DS33X11 Search Results

BFAP20

Abstract: samsung ltcc G.SHDSL Industry Single-Chip VTSA7 447h LQ13 tag 9018 LM 205h 276 741h EoPDH
Contextual Info: Rev: 063008 DS33X162/DS33X161/DS33X82/DS33X81/ DS33X42/DS33X41/DS33X11/DS33W41/DS33W11 Ethernet Over PDH Mapping Devices General Description The DS33X162 family of semiconductor devices extend 10/100/1000Mbps Ethernet LAN segments by encapsulating MAC frames in GFP-F, HDLC, cHDLC,

Contextual Info: Rev: 012108 DS33X162/DS33X161/DS33X82/DS33X81/ DS33X42/DS33X41/DS33X11/DS33W41/DS33W11 Ethernet Over PDH Mapping Devices General Description The DS33X162 family of semiconductor devices extend 10/100/1000Mbps Ethernet LAN segments by encapsulating MAC frames in GFP-F, HDLC, cHDLC,

cb346

Abstract: CB355 CB815 CB397
Contextual Info: Rev: 030508 Ge ne ra l De sc ript ion Fe a t ure s ♦ Demonstrates Key Functions of DS33X11 Ethernet Transport Chipset ♦ Includes DS26521 T1/E1 SCT, DS3170 T3/E3 SCT, Transformers, BNC, and RJ48 Network Connectors and Termination ♦ Includes Ethernet PHY Supporting 10/100 and

cb346

Abstract: RB108 rectifier DS49 ub22 diode CB321 CB786 RB104 CB246 CB209 cb337
Contextual Info: Rev: 030508 DS33X11 Demo Kit General Description The DS33X11 demo kit DK is an easy-to-use evaluation board for the DS33X11 Ethernet-over-PDH device. The demo kit contains an option for either T3/E3 or T1/E1 serial links. All PDH links are complete with line interface, transformers, and

samsung ltcc

Contextual Info: PRELIMINARY Rev: 060607 DS33X162/DS33X161/DS33X82/DS33X81/ DS33X42/DS33X41/DS33X11/DS33W41/DS33W11 Ethernet Over PDH Mapping Devices General Description The DS33X162 family of semiconductor devices extend 10/100/1000Mbps Ethernet LAN segments by encapsulating MAC frames in GFP-F, HDLC, cHDLC,

Contextual Info: Rev: 060607 DS33X162/DS33X161/DS33X82/DS33X81/ DS33X42/DS33X41/DS33X11/DS33W41/DS33W11 Ethernet Over PDH Mapping Devices General Description ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Y ♦ ♦ 10/100/1000 IEEE 802.3 MAC MII/RMII/GMII with Autonegotiation and Flow Control

CB238

Abstract: CB411 cb346 CB337 CB248 RP92 cb815 CB239 al p67 smd RB101
Contextual Info: Rev: 030508 DS33X11 Demo Kit General Description The DS33X11 demo kit DK is an easy-to-use evaluation board for the DS33X11 Ethernet-over-PDH device. The demo kit contains an option for either T3/E3 or T1/E1 serial links. All PDH links are complete with line interface, transformers, and

SDH ADM

Abstract: MultiService Access Platform Frame structure for Multiplexing of four E2 streams into E3 stream barker code motorola STM-1 Physical interface PHY STS-3c-SPE DS33 k4h561638f trace code micron label
Contextual Info: ABRIDGED DATA SHEET Rev: 101508 DS33M30/DS33M31/DS33M33 Ethernet Over SONET/SDH Mapper _ General Description _Features ♦ Support for EoS in One STS-3c/VC-4, EoS Over Up to Three Concatenated STS-1/VC-3s,

TR-008

Abstract: DS34T10x ds26521 DS21448 DS2148 DS2155 DS21Q55 DS3151 DS2149 Ncomm
Contextual Info: Maxim > App Notes > T/E Carrier and Packetized Keywords: difference, T1, E1, channel, frame, superframe, extended, ESF, SF, D4, CRC-4, CAS, multiframe, CCS, RBS, robbed bit, AIS, RAI, DMA Dec 20, 2001 APPLICATION NOTE 590 Maxim Telecommunications Frequently Asked Questions

Contextual Info: Rev: 031008 Ge ne ra l De sc ript ion The DS33X162 demo kit DK is an easy-to-use evaluation board for the DS33X162 Ethernet-overPDH device. The demo kit contains an option for either T3/E3 or T1/E1 serial links. All serial links are complete with line interface, transformers, and

schematic diagram atx Power supply 500w

Abstract: pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 Digital Signal Processors, iCoupler , iMEMS® and iSensor . . . . . 805, 2707, 2768-2769 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-568 RF Connectors . . . . . . . . . . . . . . . . . . . . . . Pages 454-455

max14574

Abstract: MAX1786 MAX1788 MAX8899 DS1849 MAX16908 MAX4967 DS3610 max17018 max13487
Contextual Info: Monitor Reports by Product: 1. Find the product of interest in the table below. Note the process and/or package for that product. 2. Use the "Back" button to return to the home page. 3. Select the process in the "Process Reliability" for the product of interest.

tr/P45/marking code M31

Contextual Info: Rev 1; 010809 DS33M30/DS33M31/DS33M33 Ethernet Over SONET/SDH Mapper _ General Description _Features ♦ Support for EoS in One STS-3c/VC-4, EoS Over Up to Three Concatenated STS-1/VC-3s, and EoPoS Over Up to Three Concatenated

EoPDH

Abstract: GFP 73 A ROADM c0a80001 diode GFP AA DS33R11 DS33R41 DS33Z11 DS33Z41 DS33Z44
Contextual Info: Maxim > App Notes > T/E Carrier and Packetized Keywords: EoPDH, Ethernet, Ethernet over PDH, Carrier Ethernet, Demarcation, EoS, Ethernet Mapper, WAN, Ethernet over E1, Ethernet over T1, EoP Nov 20, 2007 APPLICATION NOTE 4124 DS33X162 Product Family FAQ Abstract: This application note addresses frequently asked questions FAQs about the DS33X162 family of

Contextual Info: Rev: 063008 DS3 3 X 1 6 2 /DS3 3 X 1 6 1 /DS3 3 X 8 2 /DS3 3 X 8 1 / DS3 3 X 4 2 /DS3 3 X 4 1 /DS3 3 X 1 1 /DS3 3 W4 1 /DS3 3 W1 1 Et he r ne t Ove r PDH M a pping Devic e s Ge ne ra l De sc ript ion The DS33X162 family of semiconductor devices extend 10/100/1000Mbps Ethernet LAN segments by

GFP 740

Abstract: EoPDH HDB3 to LVDS E1 to ethernet converter circuit 10G BERT DS26514 DS3100GN DS34T101 DS34T104GN TDK78P7200
Contextual Info: Communications 8th Edition April 2009 Bridging two worlds ET HE R TD NET M O OV VE ER R P PA D H CK ET IC solutions optimize transportation of data between network infrastructures DH ER P V O T T R N E PA C K E E H T R E OVE TDM TDM H R-PD E V O N E T- - PA C K E T

Contextual Info: Rev 1; 010809 DS33M30/DS33M31/DS33M33 Ethernet Over SONET/SDH Mapper _ General Description _Features Support for EoS in One STS-3c/VC-4, EoS Over Up to Three Concatenated STS-1/VC-3s, and EoPoS Over Up to Three Concatenated

Frame structure for Multiplexing of four E1 streams into E2 stream

Abstract: o.172 itu-t k4h561638f HDB3 to LVDS concatenated and OC-3 and STM-1 STM-1 Physical interface PHY dcc samsung motorola 823 GFP 34.368Mhz e2 e3 8448
Contextual Info: ABRIDGED DATA SHEET Rev: 111908 DS33M30/DS33M31/DS33M33 Ethernet Over SONET/SDH Mapper _ General Description _Features ♦ Support for EoS in One STS-3c/VC-4, EoS Over Up to Three Concatenated STS-1/VC-3s,