HBGA388 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA388 package SOT636-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

MS-034

Abstract: SOT636-1
Contextual Info: PDF: 2001 Dec 13 Philips Semiconductors Package outline HBGA388: plastic thermal enhanced ball grid array package; 388 balls; body 35 x 35 x 1.75 mm; heatsink SOT636-1 B D A D1 ball A1 index area A j A2 A1 E1 E detail X e1 C 1/2 e e ∅v M C A B b AD AB y

MS-034

Abstract: sot636 SOT636-1
Contextual Info: PDF: 2001 Apr 18 Philips Semiconductors Package outline HBGA388: plastic, heatsink ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT636-1 B D A D1 ball A1 index area A ∅ j E1 E A2 A1 detail X e1 C v M B b e ∅w M v M A y y1 C AF AE AC AD AB

Contextual Info: Package outline HBGA388: plastic thermal enhanced ball grid array package; 388 balls; body 35 x 35 x 1.75 mm; heatsink SOT636-1 B D A D1 ball A1 index area A j A2 A1 E1 E detail X e1 C 1/2 e e b ∅v M C A B AD AB Y y y1 C ∅w M C AF AE AC e AA V T P M K