SSOP14 Search Results

ssop14

Abstract: SSOP14 package ssop-14 4402
Contextual Info: PACKAGE DIMENSIONS SSOP14 +0.3 5.0 -0.1 0 ~ 10º 0.5±0.2 4.4±0.2 6.4±0.3 8 14 7 1 0.65 +0.1 0.67MAX 0.1±0.1 1.15±0.1 0.15-0.05 0.1 0.22±0.1 0.1 M UNIT : mm

ssop14p

Contextual Info: SSOP14-P-44-0.65-K Mirror Finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 0.066 TYP. 1 版/98.9.18

SSOP14 package

Abstract: SSOP14
Contextual Info: SSOP14 Adapter shrink small outline package RE931-01 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 14 - hole dia 1.00 mm - pitch 0.65 mm

SSOP14 package

Abstract: jedec MO-150 SSOP14 SOT337 MO-150
Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm D SOT337-1 E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp L 7 1 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

SSOP14

Abstract: ssop-14
Contextual Info: パッケージ外形図 SSOP14 +0.3 5.0 -0.1 0 ~10ﾟ 0.5±0.2 4.4±0.2 6.4±0.3 8 14 7 1 0.65 +0.1 0.67MAX 0.1±0.1 1.15±0.1 0.15-0.05 0.1 0.22±0.1 0.1 M 単位 : mm

74AHC14

Abstract: U22-C BKLVMAIN
Contextual Info: 1 2 3 4 5 6 7 8 USB CONNECTOR VCC5 BATT_LED# L9 USB_OC#0 U22C 19 VCC3 14 14 C23 1000P 0603B U22A U22B R140 5 6 1M 0603B USB_GND GND 1 2 74AHC14_V SSOP14 7 7 A BEAD 0805C + 7 C9 100U/16V CPWX6.6 R5 470K 0603B VCC3 14 VCC3 GND 3 74AHC14_V SSOP14 4 7 F2 POLYSW_MINISMDC110

SSOP14-P-44-0

Contextual Info: SSOP14-P-44-0.65-K Mirror Finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.066 TYP. 1/Sept. 18, 1998

PACKAGE DIMENSIONS

Abstract: SSOP10 SSOP14 SSOP20
Contextual Info: PACKAGE DIMENSIONS 3. PACKAGE DIMENSIONS SSOP10 +0.3 3.50 -0.1 0 – 10º 0.5 ±0.2 4.4 ±0.2 6.4 ±0.3 6 10 1 5 0.50 +0.1 0.15 -0.05 0.1 ±0.1 1.15 ±0.1 0.9MAX 0.1 0.2±0.1 0.1 M UNIT :mm SSOP14 +0.3 5.0 - 0.1 0 – 10º 1 0.5±0.2 6.4 ±0.3 4.4±0.2 8 7

SSOP10

Abstract: SSOP14 SSOP20 4402
Contextual Info: パッケージ外形図 3. パッケージ外形図 SSOP10 +0.3 3.50 -0.1 0 – 10º 0.5 ±0.2 4.4 ±0.2 6.4 ±0.3 6 10 1 5 0.50 +0.1 0.15 -0.05 0.1 ±0.1 1.15 ±0.1 0.9MAX 0.1 0.2±0.1 0.1 M 単位：ｍｍ SSOP14 +0.3 5.0 - 0.1 0 – 10º 1 0.5±0.2 6.4 ±0.3

jedec MO-150

Abstract: ssop14 SSOP14 package MO-150
Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm D SOT337-1 E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp L 7 1 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: Package outline SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm D SOT337-1 E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp L 7 1 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max.

SSOP14 package

Abstract: JEP95 SSOP14 MO-150 QS-000761-HD-01
Contextual Info: ZMD-Standard July 2000 Package SSOP14 5,3 mm MDS 761 Dimensions in millimetres Based on JEDEC JEP95: MO-150 A2 X A 1 Dimensions View X 0,15 ° A1 bp e HE E 1 LP c 0,1 14 Z k x 45 M D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,99 Amin

SSOP14 package

Abstract: SSOP14 SSOP14-P-44-0 ssop14p
Contextual Info: SSOP14-P-44-0.65-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

sot337

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm D SOT337-1 E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp L 7 1 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: TC74LCX08F/FN/FS-TENTATIVE DATA LOW -VOLTAGE QUAD 2-INPUT AND GATE WITH 5V TOLERANT INPUTS AND OUTPUTS T h e T C 7 4 LC X 0 8 is a h ig h p erform ance CM O S 2 -IN P U T TC74LCX08F A N D G A T E. D e sign e d fo r use in 3.3 V o lt systems, it achieves h ig h speed op e ra tio n w h ile m a in ta in in g the

Contextual Info: INTEGRATED T O SH IB A QUAD 2 -INPUT CIRCUIT T E C H N IC A L AND T O S H IB A CM O S D IG IT A L IN TEG R A TED CIR C U IT TC74AC08P/F/FN/FS DATA SILICO N M O N O LITH IC GATE The TC74AC08 is an advanced high speed CMOS 2-INPUT AND GATE fabricated with silicon gate and double - layer

Contextual Info: TOSHIBA TC74VHC08F/FN/FS/FT TO SHIBA CM OS D IG ITAL INTEGRATED CIRCUIT SILICON M ONOLITHIC TC74VHC08F, TC74VHC08FN, TC74VHC08FS, TC74VHC08FT QUAD 2 -INPUT AND GATE The TC74VHC08 is an advanced high speed CMOS 2-INPUT AND GATE fabricated with silicon gate C2MOS technology.

Contextual Info: TOSHIBA TC74VHC1OF/FN/FS/FT TO SHIBA CM OS D IG ITAL INTEGRATED CIRCUIT SILICON M ONOLITHIC TC74VHC10F, TC74VHC10FN, TC74VHC10FS, TC74VHC10FT TRIPLE 3 -INPUT NAND GATE The TC74VHC10 is an advanced high speed CMOS 3-INPUT NAND GATE fabricated with silicon gate C2MOS technology.

Contextual Info: INTEGRATED T O SH IB A QUAD 2 -INPUT CIRCUIT TECHNICAL OR TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT TC74ACT32P/F/FN/FS DATA SILICON MONOLITHIC GATE The TC74ACT32 is an advanced high speed CMOS 2-INPUT OR GATE fabricated with silicon gate and double - layer metal wiring C2MOS technology.

Contextual Info: INTEGRATED T O SH IB A TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT CIRCUIT TECHNICAL TC74AC74P/F/FN/FS DATA SILICON MONOLITHIC DUAL D -TYP E FLIP FLOP WITH PRESET AND CLEAR The TC74AC74 is an advanced high speed CMOS D - FLIP FLOP fabricated with silicon gate and double - layer metal

74hc733

Abstract: 74HC73 74HC73N 74HC73D 74HC73DB 74HC73PW JESD22-A114E SSOP14 SSOP14 package
Contextual Info: 74HC73 Dual JK flip-flop with reset; negative-edge trigger Rev. 04 — 19 March 2008 Product data sheet 1. General description The 74HC73 is a high-speed Si-gate CMOS device that complies with JEDEC standard no. 7A. It is pin compatible with Low-power Schottky TTL LSTTL .

21A1

Abstract: 74LV125DB 74HC125 74HCT125 74LV125 74LV125D 74LV125N 74LV125PW JESD22-A114E
Contextual Info: 74LV125 Quad buffer/line driver; 3-state Rev. 03 — 7 April 2009 Product data sheet 1. General description The 74LV125 is a low-voltage Si-gate CMOS device that is pin and function compatible with 74HC125 and 74HCT125. The 74LV125 provides four non-inverting buffer/line drivers with 3-state outputs. The

CBT3126

Abstract: CBT3126D CBT3126DB CBT3126DS CBT3126PW JESD22-A114E JESD78 sot337-1and sot403-1and
Contextual Info: CBT3126 Quad FET bus switch Rev. 03 — 9 December 2008 Product data sheet 1. General description The CBT3126 is a quad FET bus switch with independent line switches. Each switch is disabled when the associated Output Enable OE input is LOW. The CBT3126 is characterized for operation from −40 °C to +85 °C.

prtr5v0u6s

Abstract: csp1040 TSSOP20 FOOTPRINT ip4065cx11 smd transistor GY sot89 IP4065CX11/LF BV 9y transistor smd IP4058CX8/LF IP4280CZ10 smd transistor GY
Contextual Info: Dark Green − NXP‘s transfer to halogen-free products Why Dark Green? We as NXP are deeply committed to developing eco-friendly products and integrating environmental safety aspects in all manufacturing processes. For our packaging technology this meant a shift to lead-free and halogen-free “Dark Green”, years