED MODE 200-800W SINGLE/MULTI OUTPUT F E AT U R E S • Flexible Modular Design ■ Compact - up to 4W/cu in ■ Over 100 000 possible output configurations ■ Complies with UL, CSA, BSI, BABT.◊ 2 ■ EMC meets EN55022

Contextual Info: FRM138621CU DESCRIPTION The FRM13R621CU is an APD pre-amplifier module for 1300nm wave­ length optical receiver front-end. It contains a planar Ge-APD Avalanche Photodiode and a transimpedance type GaAs pre-amplifier IC. The Ge-APD, having high responsivity, low capacitance and low noise characteristics,

Contextual Info: EIN UNTERNEHMEN VON Roederstein Keramik-Kondensatoren fur die Unterhattungs-Elektronik Ceramic Capacitors for entertainment electronics Keram ische Hochspannungs-Scheibenkondensatonen, Klasse 2 C eram ic high voltage disc capacitors, class 2 Ausfiihrung / Design:

sd 4841 p

Abstract: sd 4841
Contextual Info: A COMPANY OF M O DEL LPE-4841 In d u c to rs S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d F E A TU R ES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled

CMD646

Abstract: smc D - A77 battery CR2032 smc D - A83 RZ26L 82378IB 21172-BA 21172-CA 82378ZB sensor gpr
Contextual Info: AlphaPC 164 Motherboard Digital UNIX User’s Manual Revision/Update Information: This is a new manual. August 1996 Printed in U.S.A. AlphaPC, Digital, Digital Semiconductor, and ThinWire are trademarks of Digital Equipment Corporation. CDC is a registered trademark of Control Data Corporation.

sd 4841 p

Abstract: sd 4841 DALE 100MB 471mb marking 333*A
Contextual Info: A COMPANY OF M O DEL LPE-4841 In d u c to rs S u rfa c e M ount, G apped and U ngapped FE A T U R E S • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints

Contextual Info: MODEL LPE-6855 Inductors S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d FEATURES • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost Qualification data available

Contextual Info: MODEL LPE-5047 Inductors S u rfa c e M o u n t, G a p p e d an d U n g a p p e d FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available

102MB

Contextual Info: M ODEL LPE-4841 Inductors Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost

Contextual Info: TEKTRONIX INC/ TRI ÖUINT ShE S B 6101,218 OODÜîb l 7 M T R O 'T G ig a B it L o g ic 'I l - l l - O 16G072 Transimpedance Amplifier 30 dB Gain / 600 MHz Bandwidth FEATURES • High gain: 30 dB • Broad Bandwidth: DC to 600 MHz typ. >-32 dBm input sensitivity @ 622 Mbit/s & 10'9 BER

Contextual Info: 风 华 高 科 PNS系列 功 率 电 感 PNS SERIES Radial Choke Inductors 特征 FEATURES 高效 率及高 饱和 电流 。 High reliability,efficien cy and saturation. 屏蔽 结构。 M agnetic shielded. 应用APPLICATION： 打印 机/液 晶电视/复印 机

Contextual Info: M ODEL LPE-6562 Inductors Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost Qualification data available

Contextual Info: MODEL LPE-6855 Inductors Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available • Short lead times

sii101ct80

Abstract: Hsync Vsync RGB signal LCD laptop SiI101CT80V360 SiI100 ALL LAPTOP MOTHERBOARD CIRCUIT DIAGRAM 8000TCIP HSYNC GENERATE PIXEL CLOCK laptop motherboard resistors LR2 D13 Silicon Image
Contextual Info: SiI100/SiI101 Datasheet Silicon Image, Inc. Version 1.1 June 1998 SiI/DS-0001-B Silicon Image, Inc. SiI/DS-0001-B Copyright Notice This manual is copyrighted by Silicon Image, Inc. Do not reproduce, transform to any other format, or send/transmit any part

cl 6562

Abstract: o 103na DALE ELECTRONICS 154NA
Contextual Info: A COMPANY M O D EL L P E -6 562 In d u c to rs . a M C OF , Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available

o 103na

Contextual Info: A COMPANY OF M O D EL L P E -5 047 In d u c to rs Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints UL Class B materials + 130°C

Contextual Info: A COMPANY OF M O DEL L P E -5047 In d u c to rs S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d F E A TU R ES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints

LPE-3325

Contextual Info: A COMPANY OF M O DEL L P E -3325 In d u c to rs Surface Mount, Gapped and Ungapped FE A T U R E S • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost

Contextual Info: A COMPANY OF MODEL LPE-6855 Inductors S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d FEATURES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints

Contextual Info: M ODEL LPE-3325 Inductors Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available • Short lead times