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    SIGC32T120R3LE Search Results

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    SIGC32T120R3LE Price and Stock

    Infineon Technologies AG SIGC32T120R3LEX1SA3

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC32T120R3LEX1SA3)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC32T120R3LEX1SA3 Waffle Pack 111 Weeks 7,578
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    SIGC32T120R3LE Datasheets Context Search

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    Contextual Info: SIGC32T120R3LE IGBT3 Power Chip Features: • 1200V Trench & Field Stop technology  low turn-off losses  short tail current  positive temperature coefficient  easy paralleling This chip is used for:  power modules C Applications:  drives


    Original     		SIGC32T120R3LE L7641N, L7641U, L7641F, PDF