TQFP100 Search Results

TQFP100

Contextual Info: 100P6V-A Plastic 100pin 12✕12mm body TQFP EIAJ Package Code TQFP100-P-1212-0.40 Weight g JEDEC Code – Lead Material Alloy 42 HD D 100 76 1 HE E 75 Symbol 25 51 26 50 A L1 F y A1 b c A2 e L Detail F A A1 A2 b c D E e HD HE L L1 y Dimension in Millimeters

TQFP100

Abstract: 14X14
Contextual Info: SANYO Semiconductor Thin Quad Flat Package 100Pin Plastic TQFP100 14X14 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

Contextual Info: TQFP100—P—1420—0.65A Uniti nn Feb,2007

MN101C56A

Abstract: MN101C56C
Contextual Info: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C (under development) 32 K 48 K 1.79 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E Minimum Instruction Execution Time

TQFP100

Abstract: tQFP100 package TQFP100-P-1414-0
Contextual Info: TQFP100-P-1414-0.50-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

PTQP0100KA-A

Abstract: TQFP100
Contextual Info: JEITA Package Code P-TQFP100-14x14-0.50 RENESAS Code PTQP0100KA-A Previous Code TFP-100B/TFP-100BV MASS[Typ.] 0.5g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 75 51 76 50 bp c c1 HE Reference

TQFP100

Contextual Info: JEITA Package Code P-TQFP100-12x12-0.40 RENESAS Code PTQP0100LB-A Previous Code 100PFB-A MASS[Typ.] 0.4g HD *1 D 75 51 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. *2 HE 50 E 76 26 1 25 ZD Reference

ADSTB xilinx

Abstract: Add.dat XILINX/TSOP 137
Contextual Info: XILINX PROGRAMMER QUALIFICATION SPECIFICATION XC9500XL FAMILY 1. Introduction This document pertains to the following devices and packages: 9536XL - PLCC44, CSP48, and VQFP64 9572XL - PLCC44, CSP48, VQFP64, and TQFP100 95144XL - TQFP100, TQFP144, and CSP144

TQFP100

Abstract: 14X14 TQFP-100
Contextual Info: SANYO Semiconductor Thin Quad Flat Package 100Pin Plastic TQFP100 14X14 Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14 × 14 mm Lead shape

TQFP100

Contextual Info: JEITA Package Code P-TQFP100-14x14-0.50 RENESAS Code PTQP0100KB-D Previous Code TFP-100JV MASS[Typ.] 0.5g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 75 51 76 50 HE c Reference Symbol *2 E

Contextual Info: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C 32 K 48 K 1.5 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E *Pb free (under planning) Minimum Instruction Execution Time

Contextual Info: Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 e ZD w M bp v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TQFP100 package SOT386-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

TQFP100-P-1212-0

Abstract: 100PFB-A
Contextual Info: 100PFB-A Plastic 100pin 12✕12mm body TQFP EIAJ Package Code TQFP100-P-1212-0.40 Weight g Lead Material Cu Alloy MD e JEDEC Code – HD Under Development 76 b2 100 ME D 1 75 l2 25 HE E Recommended Mount Pad Symbol 51 26 50 A L1 e b y A1 c A2 F L Detail F

sot386

Abstract: MA26
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD

Contextual Info: 100PFD-B Plastic 100pin 14 ✕20mm body TQFP Weight g JEDEC Code – Lead Material Cu Alloy MD e EIAJ Package Code TQFP100-P-1420-0.65 HD 100 ME D 1 b2 76 75 l2 Symbol HE E Recommended Mount Pad A A1 A2 b c D E e HD HE L L1 y 51 25 26 A 50 L1 F b y A1 c A2

Contextual Info: JEITA Package Code P-TQFP100-14x14-0.50 RENESAS Code PTQP0100KA-A Previous Code TFP-100B/TFP-100BV MASS[Typ.] 0.5g HD *1 D 75 51 76 NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 50 bp c c1 HE *2 E b1

TQFP-100P

Contextual Info: TQFP100-P-1414-0.50-K 0.125t Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 (g) 版数／改版日 エポキシ樹脂 42 アロイ 半田メッキ(≥5µm) 0.55 TYP. 1 版/00.3.30

TQFP100

Abstract: tQFP100 package MS-026 MS-026 tqfp100
Contextual Info: PDF: 2000 Feb 02 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD

TQFP100

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold FPT-100P-M09

tQFP100 package

Abstract: Atmel STK600 schematic STK600 SC03 New products 1
Contextual Info: Products: 0 Home / Starter kits Subtotal: $0 Shopping List Search / Atmel STK600 -TQFP100 Starter kits Home Store Search Starter kits Select Device Select Category Enter Keywords: Debuggers Starter kits Programmers Atmel STK600 -TQFP100 ATSTK600 -SC03 Touch kits

Contextual Info: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C 32 K 48 K 1.5 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E *Pb free (under planning) Minimum Instruction Execution Time

MS-026

Abstract: 137e20 TQFP100 MS-026 tqfp100
Contextual Info: PDF: 2003 Mar 28 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD v M B