NX20P3XXUK Search Results

Contextual Info: Package outline WLCSP16: wafer level chip-size package; 16 bumps; 1.96 x 1.96 x 0.53 mm A B D NX20P3xxUK ball A1 index area A2 E A A1 detail X e1 C e C A B C Øv Øw b y D e C e2 B A ball A1 index area 1 2 3 4 X 2 mm scale Dimensions mm are the original dimensions