7453 IC Search Results

Contextual Info: DATE REV ECN APP’D. BY 1/25/06 A4 7453 JM 0.O96[2.44]{2 .450[11.43] ,247[6.27] 2) 1 TOEDu •POSITION #1 |— - ,600[15.24]-— I B B 1.082[ 27.48] - NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY

Contextual Info: DATE REV ECN APP’D. BY 1/25/06 A4 7453 JM 1.310[33.27] •870[22.10] Telili ifiirtS ^ 1 V ^ i .370[9.40] .2A 7[6.27j2 . . N; L ■POSITION #1 B B 1.082[27.48] NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY

15pFMIN

Abstract: DB3B-C transistor logic 74H
Contextual Info: NATIONA L SEMICOND -CLOGIO DEE D | t.SG1125 DObBbTB ? | _ Y~ 53 CONNECTION DIAGRAMS PINOUT A 54/7453 54H/74H53 EXPANDABLE 4-WIDE, 2-INPUT AOI GATE. ’53 EXPANDABLE 2-2-2-3-INPUT AOI GATE (’H53) ORDERING CODE: See Section 9 PIN PKGS COMMERCIAL GRADE

Contextual Info: DATE REV 1/25/06 ECN A4 7453 JM 4/11/06 A5 7579 TRM APP'D. BY B .275 [6.99] -.050 [1.27] 025 [.635]_0.045 [1.14] 6 .235 [5.97] 100 [2.54] NOTES: .100 [2.54] 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: .600 [15.24] COPPER ALLOY

Contextual Info: DATE REV ECN 1/25/06 A4 7453 JM 4/11/06 A5 7579 TRM APP'D. BY .805 [20.45] -.090 [2.29] B GOLD PLATED OVERALL NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 SHIELD: DIE CAST ALLOY CONTACTS: COPPER ALLOY SHIELD PLATING: TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

Contextual Info: -.650 [16.51]- DATE REV ECN 1/25/06 A5 7453 JM 4/11/06 A6 7579 TRM APP’D. BY -.805 [20.45]- B .430 [10.92] □ NOTES: .650 [16.51] 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 SHIELD: DIE CAST ALLOY CONTACTS: COPPER ALLOY -T ^ ^ n DIMENSIONS FOR KEY-1

Contextual Info: DATE REV ECN APP’D. BY 1/25/06 A4 7453 JM .805[20.45] H h- -100[2.54] ±.010[0.25] 7 •090[2.29] GROUND POST .370[9.40] PLASTIC SNAP ■ LOCATOR (2) B .012x.025[0.30x0.64] PH -BR CONTACTS: GOLD PLATED OVERALL 1 <> \ B -076[1.93] NOTES: 1. CONNECTOR MATERIALS:

overcurrent relay inverse normal curves

Abstract: RXvea asea relay RI asea ri 5A relay ASEA relay - unbalance relay rxief2h sr-flip-flop W2-300 induction heating oscillator circuit 50 mva transformer
Contextual Info: Jnta-No. INFORMATION EX 642-300 E RFR, November 1981 Edition 3 7453 froiW D fiW Fieg, Page 1 Motor Protection Type RAMPA List of contents Section Title Page 1 2 3 4 5 6 GENERAL INPUT CIRCUITRY OVERLOAD RELAY OVERCURRENT RELAY EAH.TH-MULT RELAY NEGATIVE SEQUENCE RELAY

Contextual Info: DATE REV 1/25/06 ECN A5 7453 JM 4/11/06 A6 7579 TRM APP'D. BY .125 [3.18] .090 [2.29] .430 [10.92] B B .125 ±.010 [3.18 ±0.25] GROUND POST PLASTIC SNAP LOCATOR 2 .012x.025 [0.30x0.64] P H -B R CONTACTS: GOLD PLATED OVERALL NOTES: 1. CONNECTOR MATERIALS:

Contextual Info: DATE REV ECN 1/25/06 A4 7453 JM 4/11/06 A5 7579 TRM APP’D. BY .805 [20.4] — -| |— — .090 [2.29] .090 [2.29] .370 [9.40] GROUND POST 2 B PLASTIC SNAP LOCATOR (2) B 125 ±.010 [3.18 ±0.25] .012x.025 [0.30x0.64] PH -BR CONTACTS: GOLD PLATED OVERALL

15X15

Contextual Info: - 1.100 DATE REV ECN 1/25/06 A6 7453 JM 4/11/06 A7 7579 TRM APP’D. BY - [27.94] .125 ±.010 [3.18 ±0.25] B B GROUND POST 2 PLASTIC SNAP LOCATOR (2) .210 .012X.025 [0.30x0.64] .170 PH-BR CONTACTS: GOLD PLATED OVERALL .110 .210 .170 .130 .070 .090 .030

Contextual Info: DATE REV ECN 1/25/06 A4 7453 JM 4/11/06 A5 7579 TRM APP'D. BY 0.096 [2.44] 2 .450 [11.43] .247 [6.27] (2) 1 B B .125 [3.18] -.230 .230-.190 . 190- -.110 .1 1 0 - NOTES: -.070 .070- 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 -.030 .0 1 0 -

Contextual Info: DATE REV ECN APP’D. BY 1 -2 6 -0 6 A2 7453 JM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS SEE PR022-01.

7400 fan-out

Abstract: 7402 nor 7491 8-bit 7490 Decade Counter TTL 7400 TTL 7400 AND propagation delay TTL 7400 propagation delay TTL 7475 TTL 7490 7402 J-K Flip-Flop
Contextual Info: Logic Integrateci Circuits, MIC 7400 Series TTL G a te s in order of gates per package Type M IC M IC M IC M IC M IC M IC M IC M IC M IC M IC M IC M IC 7430 7453 7454 7420 7440 7450 7451 7460 7410 7400 7401 7402 Positive logic definition Gates per package

LB30

Contextual Info: DATE REV ECN APP’D. BY 1/25/06 A3 7453 JM -*.780 [19.81]-*.550 [13.97]I ir M TL B o r~> CN B O o in I — *.460 [11.68]— GO CM LOAD BAR SUBASSEMBLY 670606—LB30—19/S NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY

6X6C

Contextual Info: DATE REV ECN APP’D. BY 1/25 /0 6 A6 7453 JM - .6 5 0 [16.51] MB h -i U H .125Ì.010 [3.18±0.25] POSITION #1 B U - .3 5 0 — A ' [8.89] ' GROUND POST B PLASTIC SNAP LOCATOR 2 .012x.025 [0.30x0.64] PH-BR CONTACTS: GOLD PLATED OVERALL —0 NOTES: □ (

Contextual Info: DATE 1 1 1 1 -J *= APP’D. BY A6 7453 JM 4/11/06 A7 7579 TRM [2.29] .090 — - .125 .370 [9.40] .090 [2.29] ECN ±0.25] n 125 [3.18] — ±.010 — 0.096 [2.44] 2 [3.18 805 [20.45]- - REV 1/25/06 1 1 B B GROUND POST (2) - .012X.025 [,30x.64]

Contextual Info: DATE REV ECN APP’D. BY 1 /2 5 / 0 6 A4 7453 JM -.870[ 22.10]- c U U U U — Q .370[9.40] .125±.010[3.18±0.25] POSITION #1 |— - ,600[15.24]- — I GROUND POST 2 PLASTIC SNAP LOCATOR (2) B B .012x.025 [0.30x0.64] PH -BR CONTACTS: GOLD PLATED OVERALL

Contextual Info: 1.100 - DATE REV ECN APP’D. BY 1/25/06 A6 7453 JM - [27.94] U U U u u JEUElkjH In T 3 U I.: iD i ^ m P B -.125±.010[3.18±0.25] •POSITION #1 - .800 - B GROUND POST 2 [20.32] PLASTIC SNAP LOCATOR (2) .012x.025 [0.30x0.64] PH -BR CONTACTS: GOLD PLATED OVERALL

Contextual Info: - 1.090[27.69],650[16.51] ♦ .247[6.27] 2 (\KJ -n L LJ _ r " . J B — d REV ECN APP’D. BY A4 7453 JM -.805[20.45]— 0.O96[2.44X2) — — I DATE 1/25/06 .090[2.29] V B •POSITION #1 — I ,350[8.89] |— — NOTES: 1. CONNECTOR MATERIALS:

Contextual Info: DATE REV ECN APP’D. BY 1/25/06 A6 7453 JM 4/11/06 A7 7579 TRM -.7 7 0 — [19.56] — .805— [20.45] - i u H _ . ü*UI¡W^ -POSITION B B -.5 0 0 — [12.70] .770 [19.56] NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 SHIELD: DIE CAST ALLOY

Contextual Info: 2 DATE REV ECN 1/25/06 A6 7453 JM 4/11/06 A7 7579 TRM APP’D. BY — .805— [20.45] — .650— [16.51] -i u H W - POSITION #1 k — .3 5 0 1 B [8.89] .650 [16.51] NOTES: _T ^L 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 SHIELD: DIE CAST ALLOY

Contextual Info: DATE REV 1/25/06 ECN A4 7453 JM 4/11/06 A5 7579 TRM APP’D. BY .805 [20.45]O - . 1 2 5 [3.18] -H .090 [2.29] -H LO CNJ B B IT GROUND POST 2 PLASTIC SNAP LOCATOR (2) 012x.025 [0.30x0.64] P H -B R CONTACTS: GOLD PLATED OVERALL NOTES: 1. CONNECTOR MATERIALS:

SS-611515-LF-P-1-4/6

Abstract: 15X15
Contextual Info: -1.540 [39.12]- DATE REV ECN 1/25/06 A5 7453 JM 4/11/06 A6 7579 TRM APP’D. BY .210 .230 .170 -1.100 [27.94]- .190 .130 U U U U — ET -e - Is f l .110 e .090 .370 [9.40] .030 .090 [2.29] * -1.312 [33.32]PLASTIC SNAP LOCATOR 2 U L U U ♦ : m i £ GROUND POST (2)