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XAPP623

Abstract: XC3S500E-FT256 simulation model electrolytic capacitor XC3S500E FG256 FT256 UG112 XAPP489 hyperlynx PCB echo sound
Text: Application Note: Spartan-3E Family R Four- and Six-Layer, High-Speed PCB Design for the Spartan-3E FT256 BGA Package XAPP489 v1.0 October 31, 2006 Summary This application note addresses low-cost, four- to six-layer, high-volume printed circuit board (PCB) layout for a Spartan -3E FPGA in the FT256 1 mm BGA package. The impact of highspeed signals and signal integrity (SI) considerations for low layer count PCB layouts is also