TSSOP56 Search Results

Contextual Info: SO P5 6 TS SOT364-1 TSSOP56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 4 — 15 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape

TSSOP56

Contextual Info: PDF: 2003 Mar 26 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).

SOT364-1

Abstract: TSSOP56
Contextual Info: PDF: 2003 Apr 11 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).

sot364

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).

land pattern for TSSOP56

Abstract: TSSOP56 package TSSOP56
Contextual Info: 56-Pin Thin Shrink Small Outline Package TSSOP56 Package Outline Dimensions Outline Dimensions Unit: mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 29 6.1 ±0.1 56 0 ～10゜ 0.5 1 0.25 typ. 28 0.2 +0.07 –0.06 0.5 0.45 ～ 0.75 0.1 M 14.3 max A 0.1 ±0.05 1.0 ±0.05

TSSOP56

Abstract: TSSOP56 package TSSOP-56
Contextual Info: Thin Shrink Small Outline Package 56pin TSSOP56 パッケージ エンボス方式テーピング寸法 EL テープ形状および寸法 2.0 ±0.1 4.0 ±0.1 Y X’ 14.6 ±0.1 11.5 ±0.1 Y φ2.0 ±0.1 X 0.3 ±0.05 24.0 ±0.3 12.0 ±0.1 φ1.5 +0.1 –0

MO-194

Abstract: sot481
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 4.4 mm; lead pitch 0.4 mm SOT481-1 E D A X c y HE v M A Z 29 56 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 28 bp e w M 2.5

MO-194

Abstract: TSSOP56 sot481
Contextual Info: PDF: 2001 Nov 23 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 4.4 mm SOT481-2 E D A X c y HE v M A Z 29 56 A A2 A 3 A1 pin 1 index θ Lp L detail X 1 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

JEDEC MO-153

Abstract: TSSOP56
Contextual Info: PDF: 2000 Jan 05 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).

TSSOP56

Abstract: RE933-10
Contextual Info: TSSOP56 Adapter thin shrink small outline package RE933-10 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.50 mm (240 mil) - pins: 56 - hole dia 1.00 mm - size 27.00 x 39.50 mm

Contextual Info: Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 28 w M bp e detail X 2.5 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT

TSSOP56

Abstract: TSSOP-56
Contextual Info: Thin Shrink Small Outline Package 56pin TSSOP56 パッケージ 外形図 パッケージ形状および寸法 単位 : mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 29 6.1 ±0.1 56 0 ～10゜ 0.5 1 0.25 typ. 28 0.2 +0.07 –0.06 0.5 0.45 ～ 0.75 0.1 M 14.3 max

Contextual Info: Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 4.4 mm SOT481-2 E D A X c y HE v M A Z 29 56 A A2 A 3 A1 pin 1 index θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A

TSSOP56 package

Abstract: TSSOP56
Contextual Info: 56-Pin Thin Shrink Small Outline Package Embossed EL Tape for the TSSOP56 Package Tape Dimensions 2.0 ±0.1 4.0 ±0.1 Y X’ 14.6 ±0.1 11.5 ±0.1 Y φ2.0 ±0.1 X 0.3 ±0.05 24.0 ±0.3 12.0 ±0.1 φ1.5 +0.1 –0 1.75 ±0.1 Unit: mm Y’ Y’ 8.6 ±0.1 X 1.65 ±0.1

msi 7267 MOTHERBOARD SERVICE MANUAL

Abstract: ttl cookbook msi ms 7267 MOTHERBOARD CIRCUIT diagram "0.4mm" bga "ball collapse" height PCF 799 crystal oscillator 8MHz 4 pins smd diode MARKING F5 44C smd TRANSISTOR code marking A7 terminals diagram of smd transistor bo2 cookbook for ic 555
Contextual Info: GTL/GTLP Logic High-Performance Backplane Drivers Data Book Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information

74ALVT16543

Abstract: 74ALVT16543DGG 74ALVT16543DL 8C12 8EN10
Contextual Info: INTEGRATED CIRCUITS 74ALVT16543 2.5 V/3.3 V ALVT 16-bit registered transceiver 3-State Product data sheet Supersedes data of 1998 Feb 13 Philips Semiconductors 2004 Sep 14 Philips Semiconductors Product data sheet 2.5 V/3.3 V 16-bit registered transceiver (3-State)

clc014aje

Abstract: LMV8244 Video sync splitter lm DS34C86 LMH0074SQ DS8921 HV servo thermopile array 2N3960 DP838640 DS8921 equivalent
Contextual Info: Analog Design Guide for Xilinx FPGAs www.national.com/xilinx 2008 Vol. 1 Analog Solutions for FPGAs .2 Design Tools .3 PowerWise Solutions . 4-5 Data Conversion . 6-12 Amplifiers. 13-23

74ALVT16821

Abstract: 74ALVT16821DGG 74ALVT16821DL JESD78 SSOP56 TSSOP56 diode 1d8
Contextual Info: 74ALVT16821 20-bit bus interface D-type flip-flop; positive-edge trigger; 3-state Rev. 03 — 13 June 2005 Product data sheet 1. General description The 74ALVT16821 high-performance Bipolar Complementary Metal Oxide Semiconductor BiCMOS device combines low static and dynamic power dissipation with

AEC-Q100

Abstract: PCF8576D TQFP64 TSSOP56 smd diode marking s30
Contextual Info: PCF8576D Universal LCD driver for low multiplex rates Rev. 08 — 19 March 2009 Product data sheet 1. General description The PCF8576D is a peripheral device which interfaces to almost any Liquid Crystal Display LCD with low multiplex rates. It generates the drive signals for any static or

74ALVT16501

Abstract: 74ALVT16501DGG 74ALVT16501DL JESD78 SSOP56 TSSOP56 b1238
Contextual Info: 74ALVT16501 18-bit universal bus transceiver; 3-state Rev. 04 — 8 August 2005 Product data sheet 1. General description The 74ALVT16501 is a high-performance Bipolar Complementary Metal Oxide Semiconductor BiCMOS product designed for VCC operation at 2.5 V and 3.3 V with

Contextual Info: INTEGRATED CIRCUITS 74AVC16834A 18-bit registered driver with inverted register enable and Dynamic Controlled Outputs 3-State Product data Supersedes data of 2000 Jul 25 Philips Semiconductors 2002 Sep 11 Philips Semiconductors Product data 18-bit registered driver with inverted register enable

IA LE-4

Abstract: 74ALVC16501 74ALVC16501DGG 74ALVC16501DL SSOP56 TSSOP56 SSOP56 package TC9.5/4.8/TN25/15/HB 541
Contextual Info: Philips Semiconductors Objective Specification 18-Bit Universal bus transceiver; 3-state FEATURES • • • • • • • • QUICK REFERENCE DATA GNP = 0 V ; Timb = 25 °C; t, = t, = 2.5 ns Wide supply voltage range of 1.2 V to 3.6 V In accordance with JEDEC

J13014

Abstract: 74ALVC16646 74ALVC16646DGG 74ALVC16646DL SSOP56 TSSOP56 Philips E10 SOP-56
Contextual Info: Philips Semiconductors Objective Specification 16-Bit bus transceiver/register; 3-state FEATURES • • • • • • • Wide supply voltage range of 1.2 V to 3.6 V In accordance with JEDEC standard rto.8-1A CMOS fow power consumption Multibyte flow-through

BG43

Abstract: ABE 814 16DI 74ALVC16600DGG 74ALVC16600DL SSOP56 TSSOP56
Contextual Info: Philips Semiconductors Objective Specification 18-Bit Universal bus transceiver; 3-state FEATURES • • • • • • • • 74ALVC16600 QUICK REFERENCE DATA GND = 0 V; T « * = 25 °C; t, = t, = 2.5 ns Wide supply voltage range of 1.2 V to 3.6 V In accordance with JEDEC