CY2911A Search Results

Contextual Info: CY2909A CY2911A CYPRESS SEMICONDUCTOR CMOS Micro Program Sequencers Features • • • • F a st — C Y 2 9 0 9 A /1 1 A h a s a 4 0 ns m in . c lo c k to o u tp u t c y c le tim e; co m m er cia l — C Y 2 9 0 9 /1 1 h as a 4 0 n s (m in .) c lo c k to o u tp u t c y c le

am2911a

Abstract: CY2911APC CY2909
Contextual Info: CY2909A CY2911A CYPRESS SEMICONDUCTOR CMOS Micro Program Sequencers • Infinitely expandable in 4-bit Incre­ ments Features • Fast — CY2909A/I1A has a 40-ns min. clock-to-output cycle time (com­ mercial) — CY2909/11 has a 40-ns (min.) clock-to-output cycle time (m ili­

Contextual Info: CY2909A CY2911A CYPRESS SEMICONDUCTOR Features • Fast — C Y 2 9 0 9 A /llA h a sa 4 0 -n s min. clock-to-output cycle tíme (com­ mercial) — CY2909/11 has a 40-ns (min.) clock-to-output cycle tim e (m ili­ tary! • Low power — I c e (max*) = 70 mA (commercial)

CY7C2901

Contextual Info: ÌB Ìcy p ress • Table 10. Die Sizes of Cypress Devices continued P a rt N um ber Size (mil2) P a rt N um ber Size (mil2) ECL Logic CY 2909A 7968 CY100E301L 14875 CY2910A 21750 CY100E302L 14875 CY2911A 7968 CY100E422 6960 11800 CY100E474 10830 CY7C510

CY27S03A

Abstract: 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide
Contextual Info: Thermal Management and Component Reliability slope of the logarithmic plots is given by the activation energy of the failure mechanisms causing thermally activated wear out of the device see Figure 1 . One of the key variables determining the long-term reliability

CY7C9101

Abstract: CY7C510 CY7C190 cy7c189 G30-88 CY7c910 EA 9394 cy3341 CY6116 cy7c901
Contextual Info: fax id: 8511 Thermal Management Thermal Management and Component Reliability One of the key variables determining the long-term reliability of an integrated circuit is the junction temperature of the device during operation. Long-term reliability of the semiconductor chip degrades proportionally with increasing temperatures following an exponential function described by the