XC73108 Search Results

MC3 117

Abstract: MC128 XC73108 mc103 10 pin MC124 MC116 MC92 mc11-6 PC84 PQ160
Contextual Info:  XC73108 108-Macrocell CMOS CPLD June 1, 1996 Version 1.0 Product Specification Features Macrocells can individually be specified for high performance or low power operation by adding attributes to the logic schematic, or declaration statements to the behavioral

Contextual Info: XC73108 108-Macrocell CMOS EPLD Product Specifications Features • H ig h -P erfo rm an c e E P L D - 7 .5 ns pin-to-pin s p e e d on all fast inputs - 125 M H z m axim um clock freq uen cy • A dvanced D ual-B lock architecture - 2 F ast Function Blocks

Contextual Info: £XILIN X XC73108 108-Macrocell CMOS CPLD June 1, 1996 Version 1.0 Product Specification Features Macrocells can individually be specified for high perfor­ mance or low power operation by adding attributes to the logic schematic, or declaration statements to the behavioral

Contextual Info: XC73108 108-Macrocell CMOS EPLD Product Specifications Features • High-Performance EPLD - 12 ns pin-to-pin delay - 80 MHz maximum clock frequency • Advanced Dual-Block architecture - 2 Fast Function Blocks - 10 High-Density Function Blocks • 100% interconnect matrix

Contextual Info: flX I L I N X XC73108 108-Macrocell CMOS CPLD June 1,1996 Version 1.0 Product Specification Features Macrocells can Individually be specified for high perfor­ mance or low power operation by adding attributes to the logic schematic, or declaration statements to the behavioral

ss-120a

Abstract: MC10126 Xilinx XC73108 XC73108 MGA-S j1360 k319
Contextual Info: E XILINX XC73108 108-Macrocell CMOS CPLD June 1, 1996 Version 1.0 Product Specification Features Macrocells can individually be specified for high perfor­ mance or low power operation by adding attributes to the logic schematic, or declaration statements to the behavioral

XC3030-70PC84C

Abstract: EPM5128LC EP330PC-15 A1020 transistor A1010B-PL68C EPM5128GM EP330PC15 EP330PC XC3042-70PC84C A1020A-PL84C
Contextual Info: ULCt Cross-Reference Matra MHS Cross reference list of devices supported for ULC conversion is not exhaustiv as new devices are added regularly. Additional devices not shown in this list, may also be supported. MHS encourages you to contact your local TEMIC sales representative

XC4010-5PG191M

Abstract: XC4005-5PG156M PA44-48U adapter datasheet pa44-48u SDP72 xilinx 1736a 5962-9230503MXC XC4010-5CB196B SDP-UNIV-44 XC4010-5CB196M
Contextual Info: XCELL THE QUARTERLY Issue 19 Fourth Quarter 1995 JOURNAL FOR XILINX PROGRAMMABLE LOGIC USERS GENERALFEATURES R The Programmable Logic CompanySM Inside This Issue: GENERAL Fawcett: 100,000+ Gates . 2 Guest Editorial . 3

SDP-UNIV-44

Abstract: sdp72 PA44-48U adapter datasheet XC6200 ALL-07 guide pa44-48u allpro 88 PLCC44 pinout design book Micromaster
Contextual Info: XCELL THE QUARTERLY Issue 18 Third Quarter 1995 JOURNAL FOR XILINX PROGRAMMABLE LOGIC USERS GENERALFEATURES R The Programmable Logic CompanySM Inside This Issue: GENERAL Fawcett: PCI Compliance . 2 Guest Editorial: Chuck Fox on Developing New PLD Solutions . 3

electronic components tutorials

Abstract: alu schematic circuit with transistor apollo guidance electronic tutorial circuit books ABEL-HDL Reference Manual 1.20 INCH 7 SEGMENT SINGLE DIGIT circuit diagram for seven segment display in fpga Engineering Design Automation IBM PC AT schematics keyboard schematic xt
Contextual Info: Viewlogic Tutorials PROcapture and PROsim Tutorial X-BLOX Tutorial Xilinx ABEL Tutorial XACT-Performance and Timing Analyzer Tutorial Viewlogic Tutorials — 0401414 01 Printed in U.S.A. Viewlogic Tutorials R , XACT, XC2064, XC3090, XC4005, and XC-DS501 are registered trademarks of Xilinx. All XC-prefix

mach 1 to 5 from amd

Abstract: XC7000 mach 3 family amd mach 3 palasm mach 1 family amd XC7272A X3368 mach 3 amd XC7200
Contextual Info: AMD MACH to Xilinx XC7000 EPLD Design Conversion Process  November 1993 Application Note Introduction Internal Interconnect The XC7000 family’s key advantage over MACH is its Universal Interconnect Matrix UIM . Because this interconnect is 100% populated, there are NO routing issues

MO-83-AF

Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

Xilinx XC73108

Abstract: XC73108 designing flexible pci interfaces with xilinx XC7300 PAR64 REQ64 IOBUF32 CSH-01 x5499 Xilinx XC7300
Contextual Info: Designing Flexible PCI Interfaces With Xilinx EPLDs  January 1995 Application Note – Version 2.0 Abstract nents, peripheral add-in boards, and processor/memory systems. Figure 1 shows a typical PCI-based system. The basic system architecture consists of a processor

BGA PACKAGE thermal profile

Abstract: 225-pin BGA X3365 fine BGA thermal profile XC73108 TEXTOOL zif capacitance in BGA package
Contextual Info: Ball Grid Array Packaging The Cost Effective, High Density EPLD Solution  November 1993 White Paper Introduction profile than conventional PQFPs 1.9 mm versus 3.7 mm which makes the package ideal for high pin count portable applications. The ball grid array (BGA) package is the latest in a series

XC2000

Abstract: XC3000A XC3000L XC3100A XC7300 XC73144-7 XC7336-5 XILINX XC2000 Xilinx XC73108 XC3000 package
Contextual Info: New Product Enhancements New Product Enhancements — 1 Copyright 1995 by Xilinx, Inc. All rights reserved. All trademarks are the property of the respective owners. Xilinx Logic Families Gate Array Xilinx Custom TM Transparent HardWire LCATM Conversion

Contextual Info: K XC7300 CMOS CPLD Family x il in x June 1, 1996 Version 1.0 Product Specification Features Description • The XC7300 family employs a unique Dual-Block architec­ ture that provides high speed operations via Fast Function Blocks and/or high density capability via High Density

TCA780

Abstract: TFK U 111 B TFK U 4614 B TFK S 186 P TFK U 217 B TFK BP w 41 n TFK BPW 41 N Tfk 880 TFK 148 TDSR 5150 G
Contextual Info: Industry Part Number 1N3245 1N3611GP 1N3612GP 1N3613GP 1N3614GP 1N3725 1N3957GP 1N4001GP 1N4002GP 1N4003GP 1N4004GP 1N4005GP 1N4006GP 1N4007GP 1N4245GP 1N4246GP 1N4247GP 1N4248GP 1N4249GP 1N4678.1N4717 1N4728A.1N4761A 1N4933GP 1N4934GP 1N4935GP 1N4936GP

OSC52

Abstract: XC3000 XC3100A XC4000A XC4000E XC4025 XC5200 vq100 xilinx xc3000 xact reference guide
Contextual Info: book : cover 1 Wed Jul 3 10:08:16 1996 R Release Document XACTstep Version 5.2/6.0 Synopsys October 1995 Read This Before Installation book : cover 2 Wed Jul 3 10:08:16 1996 Synopsys Xilinx Development System book : online i Wed Jul 3 10:08:16 1996 Installing Online Documentation

XC3030A

Abstract: XC3020A XC3020L XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 44 12 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

X7055

Abstract: XC7354 XC7372 X7023 X7063 xc7372-10 XC73108 XC73144 x7035 XC7336
Contextual Info:  XC7300 Characterization Data June 1, 1996 Version 1.0 Though this set of characterization data does not include explicit information on the XC7318, XC7336 and XC73144, all XC7300 products are designed using the same circuit configurations, design rules and process technology.

Denso L 918 8

Abstract: Denso L 918 P-PGA-132 MQFP-208 XC4000 XC4000E XC5000 XC1765D 145C XC1700D
Contextual Info: The Reliability Data Program October 1, 1996 Expanded Version Index • • • • • • HTOL High Temperature Operating Life . 85/85 (Bias Moisture Life). PCT (Unbiased Pressure Pot).

XC3020A

Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC2064

Abstract: XC3030 XC2018 XC3020 XC3020A XC3030A XC3042 XC3064 XC3090 xc5204
Contextual Info: 10 44 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA CERAMIC QFP PLASTIC PQFP

Contextual Info: XC7372 72 Macrocell CMOS EPLD HXILINX Advance Product Information The Universal Interconnect Matrix connects the Function Blocks to each other and to all input pins, providing 100% connectivity between the Function Blocks. This allows logic functions to be mapped into the Function Blocks and