LHF32K03 Search Results

LHF32K03 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
6056 Abstract: 13B1 LH28F320S3HNS-L11 Contextual Info: PRELIMINARY PRODUCT SPECIFICATIONS Integrated Circuits Group LH28F320S3HNS-L11 Flash Memory 32M 2M x 16/4M × 8 (Model No.: LHF32K03) Spec No.: FM985005 Issue Date: May 19, 1998 sharp sharp sharp sharp sharp sharp sharp sharp sharp sharp sharp sharp	Original	LH28F320S3HNS-L11 16/4M LHF32K03) FM985005 6056 13B1 LH28F320S3HNS-L11	PDF
A0-A21 Abstract: LH28F320S3HNS-L11 Contextual Info: PRODUCT SPECIFICATIONS Integrated Circuits Group LH28F320S3HNS-L11 Flash Memory 16M 2MB x 8 / 1MB × 16 (Model No.: LHF32K03) Spec No.: EL108029A Issue Date: December 17, 1998 sharp LHF32K03 ●Handle this document carefully for it contains material protected by international copyright	Original	LH28F320S3HNS-L11 LHF32K03) EL108029A LHF32K03 A0-A21 LH28F320S3HNS-L11	PDF
A0-A21 Abstract: LH28F320S3HNS-L11 t23V Contextual Info: PRODUCT SPECIFICATIONS Integrated Circuits Group LH28F320S3HNS-L11 Flash Memory 32M 4M x 8/2M x 16 (Model No.: LHF32K03) Spec No.: EL108029A Issue Date: December 17, 1998 sharp LHF32K03 ●Handle this document carefully for it contains material protected by international copyright	Original	LH28F320S3HNS-L11 LHF32K03) EL108029A LHF32K03 A0-A21 LH28F320S3HNS-L11 t23V	PDF
PD45V Contextual Info: SHARP SPEC No. F M 9 8 5 0 0 5 I SSUE: May 19 1998 To ; PRELIMINARY S P E C I F I C A T I O N S Product Type 32Mbit Flash Memory L H 2 8 F 3 2 0 S 3 H N S —L I 1 Model No. LHF32K03 This device sp ecification is subject to change without notice. j&This sp ecification s contains 49 pages including the cover and appendix.	OCR Scan	32Mbit LHF32K03) LHF32K03 LH28F320S3HNS-L11 PD45V	PDF
LH28F640BFHE-PBTLDY Abstract: lh28f320s5hns-zp LH28F160S5T-L70A LH28F016 LH28F008SAT-ZW lh5116na-10 LH28F640BFHE-PBTL90 LH5164A-10L LH5164AN-80L lh5116-10 Contextual Info: Product Change Notice PCN : Lead (Pb)–free Packages October 15, 2004 This document updates PCN: ST-03-Z-06E issued January 23, 2004. Objective: Existing Memory ICs are changing from a lead (Pb) process to a lead-free process. Process Change Key Points 1) SHARP is changing the lead plating process from lead (Pb) to lead-free to meet the demands	Original	ST-03-Z-06E connectiH5116D-10F LH5116H-10F LH5116NA-10F LH5164A-10LF LH5164AD-10LF LH5164AHN-10LF LH516AN0 LH28F640BFHE-PBTLDY lh28f320s5hns-zp LH28F160S5T-L70A LH28F016 LH28F008SAT-ZW lh5116na-10 LH28F640BFHE-PBTL90 LH5164A-10L LH5164AN-80L lh5116-10	PDF