TFBGA48 Search Results

Contextual Info: P-TFBGA48-0608-0.75BZ Uniti mm Jan.2004

d811

Contextual Info: P-TFBGA48-0811-0.75BZ Uniti mm May 2004

Contextual Info: STA529 FFX audio codec with analog and digital inputs and 2 x 1.2 W or 2 x 100 mW HP class-D amplifier Datasheet − production data Features • Up to 96 dB dynamic range ■ Sample rates from 8 kHz to 192 kHz ™ TFBGA48 ■ FFX ■ 1.55 V to 1.95 V digital power supply

MO-211

Abstract: TFBGA48 MO211 sot641
Contextual Info: PDF: 2000 Oct 13 Philips Semiconductors Package outline TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 5 x 5 x 0.8 mm D SOT641-1 A B ball A1 index area A A2 E A1 detail X C e1 v M B y y1 C ∅w M b e v M A H e G F E e1 D C B A 1 2

Contextual Info: SOT918-1 TFBGA48; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 19 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

015g

Abstract: TFBGA48
Contextual Info: JEITA Package Code P-TFBGA48-8x9.5-0.75 RENESAS Code PTBG0048HF-A Previous Code 48FHJ/TBP-48F MASS[Typ.] 0.15g D w S A w S B E Pin#1 Index x4 v y1 S y A1 A S S e ZD A e Reference Symbol H G B F E Dimension in Millimeters Min Nom D 8.00 E 9.50 Max v 0.15 w

st802rt1

Abstract: tqfp 7x7 TFBGA48 TQFP48 100BASE
Contextual Info: ST802RT1 10/100 real-time Ethernet 3.3 V transceiver Data Brief Features • IEEE802.3u 100 Base-TX and IEEE802.3 10 Base-T transceiver ■ IEEE802.3u 100 Base-FX fiber interface support TFBGA48 ■ Support for IEEE802.3X flow control ■ Optimized latency for real-time Ethernet

Contextual Info: Package outline TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 4.5 x 4.5 x 0.7 mm B D SOT1155-2 A ball A1 index area E A A2 A1 detail X e1 C e C A B C Øv Øw 1/2 e b H y y1 C e G F E e2 D 1/2 e C B A ball A1 index area 1 2 3 4 5

Contextual Info: P-TFBGA48-6.0x8.0-0.80 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 0.10 TYP. 1/Jan. 18, 2002

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of TFBGA48 package SOT918-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: JEITA Package Code P-TFBGA48-7.5x8.5-0.75 RENESAS Code PTBG0048HB-A Previous Code 48FHH MASS[Typ.] 0.1g w S B b D w S A S AB A A A1 ZD e e H G F E E D C B B ZE y S A x4 1 v Index mark Index mark Laser mark S 2 3 4 5 6 Reference Symbol D E v w A A1 e b x

Contextual Info: P-TFBGA48-0607-0.75AZ

Contextual Info: SOT1155-1 TFBGA48; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 12 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

Contextual Info: RENESAS Code PTBG0048HA-A w S B JEITA Package Code P-TFBGA48-7.5x8.5-0.75 Previous Code 48F7Q D w S A D1 MASS[Typ.] 0.1g b A A1 S AB A ZD e e H G E E1 D B C y S B Reference Symbol A ZE E F 1 x4 v Index mark S 2 3 4 5 6 D E v w A A1 e b x y ZD ZE D1 E1 Dimension in Millimeters

TFBGA48 thermal

Contextual Info: STA529 FFX audio codec with analog and digital inputs and 2 x 1.2 W or 2 x 100 mW HP class-D amplifier Datasheet − production data Features • Up to 96 dB dynamic range ■ Sample rates from 8 kHz to 192 kHz ™ TFBGA48 ■ FFX ■ 1.55 V to 1.95 V digital power supply

Contextual Info: Package outline TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 5 x 5 x 0.8 mm B D SOT918-1 A ball A1 index area E A2 A A1 detail X e1 ∅v ∅w b e M M C C A B C y1 C y J H G F E e2 e D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 X

Contextual Info: Package outline Package description line TFBGA484 A B D ball A1 index area E A A2 A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A ball A1 index area e2 1/2 e 1 2 3 4 5 6 7 9 11 13 15 17 19 21 8 10 12 14 16 18 20 22 X 5 max

Contextual Info: Package outline TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 4.5 x 4.5 x 0.8 mm B D SOT1155-1 A ball A1 index area E A A2 A1 detail X e1 C e ∅v ∅w 1/2 e b H C A B C y y1 C e G F E e2 D 1/2 e C B A ball A1 index area 1 2 3 4

Contextual Info: JEITA Package Code P-TFBGA48-8.5x11-0.75 RENESAS Code PTBG0048HG-A Previous Code 48FHK MASS[Typ.] 0.2g wSB φb φx M S A D wSA A1 A e e ZD AB H G F B E E D C B ZE A y S ×4 1 v Index mark Laser mark S Index mark 2 3 4 5 6 Reference Symbol D E v w A A1 e

Contextual Info: P-TFBGA48-0912-0.75AZ Uniti nn Apr ,2001

M69AW024BE

Abstract: TFBGA48
Contextual Info: M69AW024BE 16 Mbit 1M x16 3V Asynchronous PSRAM FEATURES SUMMARY • ■ ■ ■ ■ ■ SUPPLY VOLTAGE: 2.7 to 3.3V ACCESS TIME: 60ns LOW STANDBY CURRENT: 70µA DEEP POWER DOWN CURRENT: 10µA COMPATIBLE WITH STANDARD LPSRAM TFBGA48 PACKAGE RoHS COMPLIANT

w19b320

Contextual Info: W19B320AT/B Data Sheet 4M x 8/2M × 16 BITS 3V FLEXIBLE BANK FLASH MEMORY Table of Contents1. GENERAL DESCRIPTION . 4 2. FEATURES . 4

M29W320DT

Abstract: M29W320D M29W320DB TFBGA48
Contextual Info: M29W320DT M29W320DB 32 Mbit 4Mb x8 or 2Mb x16, Boot Block 3V Supply Flash Memory FEATURES SUMMARY • SUPPLY VOLTAGE Figure 1. Packages – VCC = 2.7V to 3.6V for Program, Erase and Read – VPP =12V for Fast Program (optional) ■ ACCESS TIME: 70, 90ns

pci slot pcb layout

Abstract: pci pcb layout CBTU0808 PCI express Layout
Contextual Info: NXP 2-lane channel switch CBTU0808 PCI Express channel switch For applications that require dynamic allocation of PCI Express lanes, this small channel switch eases PCB layout while introducing very low latency, preserving signal integrity, and providing bandwidth higher than 1 GHz.