MS8351 Search Results
MS8351 Price and Stock
Microchip Technology Inc MS8351-P2819GaAs Schottky Non Hermetic Flip Chip, Projected EOL: 2044-08-15 |
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MS8351-P2819 |
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MS8351-P2819 |
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MS8351-P2819 | 131 |
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MS8351-P2819 |
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TE Connectivity MS83519/2-3 |
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MS83519/2-3 | 17 |
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MS8351 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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ms8351Contextual Info: GaAs Schottky Diodes TM Low CT Series Pair MS8351 – P2819 Flip Chip GaAs Schottky: Series Pair – Low Capacitance Design Dimensions Size: 28 x 19 mils Thickness: 5 mils Bond Pad Size: 5 x 5 mils Features ● Capacitance 45 fF Typ. ● Low Series Resistance (7 Typ.) |
Original |
MS8351 P2819 MS8351 p0105 x10-13 | |
Contextual Info: GaAs Schottky Diodes TM Low CT Series Pair MS8351 – P2819 Flip Chip GaAs Schottky: Series Pair – Low Capacitance Design Dimensions Size: 28 x 19 mils Thickness: 5 mils Bond Pad Size: 5 x 5 mils Features ● Capacitance 45 fF Typ. ● Low Series Resistance (7 Typ.) |
Original |
MS8351 P2819 MS8351 x10-13 | |
Contextual Info: GaAs Schottky Diodes TM Low CT Series Pair MS8351 – P2819 Flip Chip GaAs Schottky: Series Pair – Low Capacitance Design Dimensions Size: 28 x 19 mils Thickness: 5 mils Bond Pad Size: 5 x 5 mils Features Capacitance 45 fF Typ. Low Series Resistance (7 Typ.) |
Original |
MS8351 P2819 MS8351 x10-13 |