DQ10S Search Results

Contextual Info: 37bflS5S 121 D GEC PLESSEY SEMICONDS DQ10SÔ3 1 «PLSB A PLESSEY W S e m ic o n d u c to rs . SP8660AC 150MHz 4- 10 FIXED MODULUS DIVIDER CONFORMS TO MIL-STD-883C CLASS B The SP8660 is a low power emitter coupled logic counter with an open collector output capable of driving TTL or

Contextual Info: PRELIMINARY I^ IIC R O N MT8LS6432 64K X 32 SRAM MODULE SRAM MODULE 64K X 32 SRAM LOW VOLTAGE FEA TU RES High speed: 15,20 and 25ns High-performance, low-power CMOS process Single +3.3V + 0.3V power supply _ _ 5V-tolerant I /O Easy memory expansion with CE and OE options

MD4832-D512-V3Q18-X-P

Abstract: MD4331-d1G-V3Q18-X-P marking Diskonchip MARKING G3 md4832-d512 ELPIDA K2 MD4811-D512-V3Q18-X MICRON mcp nand mcp elpida QUALCOMM Reference manual
Contextual Info: DiskOnChip -Based MCP Including Mobile DiskOnChip G3 and Mobile RAM Data Sheet, February 2004 Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code

Contextual Info: HITACHI/ LOGIC/ARRAYS/MEM Ta ““ d e J M4Tti2GB G G l O S h T 92D HD74HC668 HD74HC669 10569 Synchronous Up/Dow n Decade Counter • Synchronous Up/Dow n 4-bit Binary Counter This synchronous presettable decade counter features an internal carry look-ahead fo r cascading in high-speed count­

ELPIDA 512MB NOR FLASH

Abstract: nand mcp elpida MCP NOR FLASH SDRAM elpida Diskonchip MS08-D9SD7-B3 marking G3 QUALCOMM Reference manual nec 4 Banks x 1m x 32Bit Synchronous DRAM emblaze qualcomm 1100
Contextual Info: DiskOnChip-Based MCP Including DiskOnChip G3 and Mobile RAM Data Sheet, August 2004 • Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code

MCP 256M nand toshiba

Abstract: Diskonchip QUALCOMM Reference manual TRUEFFS TSOP 48 thermal resistance type1 MARKING G3 MCP 256M nand micron MICRON mcp transistor marking A9M MS06-D9SD8-B3
Contextual Info: DiskOnChip -Based MCP Including DiskOnChip G3 and Mobile RAM Data Sheet, September 2004 Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code