8815 NOR Search Results

N8815

Abstract: 8815 N8885 N8875 S8815 8815A 8885A S8885 S8875 8875A
Contextual Info: S IG N E T IC S DCL 8815 DUAL 4-INPUT NOR GATE 8875 TRIPLE 3-INPUT NOR GATE 8885 QUAD 2-INPUT NOR GATE NTiGBATte» CIRCUITS BASIC C IR C U IT SCHEMATIC The 8815, 8875 and 8885 gates p e r f o r m the logic NOR function for p ositive logic the logic "ONE" is

3M Philippines

Abstract: 3M8815 5591S TW-3M tape 3m vhb TC-2810 E3Z-R81-M1J-10.3M
Contextual Info: Information or Sales Assistance Contact 3M for the experience of 100 years of solutions for your design and production challenges. 3M Thermally Conductive Interface Pads Through innovative 3M technology, these soft and conformable pads provide high levels of conductivity for the more demanding

Contextual Info: RF Radiation Safety Products SMARTS AREA MONITORS • • • • • • 2 MHz to 100 GHz Detection Audible, Visible, Remote Alarms Continuous, Automatic Monitoring Failsafe Requires No Operator Indoor and Outdoor Models DESCRIPTION The Narda SMARTS family of area monitors provides

Contextual Info: SMARTS AREA MONITORS • • • • • • 2 MHz to 100 GHz Detection Audible, Visible, Remote Alarms Continuous, Automatic Monitoring Failsafe Requires No Operator Indoor and Outdoor Models DESCRIPTION The Narda SMARTS family of area monitors provides

CU1100

Abstract: CPR19-19-12U C2525M C1919S C2121M CPR19-19-15U CPR19-19-20U CPR19-19-25U c2929m C2121M cts
Contextual Info: Series CPR Forged Copper Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights

C2121M

Abstract: APR27-27-12CB C2727M APR19-19-12CB APR19-19-15CB APR19-19-20CB APR19-19-25CB C4040T APR35 C2727S
Contextual Info: Series APR Forged Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights

AER25-25-12CB

Abstract: AER19-19-12CB AER19-19-15CB AER19-19-18CB AER19-19-21CB c2525 AER21-21-23CB C1919S C2121M
Contextual Info: Series AER Forged Heat Sinks Technical Data Features • Precision forging technology for high power applications • Omni-directional pins • Designed for BGA and other surface mount packages • Various mounting methods available • Select from multiple fin heights

D 8821

Abstract: 8881 signetics 8827C 8881 NAND 8885/C
Contextual Info: MAXIMUM RATINGS Rating Value Unit Supply Voltage - Vcc 6.0 V Input Voltage 6.0 V 6.0 V -55 to +125 °c - Vin Signetics Integrated Circuits Designer's Choice 8800 Series Output Voltage - Vout Signetics 8800 Series high-speed elements. PACKAGING AVAILABLE See page 87 :

Contextual Info: HI-TEMP FAN HEAT SINK – FEX Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprint 35x35 mm and 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical

Contextual Info: HI-TEMP FAN HEAT SINKS – FHL SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 28.1

Contextual Info: HI-TEMP FAN HEAT SINKS – FHL SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 28.1

8881 NAND

Abstract: U/25/20/TN26/15/850/8881 NAND 8885/C
Contextual Info: MAXIMUM RATINGS Rating SIGNETICS INTEGRATED CIRCUITS Designer's Choice 8800 Series Signetics 8800 Series high-speed elements. FUNCTIONS AND CHARACTERISTICS FUNCTION Value Unit Supply Voltage - Vcc 6.0 V Input Voltage 6.0 V 6.0 V - Vin Output Voltage - Vout

Contextual Info: HI-TEMP FAN HEAT SINK – FHP Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 27x27 mm to 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical

Contextual Info: HI-TEMP FAN HEAT SINK – FHE Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6

Contextual Info: HI-TEMP FAN HEAT SINK – FHP Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 27x27 mm to 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical

Contextual Info: HI-TEMP FAN HEAT SINKS – FHE SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 45.0

8815 nor

Abstract: TA 8825 8885 signetics
Contextual Info: 32E D • 53^603 0 0 0 0 3 6 2 fi ILTE T-43-01 MAXIMUM RATINGS Rating Signetics Integrated Circuits Designer's Choice PACKAGING AVAILABLE See page 52 : C - 14-LEAD DUAL INLINE D - 14-LEAD FLAT PACK Value Unit Supply Voltage - Vcc 6,0 V Input Voltage - Vln

Contextual Info: HIGH TEMP FAN HEAT SINKS - FHS-090 SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6 mm

Contextual Info: FAN HEAT SINKS - FHS-090 SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6

Contextual Info: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS www.ctscorp.com CTS ® TABLE OF CONTENTS PAGE FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES

zif rod

Contextual Info: – THERMAL MANAGEMENT PRODUCTS CATALOG www.ctscorp.com CTS TABLE OF CONTENTS PAGE HI-TEMP FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES 10 ZIF STANDARD CIRCUIT BOARD RETAINERS

Contextual Info: TECHNICAL DATA SECTION CARBON AND ALLOY STEEL — STAINLESS STEEL Nominal Pipe Size Inches Outside Diameter Inches 1⁄8 0.405 1⁄4 0.540 3 ⁄8 0.675 1 ⁄2 0.840 3 ⁄4 1.050 1 1.315 11⁄4 1.660 11⁄ 2 1.900 2 2.375 21⁄ 2 2.875 3 3.500 Identification

L4W 87

Abstract: L4W 75 305621 Naltron Nanotec Electronic GmbH
Contextual Info: REPRESENTATIVES “H Y U N D A I CENTRAL REGION CANADA TECH TREK, LTD. 1015 Matheson Blvd. Unit #6 Mississauga, Ontario L4W 3A4 TECH TREK, LTD. 2271 Guenette St. St. Laurent, Quebec H4R 2E9 TECH TREK, LTD. 155 Terence Matthews Cres., Unit 7, Kanata, Ontario K2M 2A8

Nanotec Electronic GmbH

Contextual Info: REPRESENTATIVES »HYUNDAI CENTRAL REGION CANADA TECH TREK, LTD. 1015 Matheson Blvd. Unit #6 Mississauga, Ontario L4W 3A4 TECH TREK, LTD. 2271 Guenette St. St. Laurent, Quebec H4R 2E9 TECH TREK, LTD. 155 Terence Matthews Cres., Unit 7, Kanata, Ontario K2M 2A8