A0316 Search Results
A0316 Price and Stock
E-Switch Inc A031603COIL SPRING 17.5MM TA SERIES |
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A031603 |
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Belden Inc A0316446TRAY:ORGANIZER 12IN. |
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A0316446 | Bulk | 1 |
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A0316446 | Bulk | 68 | 1 |
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A0316446 |
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Kyocera AVX Components LP0AA0316A700RF FILTER LOW PASS 316MHZ 16ULGA |
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LP0AA0316A700 | Bulk | 280 |
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LP0AA0316A700 | Waffle Pack | 111 Weeks | 35 |
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LP0AA0316A700 | 35 |
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LP0AA0316A700 | 35 | 1 |
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Kyocera AVX Components LP0AA0316A7TR\250MLO FINISHED FILTER - Waffle Pack (Alt: LP0AA0316A7TR\250) |
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LP0AA0316A7TR\250 | Waffle Pack | 111 Weeks | 250 |
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Vishay Intertechnologies CSC06A0316K5FEKCSC06A-03 16.5K 1% EK e3 - Bulk (Alt: CSC06A0316K5FEK) |
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CSC06A0316K5FEK | Bulk | 10 Weeks | 2,000 |
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A0316 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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AX1015
Abstract: A0649869 AX-110BT AX100041 A0390851 AX-5270 A0408829 AX100045 AX101411 AX102212
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Original |
AX101982 10Base-T, RJ-45, 10Base-FL, 10Base2, RJ-45 10Base-T AX-200 AX-270 AX-280 AX1015 A0649869 AX-110BT AX100041 A0390851 AX-5270 A0408829 AX100045 AX101411 AX102212 | |
Contextual Info: SMA Connectors for Flexible Cable MIL-C-39012/55 SMA PLUG OUTER SLEEVE SLEEVE 7 .9 FIGURE 1 M ILITA R Y P A R T NO. M IDW EST P A R T NO. FIGURE 2 FIGURE A SS E M B LY PROCEDURE CATEGORY C A B LE TYPE C OM M ERCIAL ALTE R N A TE -3 0 0 6 -3 0 0 7 -3 0 0 8 |
OCR Scan |
MIL-C-39012/55 39012/5I | |
marking alpha omega
Abstract: alpha marking code A03160 ALPHA OMEGA PART MARKING sot23 marking UA alpha week code
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OCR Scan |
PD-01566 A03160 OT-23 A03160L marking alpha omega alpha marking code ALPHA OMEGA PART MARKING sot23 marking UA alpha week code | |
TN2130Contextual Info: Supertex inc. TN2130 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) TN2130 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
TN2130 TN2130 A031610 | |
VN2110Contextual Info: Supertex inc. VN2110 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VN2110 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
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VN2110 VN2110 A031610 | |
TN0620Contextual Info: Supertex inc. TN0620 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TN0620 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
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TN0620 TN0620 A031610 | |
DN3135Contextual Info: Supertex inc. DN3135 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) DN3135 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
DN3135 DN3135 A031610 | |
vn3205Contextual Info: Supertex inc. VN3205 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) VN3205 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
VN3205 VN3205 A031610 | |
VN2450Contextual Info: Supertex inc. VN2450 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) VN2450 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
VN2450 VN2450 A031610 | |
TN2425Contextual Info: Supertex inc. TN2425 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) TN2425 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
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TN2425 TN2425 A031610 | |
DN2625Contextual Info: Supertex inc. DN2625 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 70 70 11 ± 1.5 Au 1 (mils) DN2625 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
DN2625 DN2625 A031610 | |
VP0808Contextual Info: Supertex inc. VP0808 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length1 Width1 Thickness mils Back Side Metal 45 45 11 ± 1.5 Au (mils) VP0808 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
VP0808 VP0808 A031610 | |
VN3515Contextual Info: Supertex inc. VN3515 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) VN3515 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
VN3515 VN3515 A031610 | |
H957
Abstract: 825 384 6 TACT2
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Original |
24-Lead HV9957 DSFP-HV9957 A062811 H957 825 384 6 TACT2 | |
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TP2520Contextual Info: Supertex inc. TP2520 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TP2520 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
TP2520 TP2520 A031610 | |
TN5335Contextual Info: Supertex inc. TN5335 Die Specification Pad Layout 1 2 0,0 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 56 8.0 ± 1.0 Au 1 (mils) TN5335 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
TN5335 TN5335 A031610 | |
TP2104Contextual Info: Supertex inc. TP2104 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) TP2104 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
TP2104 TP2104 A031610 | |
VP3203Contextual Info: Supertex inc. VP3203 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) VP3203 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
VP3203 VP3203 A031610 | |
DN3535Contextual Info: Supertex inc. DN3535 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) DN3535 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
DN3535 DN3535 A031610 | |
TN2540Contextual Info: Supertex inc. TN2540 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TN2540 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
TN2540 TN2540 A031610 | |
TP2540Contextual Info: Supertex inc. TP2540 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TP2540 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
TP2540 TP2540 A031610 | |
TP2424Contextual Info: Supertex inc. TP2424 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) TP2424 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
TP2424 TP2424 A031610 | |
TP0604Contextual Info: Supertex inc. TP0604 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) TP0604 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
TP0604 TP0604 A031610 | |
Contextual Info: HV4522 HV4622 32-Channel Serial To Parallel Converter with P-Channel Open Drain Outputs Ordering Information Package Options Device Recommended Operating VPP Max 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier 44 Quad Plastic Gullwing |
Original |
HV4522 HV4622 32-Channel HV4522DJ HV4522PJ HV4522PG HV4522X HV4622DJ |