68541 Search Results

LT 5265

Abstract: 68142 Vishay MKP certificate 68183 68168 IEC 68-2-63 68534 68239 2222 376 61333 68154
Contextual Info: MKP338 6 Y2 Vishay BCcomponents Interference Suppression Film Capacitors MKP Radial Potted Type FEATURES l 168x12 halfpage l w w • AEC-Q200 qualified h • 7.5 mm to 27.5 mm lead pitch, 15 mm and 10 mm bent back to 7.5 mm, supplied loose in box, taped on ammopack or reel

LT 5265

Abstract: BFC2 IEC 68384 67182 68234 6852 68558 e 63822 MKP 338 X 2 CSA-C22
Contextual Info: MKP 338 6 Y2 Vishay BCcomponents Interference Suppression Film Capacitors MKP Radial Potted Type l 168x12 halfpage l w FEATURES w h 7.5 to 27.5 mm lead pitch, 15 mm and 10 mm bent back to 7.5 mm, supplied loose in box, taped on ammopack or reel RoHS-compliant product

Film Capacitors

Abstract: cx 23102 mkt 344 hq capacitor mkt 344 MKT 344 ic 40154 MKT 1840 ic 565 aplication CF 70124 MKP 376
Contextual Info: VISHAY I N T E R T E C H N O L O G Y , I N C . INTERACTIVE data book Vishay film capacitors vishay vse-db0110-0901 Notes: 1. To navigate: a Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents

Contextual Info: SMD 627A Declaration Component Weight in gms 0.270 Weight unit :gm CAS No. 0.079525 1344-28-1 7631-86-9 1309-48-4 Compostion Weight in gms % by weight 0.0763436 96 0.0025448 3.2 0.0003499 0.44 0.0002863 0.36 Component Alumina Substrate Material Alumina Constitiuent

Contextual Info: SMD 628B Declaration Component Weight in gms 0.30931 Weight unit :gm CAS No. 0.091080 1344-28-1 7631-86-9 1309-48-4 Compostion Weight in gms % by weight 0.0874368 96 0.0029146 3.2 0.0004008 0.44 0.0003279 0.36 Component Alumina Substrate Material Alumina

68481

Abstract: BFC2 338 68105 68502 BFC2 338 60333 68234 CSA-C22 E109565 E112471 EN132400 68207
Contextual Info: MKP 338 6 Y2 Vishay BCcomponents Interference Suppression Film Capacitors MKP Radial Potted Type FEATURES l 168x12 halfpage l w 7.5 to 27.5 mm lead pitch. Supplied loose in box, taped on ammopack or reel w h h h' F' lt P ¯dt e3 Lead (Pb)-free product (1)

sac305

Abstract: G770* sumitomo ABL-2100A G770J 2100a epoxy G770 sumitomo epoxy HSBGA VSC452XHW-02 secret
Contextual Info: Package Material Composition and Mass Calculation Customer:Vitesse Package:23x23 HSBGA Device Type:VSC452XHW-02 Die Size: 7100 X 7300 um Total Pck. Weight g : 2675.785 Provided By: Gerry Alamillo Date: 2007/08/14 name Mold Compound Substrate Silicon Die Attach

TISP2290 BOURNS

Abstract: TISP2290-S TISP2290-S BOURNS TISP2290 3050B TIP107-S TRANSISTOR 3052 leadframe to-220
Contextual Info: MATERIAL DECLARATION SHEET TO-220 Package Type Product Line TSP Transistors & Thyristors Compliance Date November 30, 2004 RoHS Compliant Yes (-S suffix) MSL N/A Bourns TISP and Transistor products complying with RoHS legislation are identified with a “-S ” suffix in the part number e.g. TISP2290-S or TIP107-S.

CD0603

Contextual Info: MATERIAL DECLARATION SHEET Material Number CD0603 Series Product Line Diode Products Compliance Date 1 Jan 2005 RoHS Compliant Yes No. 1 2 3 4 5 Construction Element subpart FR-5 BOARD Wafer Al Wire Silver paste Molding Compound Headquarters Riverside CA

Contextual Info: SMD 628A Declaration Component Weight in gms 0.30897 Weight unit :gm CAS No. 0.091080 1344-28-1 7631-86-9 1309-48-4 Compostion Weight in gms % by weight 0.0874368 96 0.0029146 3.2 0.0004008 0.44 0.0003279 0.36 Component Alumina Substrate Material Alumina

IEC 68-2-18

Abstract: IEC 68384 Vishay MKP certificate 68527 68558 BFC2 338 68105 e 63822 MKP 381 68234 68508
Contextual Info: MKP 338 6 Y2 Vishay BCcomponents Interference Suppression Film Capacitors MKP Radial Potted Type l 168x12 halfpage l w h FEATURES w 7.5 to 27.5 mm lead pitch, 15 mm and 10 mm bent back to 7.5 mm, supplied loose in box, taped on ammopack or reel RoHS compliant product

Analog Devices model 233J

Abstract: alfa uv API 45 AD0042C AC1007 analog devices TSDC1610 AD504 fetal monitor device circuit diagrams AD533J Helitrim AD 233J
Contextual Info: ANALOG DEVICES PRODUCT GUIDE Copyright 1975 by Analog Devices, Inc. FOREWORD This book is a guide to the broadest range of electronic compo­ nents and devices needed by designers of instrumentation and control systems which accept, analyze, process, convert, trans­

AL-10MR-A

Abstract: AL-20MR-D AL-232CAB mitsubishi al-20mr-d mitsubishi al-6mr-a software AL-6MR-A mitsubishi electric al-20mr-a 232CAB AL-10MR-D AL-20MT-D
Contextual Info: MITSUBISHI ELECTRIC Programmierbare Steuerungen 4,0 6,0 + - A (B) 1 2 3 POWER DC24V 4 5 6 IN 7 8 9 10 11 12 DC INPUT MITSUBISHI ESC 90,0 + - ALPHA OK AL-20MR-D 4,0 RELAY OUTPUT OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 OUT8 6,0 55,0 124,6 OUT1 OUT2 OUT3 OUT4 +

am3 socket pin diagram

Abstract: CDA10.7mg murata ACFA-450L08 LA1823 450L08 SK107M socket AM3 pin diagram AM antenna coil LA1823 FM SFU450
Contextual Info: Ordering number : ENN*6854 _ Monolithic Linear 1C LA 1823 Single-Chip Tuner IC for Use in Radio Cassette Recorder Preliminary Overview Package Dimensions The LA 1823 is a single-chip tuner IC that incorporates FM/AM and MPX circuits and supports electronic tuning.

sgm 8905

Abstract: 3302 81A ir 3302 81A alcan joint compound snapdragon AKO 546 687 burglar alarm system abstract walkie talkie circuit diagram ZENER DIODES DZ 8407 tea 1601 t
Contextual Info: December 19, 2000 Preface to the 13th Edition The Harmonized Tariff Schedule of the United States, Annotated for Statistical Reporting Purposes HTS 2001 is being published pursuant to section 1207 of the Omnibus Trade and Competitiveness Act of 1988 (P.L.

Contextual Info: Reportable Substances in Components Package Type : Component Weight : SSOP 5.3mm Body Document No : Lead #: 16 Process Type : No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Spot Silver Plating Silver Die Attach Epoxy Gold Wire External Lead Plating

Contextual Info: SMD 627B Declaration Component Weight in gms 0.270 Weight unit :gm CAS No. 0.079525 1344-28-1 7631-86-9 1309-48-4 Compostion Weight in gms % by weight 0.0763436 96 0.0025448 3.2 0.0003499 0.44 0.0002863 0.36 Component Alumina Substrate Material Alumina Constitiuent

bfc233860

Abstract: 68239 68548 BFC2 338 60333 IEC 68-2-18
Contextual Info: MKP 338 6 Y2 Vishay BCcomponents Interference Suppression Film Capacitors MKP Radial Potted Type FEATURES l 168x12 halfpage l w h w 7.5 to 27.5 mm lead pitch, 15 mm and 10 mm bent back to 7.5 mm, supplied loose in box, taped on ammopack or reel RoHS-compliant product

LA1823

Abstract: sumida FM cda10.7MG1 MURATA MW LA1823 FM 3067B DIP24S MFP24S SFU450B murata
Contextual Info: 注文コード No. N 6 8 5 4 A LA1823 LA1823M モノリシックリニア集積回路ファンモータ用 ラジオカセット用 1 チップチューナ IC 概要 は内蔵化に

Contextual Info: 100% Material Declaration Data Sheet for FG456 Package PK154 v1.4 August 24, 2012 Average Weight: 2.0021 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3 100.00 Use in Product

IEC 68384

Abstract: 68522 IEC 68-2-18 IEC 68-2-63 LT 5265 68239 68558 68548 MKP338 6 Y2
Contextual Info: MKP338 6 Y2 Vishay BCcomponents Interference Suppression Film Capacitors MKP Radial Potted Type FEATURES l 168x12 halfpage l w w • AEC-Q200 qualified h • 7.5 mm to 27.5 mm lead pitch, 15 mm and 10 mm bent back to 7.5 mm, supplied loose in box, taped on ammopack or reel

a 68063

Abstract: 67423 68063 69171 69093 69561 67623 69653 E73571 69313
Contextual Info: 62000-69000 SERIES POWER DISTRIBUTION BLOCKS VERSATILE POWER DISTRIBUTION BLOCKS FOR CABLE TERMINATIONS Ferraz Shawmut Power Distribution Blocks afford a safe, convenient way of splicing cables, splitting primary power into a variety of secondary circuits or providing a fixed junction tap-off point. Power

FLUKE 8840a specification

Abstract: FLUKE 8840a 700013 Y8101 capacitor IH 104j FLUKE 83RF PROBE FLUKE 79 series II multimeter diagram 40 HMR 20 EQUIVALENT 40 RB 120 8840A instruction manual U804
Contextual Info: DIGITAL MULTIMETER Instruction Manual FLUKE. 8840A DIGITAL MULTIMETER Instruction Manual PN 879304 December 1991 Rev. 2, 4/94 1994 Fluke Corporation. All rights reserved. Printed in U.S.A. All product names are trademarks of their respective companies FLUKE

3050B

Abstract: TISP4C250H3BJR-S SMB Package
Contextual Info: MATERIAL DECLARATION SHEET SMB Package Type DO-214AA Product Line TSP (Transistors & Thyristors) Compliance Date November 30, 2004 RoHS Compliant Yes (-S suffix) MSL 1 Bourns TISP products complying with RoHS legislation are identified with a “-S ” suffix in the component part number e.g. TISP4C250H3BJR-S.