|
2SA1162
|
|
Toshiba Electronic Devices & Storage Corporation
|
PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346 |
|
|
|
54122-116262500LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 26 position, 2.54mm (0.100in) pitch |
|
|
|
131-7116-21D
|
|
Amphenol Communications Solutions
|
Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate. |
|
|
|
131-6116-21H
|
|
Amphenol Communications Solutions
|
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP. |
|
|
|
77311-162-09LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch. |
|
|
