D2240 Search Results

Contextual Info: f f l H A R R D22402 I S S E M I C O N D U C T O R Sync Generator for TV Applications and Video Processing Systems November 1996 Features Description • Interlaced Composite Sync Output The Harris C D22402 Note is a CM OS LSI sync generator that produces all the tim ing signals required to drive a fully 2-to-1

ISS82

Abstract: ESI 252 impedance meter D2240NL TO252and
Contextual Info: S T U/D2240NL S amHop Microelectronics C orp. Nov 22,2004 N-C hannel E nhancement Mode Field E ffect Transistor F E AT UR E S P R ODUC T S UMMAR Y V DS S ID R DS ON S uper high dense cell design for low R DS (ON ). ( m W ) Max R ugged and reliable. 35@ V G S = 10V

Contextual Info: Liqui-Bond SA 2000 Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits TEST METHOD Visual 200,000 200,000 ASTM D2196 2.4 2.4 ASTM D792 6 6 — ASTM D2240 Shelf Life @ 10°C months PROPERTY AS CURED - PHYSICAL Hardness (Shore A)

Contextual Info: Liqui-Bond SA 1800 One-Part Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits 125,000 125,000 ASTM D2196 2.8 2.8 ASTM D792 6 6 — PROPERTY AS CURED - PHYSICAL Hardness (Shore A) 80 80 ASTM D2240 -76 to 392 -60 to 200 —

Contextual Info: S T U/D2240NL S amHop Microelectronics C orp. Nov 22,2004 N-C hannel E nhancement Mode Field E ffect Transistor F E AT UR E S P R ODUC T S UMMAR Y V DS S ID R DS ON S uper high dense cell design for low R DS (ON ). ( m Ω ) Max R ugged and reliable. 35@ V G S = 10V

Contextual Info: S T U/D2240NL S amHop Microelectronics C orp. Nov 22,2004 N-C hannel E nhancement Mode Field E ffect Transistor F E AT UR E S P R ODUC T S UMMAR Y V DS S ID R DS ON S uper high dense cell design for low R DS (ON ). ( m W ) Max R ugged and reliable. 35@ V G S = 10V

ASTM D374

Abstract: ASTM D2240, D412 ASTM D412 ASTM d412 ASTM D2240 D2240 ASTM d792 ASTM-D-257 ASTM-D-374
Contextual Info: TG2030 Ultra Soft Thermal Conductive Pad Features Superior thermal conductivity Highly compressible Naturally tacky Low Shore OO hardness Low oil bleed Electrically insulating Applications Electronic components: IC - CPU - MOS LED - M/B - P/S - Heat Sink LCD-TV - Notebook PC - PC Telecom Device - Wireless Hub.etc.

SJ-6506

Abstract: D1894 astm D2632 ASTM D412 for rubber synthetic rubber adhesive
Contextual Info: 3 Bumpon Protective Products TM Quiet Clear SJ-6500 Series Technical Data Product Description 3M Bumpon™ Quiet Clear SJ-6500 Series are molded cushioning products that utilize a special, soft polyurethane formulation and synthetic rubber adhesive system.

bergquist

Abstract: SIL-PAD 1000 TO 247 ASTM D2240, D412 ASTM D374 SIL-PAD 900S D149 D150 D2240 D257 D374
Contextual Info: Sil-Pad 900S High Performance Insulator for Low-Pressure Applications Features and Benefits TYPICAL PROPERTIES OF SIL-PAD 900S PROPERTY Color • Thermal impedance: 0.61°C-in2/W @50 psi • Electrically isolating • Low mounting pressures • Smooth and highly compliant surface

Contextual Info: Technical Data June 2011 3M Thermally Conductive Silicone Interface Pad 5515-20 and 5515-25 Product Description 3M™ Thermally Conductive Silicone Interface Pads 5515-20 and 5515-25 are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. The 3M Pad

astm D150

Abstract: D412 ASTM D412 ASTM D5470 ASTM D2240, D412 ASTM D2240 T-Flex 200 Outgassing CVCM ASTM
Contextual Info: Laird Technologies Web site: www.LairdTech.com Item # Tflex 2130 V0, Tflex 200 V0 Series Gap Filler Material Tflex™ 200 V0 Series Gap Filler Material The Tflex™ 200 V0 Series is a very soft, free standing gap filler that is more compressible than most gap fillers. Tflex™

D149

Abstract: D2240 D257 D412 A15561-00
Contextual Info: TgardTM 3000 Thermally Conductive Insulators Innovative Technology for a Connected World Electrically Insulating, Thermally Conductive Material The TgardTM 3000 is specifically designed to solve over heating issues such as lower component efficiency, premature component failures, size limitations and other performance problems for today’s power

HELLERMANN

Abstract: Wiring Duct PVC DUROMETER 5x4G HellermannTyton TC1.5W 106H SLHD4X4G4 SLHD2X4W
Contextual Info: HellermannTyton’s Pro-Duct wiring duct efficiently routes and protects wire and cable. Manufactured from high impact, rigid PVC, Pro-Duct includes solid, slotted and high density slotted styles. Available in over 26 sizes. Pro-Duct comes in standard colors of gray and white in 6

MIL-I-81765

Abstract: d412 astm 412 ASTM D 2240 ASTM D2240, D412 ASTM B 412 ELONGATION D2240 grommet URHR-2 D635
Contextual Info: shrinkHOoP Cable Clamp Heat Shrink Grommet Sizes 2, 3 and 4 c b a L Table of Dimensions, inch mm : Part Description URHR-2 URHR-3 URHR-4 Inside Diameter Min. Exp. (a) Max. Rec’d (b) 1.23 (31) 1.44 (37) 1.85 (47) 0.10 (2.5) 0.14 (3.5) 0.18 (4.6) Outside Diameter

bergquist

Abstract: 2500S2
Contextual Info: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at

Thermal Gap Filler

Abstract: D149 D2240 D257 D412 E595
Contextual Info: TflexTM 200 V0 Series Thermal Gap Filler Innovative Technology for a Connected World SOFT, FREESTANDING GAP FILLER Tflex 200 V0 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this

Contextual Info: Gap Pad 1500S30 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500S30 • Thermal conductivity: 1.3 W/m-K PROPERTY Color • Highly conformable / low hardness Reinforcement Carrier

a3000

Contextual Info: Gap Pad A3000 Thermally Conductive, Reinforced Gap Filling Material Features and Benefits • Thermal conductivity: 2.6 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Reduced tack on one side to aid in application assembly • Electrically isolating

Contextual Info: Sil-Pad 800 High Performance Insulator for Low-Pressure Applications Features and Benefits T YPICAL PROPERT IES OF SIL-PAD 800 PROPERTY Color • Thermal impedance: 0.45°C-in 2/W @50 psi • High value material • Smooth and highly compliant surface

Contextual Info: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at

Contextual Info: Gap Pad VO Ultimate Ultra Conformability, Robust, Improved Thermal Conductivity, Gap Filling Material Features and Benefits • Thermal conductivity: 1.3 W/m-K • Ultra conformability • Gel-like modulus TYPICAL PROPERTIES OF GAP PAD VO ULTIMATE PROPERTY

C351

Abstract: D149 D150 D2240 D257 D374 D575 D792 ASTM d792 ASTM D2240
Contextual Info: Gap Pad 2000S40 Highly Conformable,Thermally Conductive “S-Class” Gap Filling Material Features & Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color • Thermal conductivity = 2.0 W/mK • Low S-Class thermal resistance at very low pressures

Contextual Info: TflexTM 300 Series Thermal Gap Filler Innovative Technology for a Connected World UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing

Contextual Info: TflexTM HR200 Series Thermal Gap Filler Innovative Technology for a Connected World PRELIMINARY MID-PERFORMANCE GAP FILLER WITH 1.6 W/MK Tflex HR200 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.