XFBGA24 Search Results

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XFBGA24 package SOT1342-1 Hx ball A1 index area P P Hy see detail X Cu pad CP solder land (SL) solder paste deposit (SP) solder land plus solder paste (SR) SR/SL SP occupied area CP

Contextual Info: Package outline SOT1342-1 XFBGA24: plastic, extremely thin fine-pitch ball grid array package; 24 balls A B D ball A1 index area A2 A E A1 detail X e1 C e C A B C Øv Øw b y1 C y E e D e2 C B A 1 ball A1 index area 2 3 4 5 X 2 mm scale Dimensions mm are the original dimensions

SMD transistor M06

Contextual Info: PCAL6416A Low-voltage translating 16-bit I2C-bus/SMBus I/O expander with interrupt output, reset, and configuration registers Rev. 5 — 10 December 2013 Product data sheet 1. General description The PCAL6416A is a 16-bit general-purpose I/O expander that provides remote I/O

SMD transistor M06

Contextual Info: PCAL6416A Low-voltage translating 16-bit I2C-bus/SMBus I/O expander with interrupt output, reset, and configuration registers Rev. 3 — 24 December 2012 Product data sheet 1. General description The PCAL6416A is a 16-bit general purpose I/O expander that provides remote I/O

SMD transistor M06

Abstract: SMD transistor M05 PCA6416A sot1342
Contextual Info: PCAL6416A Low-voltage translating 16-bit I2C-bus/SMBus I/O expander with interrupt output, reset, and configuration registers Rev. 4 — 6 May 2013 Product data sheet 1. General description The PCAL6416A is a 16-bit general-purpose I/O expander that provides remote I/O

TDA5051AT

Abstract: PCA9541A LM75AD SA630D
Contextual Info: Technical Information Technical Information for Breakout Boards OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Preliminary 1 — 9/6/2013 Document information Info Content Keywords Abstract Fm+, I2C-bus, Surface Mount Package, Breakout Board