SIGC32T120R3E Search Results
SIGC32T120R3E Price and Stock
Infineon Technologies AG
Infineon Technologies AG SIGC32T120R3EX1SA3IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC32T120R3EX1SA3) |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SIGC32T120R3EX1SA3 | Waffle Pack | 20 Weeks | 7,578 |
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SIGC32T120R3E Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: SIGC32T120R3E IGBT3 Power Chip Features: • 1200V Trench + Field Stop technology low turn-off losses short tail current positive temperature coefficient easy paralleling This chip is used for: power modules C Applications: drives G |
Original |
SIGC32T120R3E L7641M, L7641T, L7641E, |