LQFP144 Search Results

Contextual Info: SPC56EL70L3, SPC56EL70L5 SPC564L70L3, SPC564L70L5 32-bit Power Architecture microcontroller for automotive SIL3/ASILD chassis and safety applications Datasheet - production data LQFP144 20 x 20 x 1.4 mm LQFP100 (14 x 14x 1.4 mm) • Nexus Class 3+ interface

SPC564

Abstract: SPCEL70
Contextual Info: SPC56EL70L3, SPC56EL70L5 SPC564L70L3, SPC564L70L5 32-bit Power Architecture microcontroller for automotive SIL3/ASILD chassis and safety applications Datasheet - production data LQFP144 20 x 20 x 1.4 mm LQFP100 (14 x 14x 1.4 mm) • Nexus Class 3+ interface

stm32f407xx

Abstract: STM32f4xx reference manual
Contextual Info: STM32F405xx STM32F407xx ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet - production data FBGA • LQFP64 10 x 10 mm LQFP100 (14 × 14 mm) LQFP144 (20 × 20 mm)

MT29F2G16AADWP

Abstract: 7SDMM-B0-2211 7SDMM-B0-2211-A PB20 LQFP144 PA10 PA11 PA13 PA15 PA16
Contextual Info: 5 4 3 2 1 SAM3U-EK RevB Block Diagram D D ATMEL Cortex M3 Processor SAM3U LQFP144 Reset,Debug Logic Power Manage C C Audio DAC SD/MMC Card PSRAM Accelerometer B Temperature sense Nand Flash USB & UART 2.8 Inch TFT-LCD B User Interface (PIO PortA,B,C) A A

sot486

Abstract: SOT486-1
Contextual Info: PDF: 1999 Nov 03 Philips Semiconductors Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 c y X A 73 72 108 109 ZE e E HE A A2 A 3 A1 θ wM Lp bp L pin 1 index detail X 37 144 1 36 v M A ZD wM bp e

PAD108

Contextual Info: MMP EIAJ Package Code LQFP144-P-2020-0.50 Plastic 144pin 20✕20mm body LQFP Weight g 1.23 JEDEC Code – Lead Material Cu Alloy MD e 144P6Q-A b2 D 144 ME HD 109 1 l2 Recommended Mount Pad 108 36 A A1 A2 b c D E e HD HE L L1 Lp HE E Symbol 73 37 72 A L1 F

LQFP144-P-2020-0

Contextual Info: LQFP144-P-2020-0.50-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.37 TYP. 5/Nov. 28, 1996

LQFP-144

Abstract: LQFP144 LQFP144 dimension LQFP144 DATASHEET
Contextual Info: PACKAGE DIMENSIONS LQFP144 0.22±0.05 0.08 M 73 108 109 72 +0.10 -0.05 20.00typ 0.10 0.10 22.00 ±0.40 0.50 +0.10 -0.05 144 37 1 36 0.17±0.05 20.00typ 1.00typ 0.37typ 0° 10 ° NOTE1 0.08 0.05MIN 1.25 1.70MAX 22.00±0.40 0.50±0.10 ＧＤ－Ｑ１４４０１Ｙ－０２

LQFP144

Abstract: LQFP144 DATASHEET
Contextual Info: パッケージ外形図 LQFP144 0.22±0.05 0.08 M 73 108 109 72 +0.10 -0.05 20.00typ 深さ0.10 深さ0.10 22.00 ±0.40 0.50 +0.10 -0.05 144 37 1 36 0.17±0.05 20.00typ 1.00typ 0.37typ 0° 10 ° （注1 ）NOTE1 0.08 0.05MIN 1.25 1.70MAX 22.00±0.40 0.50±0.10

BP 109 transistor

Abstract: LQFP144
Contextual Info: JEITA Package Code P-LQFP144-20x20-0.50 RENESAS Code PLQP0144KB-A Previous Code FP-144F/FP-144FV MASS[Typ.] 1.4g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 108 73 109 72 bp c c1 HE Reference

C90LC

Abstract: MPC5602 MPC5604PE MPC560 MPC5603 MPC5604PEF MPC5602PEF MPC560xp freescale
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604P Rev. 1, 8/2008 MPC560xP MPC560xP Microcontroller Data Sheet MAPBGA–225 QFN12 15 mm x 15 mm 14 x 14 x 1.4 mm ##_mm_x_##mm LQFP100 LQFP144 (20 x 20 x 1.4 mm) 32-bit Power Architecture based MCU for

100P6S-A

Abstract: LQFP100-P-1414-0 LQFP144-P-2020-0 QFP100-P-1420-0 PAD108
Contextual Info: Package Dimensions M32C/83 Group Package Dimensions Recommended EIAJ Package Code LQFP144-P-2020-0.50 Plastic 144pin 20✕20mm body LQFP Weight g 1.23 JEDEC Code – Lead Material Cu Alloy MD e 144P6Q-A b2 D ME HD 144 109 1 l2 Recommended Mount Pad 108 36

LQFP144

Abstract: 109c LQFP-144 M0101
Contextual Info: LQFP144 0. 50 0. 22 ± 0 . 05 0.08 M 73 108 □7 2 ri -j A+0. 10 u - l u -0. 05 o. i o :8:¿5 37 144 20. OOtyp. 36 0 .1 7 ± 0 . 05 22. 00 ± 0 .4 0 AJ 1.25 - H 0.08 / ° l , o° o G D - Q 1 4 4 0 1 Y - 0 2 : mm Ver.2008-08-28

LQFP144

Abstract: 1616 LQFP-144P
Contextual Info: 1 TYP. LQFP144-P-1616-0.40A U nit : mm

SPC56EL70

Abstract: SPC56EL70L3 bosch edc 17
Contextual Info: SPC56EL70L3, SPC56EL70L5 SPC564L70L3, SPC564L70L5 32-bit Power Architecture microcontroller for automotive SIL3/ASILD chassis and safety applications Datasheet - production data LQFP144 20 x 20 x 1.4 mm LQFP100 (14 x 14x 1.4 mm) • Nexus Class 3+ interface

TQPACK144SD

Abstract: POLYPOD-TQ144 Inca ETAS nexus 4 TQPACK176SD QFP-176
Contextual Info: SPC563M64CAL144/176 SPC563M64xx microcontroller family calibration and emulation system Data brief Features • Support for LQFP144 and LQFP176 MCU production packages allowing calibration systems to be built without requiring modifications to the standard production

LQFP144

Abstract: QFP100-P-1818B scl-3b
Contextual Info: MN103L03 Series MN103LF03R Type Internal ROM type FLASH ROM byte 1024K RAM (byte) 63.5K LQFP128-P-1818C (Under development), LQFP144-P-2020A (Under development), QFP100-P-1818B (Under development) Package (Lead-free) Minimum Instruction Execution Time 25 ns (at 2.7 V to 3.6 V, 40 MHz)

BGA-132

Abstract: manual STM32 touch sensing STM32L151RD STM32 F4 touch frame STM32L15x STM32L152 STM8L15 STM8 detail registers I2C
Contextual Info: STM32L151xD STM32L152xD Ultralow power ARM-based 32-bit MCU with 384 KB Flash, RTC, LCD, USB, analog functions, 10 serial ports, memory I/F Features • ■ ■ ■ ■ ■ LQFP144 20 x 20 mm LQFP100 14 × 14 mm LQFP64 10 × 10 mm Operating conditions – Operating power supply range: 1.65 V to

Contextual Info: Low-cost, low-power ARM9 microcontrollers High integration and superior performance at an affordable price The NXP ARM9 portfolio ARM926EJ-S ARM968 ARM926EJ-S ARM926EJ-S ARM926EJ-S ARM922T LPC29xx LPC313x LPC3180/01 LPC32x0 LH7A40x LPC314x LPC315x LQFP144, LQFP208,

Contextual Info: STM32F415xx STM32F417xx ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, crypto, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet - production data FBGA • LQFP64 10 x 10 mm LQFP100 (14 × 14 mm) LQFP144 (20 × 20 mm)

LQFP144

Abstract: LQFP-144
Contextual Info: PACKAGE DIMENSIONS LQFP144 ＧＤ－Ｑ１４４０１Ｙ－０２ UNIT : mm Ver.2008-08-28

BP 109 transistor

Abstract: LQFP144
Contextual Info: JEITA Package Code P-LQFP144-20x20-0.50 RENESAS Code PLQP0144KC-A Previous Code FP-144H/FP-144HV MASS[Typ.] 1.4g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 108 73 109 72 bp c c1 HE Reference

LQFP-144

Abstract: LQFP144 LQFP144-P-2020-0
Contextual Info: LQFP144-P-2020-0.50 U nit : mm Z'O + O' I Z + 0.055 0.145 - 0.045 0. 10± 0.05 LQFP144-P-2020-0.50 Unit : mm

100P6S-A

Abstract: LQFP100-P-1414-0 LQFP144-P-2020-0 QFP100-P-1420-0 PAD108
Contextual Info: Under development Preliminary specification Specifications in this manual are tentative and subject to change. Package Dimensions M32C/84 Group Package Dimensions Recommended EIAJ Package Code LQFP144-P-2020-0.50 Plastic 144pin 20✕20mm body LQFP Weight g