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XPBL-2733B1-10DA
|
|
Amphenol Communications Solutions
|
25G BIDI SFP+ LR I Temp |
|
|
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XPBL-2733B1-10D
|
|
Amphenol Communications Solutions
|
25G BIDI SFP+ LR |
|
|
|
77311-127-33LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch. |
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|
|
77311-427-33LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch. |
|
|
|
77311-827-33LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch. |
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|
