765 POWER CHIP Search Results

bq51013ARHL

Abstract: WR-483250-15M2-G HPA689 BQ500210EVM-689 HPA765AEVM SLUU911 BQ51014 Texas Instruments BQTESLA CSD75205W1015 wirelesspower
Contextual Info: User's Guide SLUU911 – June 2012 bq51013AEVM-765 Evaluation Module The bq51013AEVM-765 wireless power receiver evaluation kit from Texas Instruments is a highperformance, easy-to-use development kit for the design of wireless power solutions. Consisting of a 5-V

Contextual Info: User's Guide SLUU911A – June 2012 – Revised October 2012 bq51013AEVM-765 Evaluation Module QFN Package The bq51013AEVM-765 wireless power receiver evaluation kit from Texas Instruments is a highperformance, easy-to-use development kit for the design of wireless power solutions. Consisting of a 5-V

C9011 transistor

Abstract: C9011 SC3423 24 pin 7 segment 4 DIGIT display layout 12 pin 7 segment display layout -LD-5461BS 16 SEGMENT DISPLAY SC3424 SC3425 SC3426 h1331
Contextual Info: Silan Semiconductors SC3423 8-DIGIT CALCULATOR DESCRIPTION The SC3423 is a single-chip LSI CMOS calculator with 8-digit four function arithmetic operations, single memory, extraction of square root and percentage calculation functions, leading zero and trailing

Contextual Info: SC3423 3V,8-DIGIT CALCULATOR CIRCUIT DESCRIPTION The SC3423 is a single-chip LSI CMOS calculator with 8-digit four 46 45 44 43 42 41 40 39 38 37 36 35 47 33 1 32 2 31 3 30 4 29 5 28 6 27 7 8 26 9 25 10 24 11 12 13 14 15 16 17 18 19 20 21 22 23 function arithmetic operations, single memory, extraction of square root

bq 726

Abstract: datasheet 346 766
Contextual Info: FSC Series-Stacked Capacitors Holy Stone Large Size Multilayer Ceramic Chip Capacitors [Large Stacked Capacitors] FSC Series MLCC Design, Suitable for Switchmode Power Supply Filters ‹ Features ‹ Application ‰ High CV MLCC design, effectively can replace Tantalum ‰ Power supplies

Contextual Info: ► ► Micro i Low Profile Chip Inductors Mechanical Configuration Units are epoxy encapsulated. Contact area for reflow are gold plated per MIL-G-45204 Type 1 Grade A. Internal connections are thermal com­ pression bonded. Curre nt Rating at 90°C. AMB. 35°C Rise

Contextual Info: Series 3090 Micro i Low Profile Chip Inductors SERIES 3090 IRON CORE MIL-C-83446 Reference for testing methods only. Mechanical Configuration Units are epoxy encapsulated. Contact area for reflow soldering are gold plated per MIL-G-45204 Type 1 Grade A. Internal

Contextual Info: Series 3090 Micro i Low Profile Chip Inductors SERIES 3090 IRON CORE MIL-C-83446 Reference for testing methods only. Mechanical Configuration Units are epoxy encapsulated. Contact area for reflow soldering are gold plated per MIL-G-45204 Type 1 Grade A. Internal

Contextual Info: IN DU CT AN CE µ TO H LE RA NC E Q MI NI MU M TE ST FR EQ UE SR NC F MI Y (M NI MU Hz DC ) M ( MH MA RES z) XI IST M A CU UM NC (O E R HM MA RE S X. NT (m RA ) A) TI NG DA SH Micro i Low Profile Chip Inductors NU MB ER * 3090R 3090 Series SERIES 3090 IRON CORE

Contextual Info: IN DU CT AN CE µ TO H LE RA NC E Q MI NI MU M TE ST FR EQ UE SR NC F MI Y (M NI MU Hz DC ) M ( MH MA RES z) XI IST M A CU UM NC (O E R HM MA RE S X. NT (m RA ) A) TI NG NU MB ER Micro i Low Profile Chip Inductors PA RT Series 3090 SERIES 3090 IRON CORE

Contextual Info: Series 3090 Micro i Low Profile Chip Inductors Millimeters 1.27 Max. 2.54±.254 2.54±.254 1.27 Min. 0.38 Min. Typ 0.51 Max. (Typ) 0.010 0.015 0.022 0.033 0.039 0.047 0.056 0.068 0.082 0.10 0.12 0.15 0.18 0.22 0.27 0.33 0.39 0.47 0.56 0.68 0.82 1.00 1.20

Contextual Info: IN DU CT AN CE µ TO H LE RA NC E Q MI NI MU M TE ST FR EQ UE SR NC F MI Y (M NI MU Hz DC ) M ( MH MA RES z) XI IST M A CU UM NC (O E R HM MA RE S X. NT (m RA ) A) TI NG DA SH Micro i Low Profile Chip Inductors NU MB ER * 3090R 3090 Series SERIES 3090 IRON CORE

472K

Contextual Info: IN DU CT AN CE µ TO H LE RA NC E Q MI NI MU M TE ST FR EQ UE SR NC F MI Y (M NI MU Hz DC ) M ( MH MA RES z) XI IST M A CU UM NC (O E R HM MA RE S X. NT (m RA ) A) TI NG NU MB ER Micro i Low Profile Chip Inductors PA RT Series 3090 SERIES 3090 IRON CORE

Contextual Info: IN DU CT AN CE µ TO H LE RA NC E Q MI NI MU M TE ST FR EQ UE SR NC F MI Y (M NI MU Hz DC ) M ( MH MA RES z) XI IST M A CU UM NC (O E R HM MA RE S X. NT (m RA ) A) TI NG Micro i Low Profile Chip Inductors PA RT NU MB ER Series 3090 SERIES 3090 IRON CORE

1N5819

Abstract: LT1176 LT1176-5 PE-92102 T-50 dip buck converter
Contextual Info: LT1176/LT1176-5 Step-Down Switching Regulator FEATURES • ■ ■ ■ ■ ■ ■ ■ tion. The power switch, all oscillator and control circuitry, and all current limit components are included on the chip. The topology is a classic positive “buck” configuration but

free circuit diagram of USB modem

Abstract: hfp 730 MT0760 oci 402 bluetooth transmitter receiver circuit diagram free circuit diagram of bluetooth modem MT0765 bluetooth transmitter circuit diagram
Contextual Info: M I C R O T U N E MT0760/765 – BLUETOOTHTM ONECHIP RADIO/BASEBAND SYSTEM-ON-CHIP WITH USB INTERFACE AND FLASH MEMORY BLUETOOTH USB DATA AND VOICE APPLICATIONS Preliminary APPLICATIONS • Desktop and notebook computers • Personal digital assistants

FLR026XV

Contextual Info: FLR026XP, FLR026XV n eP ,. G a A s F E T a n d H E M T Chips r U J I 1b U FEATURES • High Output Power: P-|d B = 23.0dBm Typ. • High Gain: G 1dB = 7.5dB(Typ.)(FLR026XP) G 1dB = 8.5dB(Typ.)(FLR026XV) • High PAE: r\addl = 28%(Typ.)(FLR026XP) *ladd = 29%(Typ.)(FLR026XV)

FLR026XV

Abstract: FLR026XP
Contextual Info: FLR026XP, FLR026XV p | ,<f° GaAs F E T and H E M T Chips rUJIIbU ,. FEATURES • High Output Power: P-|<jB = 23.0dBm Typ. • High Gain: G-j^B = 7.5dB(Typ.)(FLR026XP) G 1dB = 8.5dB(Typ.)(FLR026XV) • High PAE: n adc| = 28%(Typ.)(FLR026XP) il add = 29%(Typ.)(FLR026XV)

8272 floppy disk controller

Abstract: 9229BT 9229B ic 8272 9229T floppy 765 765 fdc FDC9229 FDC9229T
Contextual Info: STANDARD MICROSYSTEMS CORPORATION ,a— FDC 9229T FDC 9229BT FLOPPY DISK INTERFACE CIRCUIT PIN CONFIGURATION FEATURES □ Digital Data Separator Performs complete data separation function for floppy disk drives Separates FM and MFM encoded data No critical adjustments necessary

Contextual Info: STANDARD MICROSYSTEMS CORPORATION, FDC 92C39/92C39B 92C39T/92C39BT PRELIMINARY ENHANCED FLOPPY DISK INTERFACE CIRCUIT FEATURES PIN CONFIGURATION □ Digital Data Separator Performs complete data separation function for floppy disk drives Separates FM and MFM encoded data

8272 floppy disk controller

Abstract: 179X FDC 8272 FDC9229 functions floppy disk controller 8272 FDC92 765A DO07 FDC7265 FDC9239
Contextual Info: ST AN D AR D MICROSYSTEMS bS STANDARD MICROSYSTEMS CORPORATION a s s s s s s s a DE 1 fiSbMbfib 0 D Q37 Û3 □ f T-5 2-3 3 -1 1 FDC 9239/9239B 9239T/9239BT PRELIMINARY ENHANCED FLOPPY DISK INTERFACE CIRCUIT FEATURES PIN CONFIGURATION □ Digital Data S eparator

8272 floppy disk controller

Abstract: functions floppy disk controller 8272 9239BT floppy 765 9239 ic 8272 FDC motor controller
Contextual Info: S T A N D A R D M I C R O S Y S T E M S bS STANDARD MICROSYSTEMS CORPORATION a s s s s s s s a DE 1 fiSbMbfib 0 D Q 3 7 Û 3 □ f T-52-33-11 FDC 9239/9239B 9239T/9239BT PRELIMINARY ENHANCED FLOPPY DISK INTERFACE CIRCUIT FEATURES PIN CONFIGURATION □ Digital Data Separator

CQ 765

Abstract: CQ 637 CQ 818 FLK022
Contextual Info: FLK022XP : FLK022XV GaAs F ET u n dH E M T Chips ELECTRICAL CHARACTERISE CS Amb ent Temperature Ta=25° C Item Symbol Saturated Drain Current IDSS Test Conditions 100 150 mA - 50 - mS -1.0 -2.0 -3.5 V -5 - - V 23 24 - dBm 6 7 - dB - 32 - % VdS = 5V, Ids = 65mA

8272 floppy disk controller

Abstract: floppy disk controller 8272 FDC9229 765 floppy disk controller 765 fdc 9229B 8272 floppy disk motor head step functions floppy disk controller 8272 FDC9229BT
Contextual Info: STANDARD MICROSYSTEMS CORPORATION FDC 9229T FDC 9229BT FLOPPY DISK INTERFACE CIRCUIT PIN CONFIGURATION FEATURES DSKD o qT cl-MIk It— zz X 3 FDCSEL 2 [ n h n n n n i 25 24 23 22 21 20 19 \ MINI 3 [ 18 17 3 EARLY 1 WDIN 16 3 XTAL/CLKIN 15 3 NC 14 3 GND 13 3 CLKOUT