DDR200, Search Results

DDR266

Contextual Info: DDR SDRAM stacked 1Gb B-die x4/x8 DDR SDRAM Stacked 1Gb B-die DDR SDRAM Specification (x4/x8) Revision 1.1 Rev. 1.1 August. 2003 DDR SDRAM stacked 1Gb B-die (x4/x8) DDR SDRAM st. 1Gb B-die Revision History Revision 0.0 (May, 2003) - First version for internal review.

ddr266

Contextual Info: DDR SDRAM 512Mb B-die x4, x8, x16 DDR SDRAM 512Mb B-die DDR SDRAM Specification Revision 1.1 Rev. 1.1 August 2003 DDR SDRAM 512Mb B-die (x4, x8, x16) DDR SDRAM 512Mb B-die Revision History Revision 0.0 (February, 2003) - First version for internal review

K4H2G

Abstract: DDR266 DDR333 DDR400
Contextual Info: Preliminary DDR SDRAM DDR SDRAM stacked 2Gb A-die x4 Stacked 2Gb A-die SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant) INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

DDR266

Abstract: DDR333 K4H560838E
Contextual Info: DDR SDRAM 256Mb E-die x4, x8 DDR SDRAM 256Mb E-die DDR SDRAM Specification 60Ball FBGA (x4/x8) INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

64Mb samsung SDRAM

Abstract: DDR333 DDR266
Contextual Info: DDR SDRAM 256Mb E-die x4, x8 DDR SDRAM 256Mb E-die DDR SDRAM Specification 54pin sTSOP(II) INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

HDD32M72D18RPW

Contextual Info: HANBit HDD32M72B18RPW DDR SDRAM Module 256Mbyte 32Mx72bit , based on 16Mx8, 4Banks, 4K Ref., 184Pin-DIMM with PLL & Register Part No. HDD32M72D18RPW GENERAL DESCRIPTION The HDD32M72D18RPW is a 64M x 72 bit Double Data Rate(DDR) Synchronous Dynamic RAM high-density memory

HDD64M72D18W

Contextual Info: HANBit HDD64M72D18W DDR SDRAM Module 512Mbyte 64Mx72bit , based on 32Mx8, 4Banks, 8K Ref., with 184Pin-DIMM Part No. HDD64M72D18W GENERAL DESCRIPTION The HDD64M72D18W is a 64M x 72 bit Double Data Rate(DDR) Synchronous Dynamic RAM high-density memory module. The module consists of eighteen CMOS 32M x 8 bit with 4banks DDR SDRAMs in 66pin TSOP-II 400mil packages

Contextual Info: K4H1G0438A K4H1G0838A DDR SDRAM 1Gb A-die SDRAM Specification 66 TSOP-II with Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

Contextual Info: DDR SDRAM 512Mb B-die x4, x8 DDR SDRAM 512Mb B-die DDR SDRAM Specification sTSOP(II) (400mil x 441mil) Revision 1.2 October, 2004 Rev. 1.2 October, 2004 DDR SDRAM 512Mb B-die (x4, x8) DDR SDRAM 512Mb B-die Revision History Revision 0.0 (February, 2003) - First version for internal review

Contextual Info: Preliminary DDR SDRAM DDR SDRAM 512Mb C-die x4, x8, x16 512Mb C-die DDR SDRAM Specification 60 FBGA with Pb-Free (RoHS compliant) Revision 0.0 October. 2004 Rev. 0.0 October. 2004 DDR SDRAM 512Mb C-die (x4, x8, x16) Preliminary DDR SDRAM 512Mb C-die Revision History

k4h560838huc

Abstract: K4H561638H-UC
Contextual Info: DDR SDRAM 256Mb H-die x4, x8, x16 DDR SDRAM 256Mb H-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant) INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

Contextual Info: DDR SDRAM 512Mb B-die x4, x8, x16 DDR SDRAM 512Mb B-die DDR SDRAM Specification 60Ball FBGA Revision 1.1 Rev. 1.1 May. 2004 DDR SDRAM 512Mb B-die (x4, x8, x16) DDR SDRAM 512Mb B-die Revision History Revision 0.0 (September, 2003) - First version for internal review

K4H510838d

Contextual Info: K4H510838D K4H511638D Preliminary Industrial DDR SDRAM 512Mb D-die DDR SDRAM Specification 66 TSOP-II with Pb-Free RoHS compliant Industrial Temp. -40 to 85°C INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

Contextual Info: DDR SDRAM 512Mb C-die x4, x8, x16 DDR SDRAM 512Mb C-die DDR SDRAM Specification 60 FBGA with Pb-Free (RoHS compliant) Revision 1.0 February. 2005 Rev. 1.0 February. 2005 DDR SDRAM 512Mb C-die (x4, x8, x16) DDR SDRAM 512Mb C-die Revision History Revision 0.0 (October, 2004)

Contextual Info: DDR SDRAM 128Mb E-die x4, x8, x16 DDR SDRAM 128Mb E-die DDR SDRAM Specification Revision 1.0 Rev. 1.0 Dec. 2002 DDR SDRAM 128Mb E-die (x4, x8, x16) DDR SDRAM 128Mb E-die Revision History Revision 1.0 (December, 2002) - First release Rev. 1.0 Dec. 2002 DDR SDRAM 128Mb E-die (x4, x8, x16)

Contextual Info: DDR SDRAM 256Mb E-die x4, x8 DDR SDRAM 256Mb E-die DDR SDRAM Specification 60Ball FBGA (x4/x8) Revision 1.2 October, 2004 Rev. 1.2 October, 2004 DDR SDRAM 256Mb E-die (x4, x8) DDR SDRAM 256Mb E-die Revision History Revision 1.0 (June, 2003) - First release

Contextual Info: DDR SDRAM stacked 1Gb B-die x4/x8 DDR SDRAM Stacked 1Gb B-die DDR SDRAM Specification (x4/x8) Revision 1.3 Revision 1.3 May, 2004 DDR SDRAM stacked 1Gb B-die (x4/x8) DDR SDRAM st. 1Gb B-die Revision History Revision 0.0 (May, 2003) - First version for internal review.

Contextual Info: DDR SDRAM K4H561638J 256Mb J-die DDR SDRAM Specification 66 TSOP-II & 60 FBGA with Lead-Free and Halogen-Free RoHS compliant Industrial Temp. -40 to 85°C INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

Contextual Info: DDR SDRAM 256Mb E-die x4, x8 DDR SDRAM 256Mb E-die DDR 400 SDRAM Specification 60Ball FBGA (x4/x8) Revision 1.0 Rev. 1.0 July. 2003 DDR SDRAM 256Mb E-die (x4, x8) DDR SDRAM 256Mb E-die Revision History Revision 1.0 (July, 2003) - First release Rev. 1.0 July. 2003

Contextual Info: DDR SDRAM 256Mb E-die x4, x8 DDR SDRAM 256Mb E-die DDR SDRAM Specification Revision 1.0 Rev. 1.0 April. 2003 DDR SDRAM 256Mb E-die (x4, x8) DDR SDRAM 256Mb E-die Revision History Revision 1.0 (April, 2003) - First release. Rev. 1.0 April. 2003 DDR SDRAM 256Mb E-die (x4, x8)

K4H511638D

Abstract: 4mx32 DDR266 DDR333 DDR400 K4H510838D TSOPII
Contextual Info: K4H510838D K4H511638D Industrial DDR SDRAM 512Mb D-die DDR SDRAM Specification 66 TSOP-II & 60FBGA with Pb-Free RoHS compliant Industrial Temp. -40 to 85°C INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

K4H560438H

Abstract: k4h561638h-zc DDR333 DDR400 K4H560838H K4H561638H
Contextual Info: K4H560438H K4H560838H K4H561638H DDR SDRAM 256Mb H-die DDR SDRAM Specification 60 FBGA with Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

DDR 333

Abstract: DDR333 DDR400 K4H510438C K4H510838C
Contextual Info: K4H510438C K4H510838C K4H511638C DDR SDRAM 512Mb C-die DDR SDRAM Specification 60 FBGA with Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

samsung 922 pinout

Abstract: DDR200 DDR266 DDR333 DDR400
Contextual Info: DDR SDRAM 1Gb M-die x4, x8 DDR SDRAM 1Gb M-die SDRAM Specification 66 TSOP-II INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,