SOJ28 Search Results

SOJ28-P-400-1

Contextual Info: 28P0N-A Plastic 28pin 400mil SOJ LOC EIAJ Package Code SOJ28-P-400-1.27 JEDEC Code – Weight(g) Lead Material Alloy 42 e D c 28 e1 HE E e1 I1 I2 15 Recommended Mount Pad Symbol 1 14 L A A1 b1 e b2 y b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2 I1 I2 Dimension in Millimeters

Contextual Info: 28P0K Plastic 28pin 400mil SOJ EIAJ Package Code SOJ28-P-400-1.27 JEDEC Code MO-061AA Weight g 1.08 Lead Material Alloy 42 e D b2 28 I1 I2 c e1 E HE e1 15 Recommended Mount Pad Symbol 1 14 L A A1 b1 e y b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2 I1 I2

SOJ28-P

Contextual Info: SOJ28-P-400-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.30 TYP. 5/Dec. 5, 1996

SOJ28

Contextual Info: SOJ28/24-P-400-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.25 TYP. 5/Dec. 5, 1996

Contextual Info: SOJ28-P-400-1.27 Unit nn Sep.2000

soj28

Contextual Info: SOJ28/24-P-400-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

SOJ28-P-300-1

Contextual Info: SOJ28-P-300-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Cu アロイ 半田メッキ (≥5µm) 0.80 TYP. 3 版/96.12.5

SOJ28-P

Contextual Info: SOJ28-P-400-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 1.30 TYP. 5 版/96.12.5

Contextual Info: SOJ28-P-400-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

SOJ28-P-300-1

Abstract: MAR 749
Contextual Info: 28P0D-A EIAJ Package Code SOJ28-P-300-1.27 Plastic 28pin 300mil SOJ LOC Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 Under Development D c 28 e1 HE E e1 I1 I2 15 Recommended Mount Pad 14 1 L A A1 b1 e y b SEATING PLANE Symbol A A1 b b1 c D E e e1

PA-SOJ28D-L-V-01

Abstract: PA-SOJ28D-L-V-01W
Contextual Info: 0.198" 0.998" 1 Pin 28 28 0.261" 15 0.400" PA-SOJ28D-L-V-01 Pin 1 0.800" 14 1 0.989" 2 0.187" 0.141" 0.100" typ. Side View 0.050" 0.020"±0.001" dia. 0.165" End View 0.100" 0.193" PA-SOJ28D-L-V-01W 0.507" 28 27 26 24 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5

SOJ28

Contextual Info: M624256 1 Megabit 256K x 4 VERY FAST SRAM WITH OUTPUT ENABLE 256K x 4 VERY FAST SRAM with OUTPUT ENABLE EQUAL CYCLE and ACCESS TIMES: 15, 20ns LOW VCC DATA RETENTION: 2V TRI-STATE COMMON I/O JEDEC PLASTIC SOJ, 400 mil PACKAGE 28 1 SOJ28 (E) 400 mils DESCRIPTION

Contextual Info: M624256 1 Megabit 256K x 4 VERY FAST SRAM WITH OUTPUT ENABLE DATA BRIEFING 256K x 4 VERY FAST SRAM with OUTPUT ENABLE EQUAL CYCLE and ACCESS TIMES: 15, 20ns LOW VCC DATA RETENTION: 2V TRI-STATE COMMON I/O JEDEC PLASTIC SOJ, 400 mil PACKAGE 28 1 SOJ28 (E)

SOJ28-P-300-1

Contextual Info: SOJ28-P-300-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 0.80 TYP. 3/Dec. 5, 1996

Contextual Info: SOJ2824-P-400-1.27B U nit nn Sep.2000

E128

Contextual Info: 28P0K-B EIAJ Package Code SOJ28/24-P-400-1.27 Plastic 28pin 400mil SOJ JEDEC Code – Weight g 1.08 Lead Material Alloy 42 e D I1 I2 23 c 15 20 e1 HE E e1 28 b2 Recommended Mount Pad Symbol 1 9 6 14 L A A1 b1 e y b SEATING PLANE A A1 b b1 c D E e e1 HE L

SOJ28-P-300-1

Abstract: SOJ28 SOJ28-P SOJ-28
Contextual Info: SOJ28-P-300-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

SOJ-28

Abstract: SOJ28
Contextual Info: SOJ28/24-P-400-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 1.25 TYP. 5 版/96.12.5

CV 203

Abstract: PA-SOJ28A-L-V-01 PA-SOJ28A-L-V-01W
Contextual Info: 0.993" Pin 28 0.203" 28 0.240" 1 15 0.295" PA-SOJ28A-L-V-01 Pin 1 Pin 1 0.800" 0.990" 14 1 2 0.187" Side View End View 0.141" 0.100" typ. 0.165" 0.050" 0.020"±0.001" dia. 0.100" 28 27 26 25 24 23 22 21 20 19 18 17 16 15 0.193" 1 2 3 4 5 6 7 8 9 10 11 12 13 14

TC5117445CSJ

Contextual Info: TO SHIBA_ TC5117445CSJ-40,-50,-60 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 4,194,304-WORD BY 4-BIT EDO HYPER PAGE DYNAMIC RAM DESCRIPTION The TC5117445CSJ is an EDO (Hyper Page) dynamic RAM organized as 4,194,304 words by 4 bits. The

TC5117800bnt-60

Abstract: TC5117800B
Contextual Info: TOSHIBA TC5117800BNJ/BNT-60/70 PRELIMINARY 2,097,152 WORD X 8 BIT FAST PAGE DYNAMIC RAM Description The TC5117800BNT is the fast page dynamic RAM organized 2,097,152 words by 8 bits. The TC5117800BNT utilizes Toshiba’s CMOS silicon gate process technology as well as advanced circuit techniques to provide wide operating margins,

lt928

Abstract: 55328P TC55328J
Contextual Info: 3 2 ,7 6 8 W O R D x 8 B IT C M O S S TA TIC R A M D E S C R IP T IO N The TC55328P/J is a 262,144 bits high speed static random access memory organized as 32,768 words by 8 bits using CMOS technology, and operated from a single 5-volt supply. Toshiba's CMOS

Contextual Info: TOSHIBA TC514800AJ/AZ/AFT-70/80 524,288 WORD X 8 BIT DYNAMIC RAM DESCRIPTION The TC514800AJ/AZ/AFT is the new generation dynam ic RAM organized 524,288 word by 8 bit. The TC514800A J/AZ/AFT utilizes T oshiba’s CM OS silicon gate process technology as w ell as advanced circuit

tc5117400f

Abstract: TC5117400J
Contextual Info: TOSHIBA TC5117400J/Z/FT-60/70 4,194,304 WORD X 4 BIT DYNAMIC RAM DESCRIPTION The TC5117400J/Z/FT-60/70 is the new generation dynamic RAM organized 4,194,304 word by 4 bit. The TC5117400J/Z/FT-60/70 utilizes Toshiba’s CMOS silicon gate process technology as well as advanced