CX506 Search Results

CX506

Abstract: MA506
Contextual Info: CARDINAL COMPONENTS Surface Mount Crystal Series CX506 Fits Epson MA506 footprint. Part Numbering Example: CX506 Z - A1 B2 C2 200 - 3.579545 D18 - 3 CX506 Z A1* B2 SERIES ADDED FEATURES OPERATING TEMP. CX506 BLANK = BULK PACK A0 = -10°C ~ +60°C Z = TAPE AND REEL A1 = -10°C ~ +70°C

Contextual Info: CARDINAL COMPONENTS Surface Mount Crystal Series CX506 Fits Epson MA506 footprint. Part Numbering Example: CX506 Z - A1 B2 C2 200 - 3.579545 D18 - 3 CX506 Z A1* B2 SERIES ADDED FEATURES OPERATING TEMP. CX506 BLANK = BULK PACK A0 = -10°C ~ +60°C Z = TAPE AND REEL A1 = -10°C ~ +70°C

cx506

Abstract: 3.579545
Contextual Info: CARDINAL COMPONENTS Surface Mount Crystal Series CX506 Fits Epson MA506 footprint. Part Numbering Example: CX506 Z - A1 B2 C2 200 - 3.579545 D18 - 3 CX506 Z A1* B2 C2 200 3.579545 D18 -3 SERIES ADDED FEATURES OPERATING TEMP. STABILITY TOLERANCE RESISTANCE FREQUENCY LOAD CAP.

F-Connector

Abstract: Moca Filter
Contextual Info: CX5060 - MOCA POINT OF ENTRY FILTER Pulse w w w .p u ls e e n q . c o m CX5060 - ELECTRICAL SPECIFICATIONS: 25 ’ C FILTER, 5 - 1 0 0 2 MHz IMPEDANCE = 7 5 OHMS 1. INSERTION LOSS: FREQUENCY 6KV SURGE PROTECTION METAL HOUSING 5 - 8 6 0 MHz 8 6 0 -1 0 0 2 MHz

Contextual Info: CARDINAL COMPONENTS Surface Mount Crystal Series CX506 Fits Epson MA506 footprint. Part Numbering Example: CX506 Z - A1 B2 C2 200 - 3.579545 D18 - 3 CX506 A1* Z B2 SERIES ADDED FEATURES OPERATING TEMP. CX506 BLANK = BULK PACK A0 = -10°C ~ +60°C Z = TAPE AND REEL A1 = -10°C ~ +70°C

crystals

Abstract: TCXO 32768 32768 mhz crystal footprint 4 pin surface mount crystal oscillator
Contextual Info: CARDINAL COMPONENTS Short Form Guide • Parts Catalog CRYSTAL SECTION C49 - 10 Microprocessor Crystals HC-49, 1.8 - 150 MHz Low cost, Broad Frequency Range CX506 - 22

C-G6FA

Abstract: C-G26FB C-G18FA HP5-96PA-2
Contextual Info: Series High-density Packaging System Connectors for Hi-PAS Mounting HP5 • 6 Series C-G * * Series Overview The HP5 Series and C - G * * Series o f Hi-PAS H ig h -d e n sity Packaging S ystem m o u n tin g co n n e cto rs w ere d e veloped to m e e t th e d e m a n d s o f the hig h p e rfo rm a n ce and tre n d to w a rd h ig h -d e n s ity packaging o f

C-G26FB

Abstract: C-G6FA TD1A C-G64FA C-G26FA caulking A26D PANDUIT C-G18FB LCF-J64MB
Contextual Info: PCN11M MQ S e rie s I For Digital System Network 583 Connectors for Digital System Network PCN11M Series C - G * * Series CL206 Scope T h e P C N 11 M and C - G * * Series connectors are fo r packaging and cable use d eve lo p ed in response to digitizing

C-G6FA

Abstract: C-G26FA dc welding circuit diagram C-G26FB caulking ehps C-G18FA A 1952 R Q U-Groove Polycarbonate
Contextual Info: HP5-6 MQ Series High-density Packaging System Connectors for Hi-PAS Mounting HP5 • 6 Series C - G * * Series Overview The HP5 Series and C - G * * Series o f Hi-PAS H ig h -d e n sity Packaging S ystem m o u n tin g co n n e cto rs w ere developed to m e e t th e dem a n d s o f the h igh p e rfo rm a n ce and tre n d to w a rd h ig h -d e n s ity packaging o f

Contextual Info: Major Specifications HP5 • 6 Series Specification Item M ounting spacing Remarks 15.24 mm 189, 123, or 75 contacts Num ber o f contacts BWB • M axim um o f 567 contacts w ith 300-mm high package • System: w ith o u t rows C and E, w ith o u t rows A, C, and E, w ith o u t rows A, B, C, and E

philips semiconductor data handbook

Abstract: M34300 64742-94-5 " m7" smd cfl AE TCXO 1025 SC370 M72 7 segment MIPO 255 PG2000P CT4S
Contextual Info: Timing Product Solu0ons Crystals Oscillators Programmable TCXO VCXO VC-TCXO OCXO Mul8‐Output Frequency Hi‐Rel Pla8num Resonators Equipment CARDINAL COMPONENTS Milestones

Contextual Info: CARDINAL COMPONENTS CRYSTAL SECTION CX129 . 27 CX051 . 28 CX17A . 29 CX17C . 29

Contextual Info: High-density Packaging System • Connectors for 50Q Coaxial Ribbon Cables OCX50-6FA 3.5 ■ tr CSJ cvi pt LO Jt \ \ t-* c\j r LO L f ! 1 LO " 1 12. 5 Pin No. 3B Product No. HRS No. CX50-6FA CL206-5152-0 Pin No. IB See Page 38 fo r info rm atio n about cable