SIDC38D60C6 Search Results
SIDC38D60C6 Datasheets (2)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SIDC38D60C6 |
|
Used for IGBT3 | Original | 61.31KB | 4 | ||
| SIDC38D60C6X1SA3 |
|
Discrete Semiconductor Products - Diodes - Rectifiers - Single - DIODE GEN PURP 600V 150A WAFER | Original | 61.49KB |
SIDC38D60C6 Price and Stock
Infineon Technologies AG SIDC38D60C6X1SA3Diode Switching 150A DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC38D60C6X1SA3) |
|||||||||||
| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
|
SIDC38D60C6X1SA3 | Waffle Pack | 111 Weeks | 116 |
|
Get Quote | |||||
SIDC38D60C6 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
C185T
Abstract: FS150R06KE3 SIDC38D60C6
|
Original |
SIDC38D60C6 L4591M, C185T FS150R06KE3 SIDC38D60C6 | |
SIDC38D60C6Contextual Info: SIDC38D60C6 Fast switching diode chip in EMCON 3 -Technology FEATURES: • 600V EMCON 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient Chip Type VR IF SIDC38D60C6 600V 150A A This chip is used for: |
Original |
SIDC38D60C6 Q67050-A4355A101 L4591M, SIDC38D60C6 | |
|
Contextual Info: SIDC38D60C6 Fast switching diode chip in EMCON 3 -Technology FEATURES: • 600V EMCON 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient Chip Type VR IF SIDC38D60C6 600V 150A A This chip is used for: |
Original |
SIDC38D60C6 Q67050-A4355A101 L4591M, |