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    AAAB OP Search Results

    AAAB OP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TC75S67TU
    Toshiba Electronic Devices & Storage Corporation Operational Amplifier, 2.2V to 5.5V, Low Noise type:VNI=6nV/√Hz@1kHz, SOT-353F Visit Toshiba Electronic Devices & Storage Corporation
    TC75S102F
    Toshiba Electronic Devices & Storage Corporation Operational Amplifier, 1.5V to 5.5V, I/O Rail to Rail, IDD=0.27μA, SOT-25 Visit Toshiba Electronic Devices & Storage Corporation
    TA75W01FU
    Toshiba Electronic Devices & Storage Corporation Operational Amplifier, Bipolar (358) type Dual Op-Amp, 3V to 12V, SOT-505 Visit Toshiba Electronic Devices & Storage Corporation
    TC75S54F
    Toshiba Electronic Devices & Storage Corporation Operational Amplifier, 1.8V to 7.0V, IDD=100μA, SOT-25/SOT-353 Visit Toshiba Electronic Devices & Storage Corporation
    TC75S55F
    Toshiba Electronic Devices & Storage Corporation Operational Amplifier, 1.8V to 7.0V, IDD=10μA, SOT-25/SOT-353 Visit Toshiba Electronic Devices & Storage Corporation

    AAAB OP Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    EIA-783

    Abstract: EIA-364-13 contact retention EIA-700 AAAB
    Contextual Info: MAXIMUM solutions Mill-Max Now Offers 891 & 893 1 mm Pitch Mezzanine Connectors Mill-Max introduces 64 position, 1 mm pitch mezzanine connectors for parallel board stacking interconnections. The connectors meet EIA-700 AAAB specifications for IEEE 1386 applications.


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    EIA-700 VME64 VME64X EIA-783 EIA-364-13 contact retention EIA-700 AAAB PDF

    Contextual Info: MAXIMUM SOLUTIONS Mill-Max Now Offers 891 & 893 1 mm Pitch Mezzanine Connectors Mill-Max introduces 64 position, 1 mm pitch mezzanine connectors for parallel board stacking interconnections. The connectors meet EIA-700 AAAB specifications for IEEE 1386 applications.


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    EIA-700 VME64 VME64X 891-10-064-30-12000ethod PDF

    Contextual Info: MAXIMUM solutions Mill-Max Now Offers 891 & 893 1 mm Pitch Mezzanine Connectors Mill-Max introduces 64 position, 1 mm pitch mezzanine connectors for parallel board stacking interconnections. The connectors meet EIA-700 AAAB specifications for IEEE 1386 applications.


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    EIA-700 VME64 VME64X 891-10-064-3ethod PDF

    Contextual Info: INTERCONNECTS SERIES 891 & 893 • 1mm GRID SURFACE MOUNT • MALE AND FEMALE CONNECTORS • 64 Position Mezzanine Connectors for board stacking • • • • 1 mm Centerline high density packaging Mated connector board stacking height of 10 mm Conforms to EIA-700 AAAB for IEEE 1386 applictions


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    EIA-700 EIA-783 330mm PDF

    Contextual Info: INTERCONNECTS SERIES 891 & 893 • 1mm GRID SURFACE MOUNT • MALE AND FEMALE CONNECTORS • 64 Position Mezzanine Connectors for board stacking • • • • 1 mm Centerline high density packaging Mated connector board stacking height of 10 mm Conforms to EIA-700 AAAB for IEEE 1386 applictions


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    EIA-700 EIA-783 PDF

    EIA-783

    Contextual Info: INTERCONNECTS SERIES 891 & 893 • 1mm GRID SURFACE MOUNT • MALE AND FEMALE CONNECTORS • 64 Position Mezzanine Connectors for board stacking • • • • 1 mm Centerline high density packaging Mated connector board stacking height of 10 mm Conforms to EIA-700 AAAB for IEEE 1386 applictions


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    EIA-700 EIA-783 EIA-783 PDF

    HPF Switched Capacitor

    Abstract: MN6516 MN6516S
    Contextual Info: INDL/ELEK C I O 75 P A N A S O N IC 1>e | =133652 aaab?S=i M | 6 93 28 52 P ANA SONI C I NDL ♦EL E C T R ONIC . ^:CD-ftË . 72Ç ¿0M 3 1 ^ Æ lh É J z L MN6516, MN6516S MN6516, MN6516S "/?• b * CMOS LSI Switched Capacitor H i g h - P a s s and L o w - P a s s F i l t e r C M O S L S I


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    932J352 MN6516, MN6516S MN6516 HPF Switched Capacitor MN6516S PDF

    EIA-700 AAAB

    Abstract: amp 120527-1 IEEE1386 AAAB
    Contextual Info: Fine Pitch SMT Stacking Connectors Parallel Board-to-Board Catalog 889092 Issued 1 O-97 1 .Omm FH (IEEE 1386) Connectors Product Facts n For board stacking applications n High density packaging on 1.0 [.0391 centerline spacing n Available in standard 64position and optional 84position sizes


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    64position 84position EIA-700 l-800-522-6752 EIA-700 AAAB amp 120527-1 IEEE1386 AAAB PDF

    EIA-700 AAAB

    Abstract: 1-5146896-1 5120521-1 2-5120527-2 EIA-700 1-5146894-1 IEEE1386 1-5120528-1 5146898-1 5120532-1
    Contextual Info: Fine Pitch SMT Stacking Connectors Parallel Board-to-Board 1.0mm Free Height (FH) (IEEE 1386) Connectors Product Facts • For board stacking applications ■ High density packaging on 1.0 [.039] centerline spacing ■ Available in standard 64-position and optional


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    64-position 84-position EIA-700 EIA-700 AAAB 1-5146896-1 5120521-1 2-5120527-2 1-5146894-1 IEEE1386 1-5120528-1 5146898-1 5120532-1 PDF

    Contextual Info: Feat ur es Single P ow er Supply R e a d an d W r i t e V o l t a g e , 5 V ± 5% Hi gh P e r f o r m a n c e j 200 ns M a x i m u m A c c e s s T i m e l m Ë L 6 m s T y p i c a l S e c t o r Wr i t e CMOS Low Power Consumption 25 m A T yp i c a l A c t i v e C u r r e n t By t e M o d e


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    AT5FC008 AT5FC008-20 PDF

    IEEE1386

    Contextual Info: Fine Pitch SMT Stacking Connectors Parallel Board-to-Board 1.0mm Free Height (FH) (IEEE 1386) Connectors Product Facts • For board stacking applications ■ High density packaging on 1.0 [.039] centerline spacing ■ Available in standard 64-position and optional


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    64-position 84-position EIA-700 IEEE1386 PDF

    EIA-700 AAAB

    Abstract: 5120521-1 5120532-1
    Contextual Info: 3 Stacking mm 1.00 1.50 1.50 3.00 3.90 4.00 4.00 4.00 4.20 4.50 4.50 4.70 5.00 5.00 5.00 5.00 5.50 5.90 6.00 6.00 6.00 6.00 6.35 6.60 7.00 7.00 7.00 7.00 8.00 8.00 8.00 8.00 8.13 9.00 9.00 9.00 9.00 9.00 9.91 10.00 10.00 10.00 10.92 11.00 11.00 11.00 11.00


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    EIA-700 EIA-700 AAAB 5120521-1 5120532-1 PDF

    amp 120527-1

    Abstract: EIA-700 AAAB 120527-1 AMP
    Contextual Info: Catalog 1 3 0 7 5 1 5 Issued 9-99 Free Height FH Connectors (Continued) 1.0mm FH (IEEE 1386) Plugs with Locating Posts, 1.0 [.039] Pitch 8 [.315] thru 15 [.591] Stacking Heights Material and Finish: Housing — Liqu id crystal polymer, black Contacts — Phosphor bronze; duplex


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    EIA-700 amp 120527-1 EIA-700 AAAB 120527-1 AMP PDF

    AMP 120521-1

    Contextual Info: Fine Pitch S M T S tack in g C o n n e cto rs Parallel B oard -to-B oard 889092 Revised 2-99 1.0mm FH (IEEE 1386) Receptacles with Locating Posts, 1.0 [.039] Pitch 8 [ 315] thru 15 [ 591] Stacking Heights Material and Finish: Housing — L iq jiri crystal polymer,


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    000050J EIA-700 S23-2 AMP 120521-1 PDF

    Contextual Info: C atalog Fine Pitch SM T Stacking Connectors Parallel Board-to-Board 889092 Revised 2 99 8 [.315] thru 15 [.591] Stacking Heights Material and Finish: Housing — . ¡quid crystal polymer, black Contacts — Phosphor bronze, duplex plated 0.DUO/6 ,'.000030] min. gold on


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    EIA-700 1-8D0-722-1111 PDF

    120521-1

    Contextual Info: Catalog 1307515 Issued 9-99 Free Height FH Connectors (Continued) 1.0mm FH (IEEE 1386) Receptacles with Locating Posts, 1.0 [.039] Pitch 8 [.315] thru 15 [.591] Stacking Heights Material and Finish: Housing — black L iq u id crystal polym er, Contacts — P h o s p h o r bronze; d u p le x


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    EIA-700 120521-1 PDF

    Contextual Info: Catalog 389092 Revised 2-99 Fine Pitch S M T Stacking Connectors Parallel Board-to-Board 1 .0 m m F H ( I E E E 1386) Receptacles with Vacuum Cover, 1 .0 [.039] Pitch 8 [.315] thru 15 [.591] Stacking Heights Material and Finish: Housing — I qu id crystal polymer


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    CQ075 UU003CJ EIA-700 PDF

    Contextual Info: Fine Pitch SMT Stacking Connectors Parallel Board-to-Board 1.0mm FH (IEEE 1386) Plugs with Locating Posts, 1.0 [.039] Pitch 8 [.315] thru 15 [.591] Stacking Heights A 1.0 [.039] Pitch 0.5 [.020] 2 Plc. Material and Finish C L Housing — Liquid crystal polymer,


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    EIA-700 PDF

    AAAB

    Abstract: EIA-700 AAAB
    Contextual Info: Catalog 1 3 0 7 5 1 5 Issued 9-99 Free Height FH Connectors (Continued) 1.0mm FH (IEEE 1386) Receptacles with Vacuum Cover, 1.0 [.039] Pitch Mezzanine/Stacking 8 [.315] thru 15 [.591] Stacking Heights -A 10 [.039] “ H Material and Finish:


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    EIA-700 AAAB EIA-700 AAAB PDF

    5120523-2

    Contextual Info: Fine Pitch SMT Stacking Connectors Parallel Board-to-Board 1.0mm FH (IEEE 1386) Receptacles with Locating Posts, 1.0 [.039] Pitch 8 [.315] thru 15 [.591] Stacking Heights A 1.0 [.039] Pitch 0.6 [.024] 2 Plc. Material and Finish Housing — Liquid crystal polymer,


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    EIA-700 5120523-2 PDF

    Contextual Info: Fine Pitch SMT Stacking Connectors Parallel Board-to-Board 1.0mm FH (IEEE 1386) Receptacles without Locating Posts, 1.0 [.039] Pitch 8 [.315] thru 15 [.591] Stacking Heights A 1.0 [.039] Pitch 0.6 [.024] 2 Plc. Material and Finish Housing — Liquid crystal polymer,


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    EIA-700 PDF

    Contextual Info: Fine Pitch SMT Stacking Connectors Parallel Board-to-Board 1.0mm FH (IEEE 1386) Plugs without Locating Posts, 1.0 [.039] Pitch 8 [.315] thru 15 [.591] Stacking Heights A 1.0 [.039] Pitch 0.5 [.020] 2 Plc. C L Material and Finish Housing — Liquid crystal polymer,


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    EIA-700 PDF

    EIA-700 AAAB

    Abstract: SC140 149 dsi MSC8103 freescale superflash MSC81xx
    Contextual Info: Digital Signal Processors MSC81x2 DSP High-Volume Packet Telephony Farm Card 81x2PFC-HV Overview designers can use to evaluate, develop, test and The MSC81x2 High-Volume Packet Telephony deliver telephony software on the Freescale Farm Card (81x2PFC-HV) is a hardware evaluation


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    MSC81x2 81x2PFC-HV) MSC81xx 81x2PFC-HV MSC81x2 MSC8103 HDI16 EIA-700 AAAB SC140 149 dsi freescale superflash PDF

    sda 5222

    Contextual Info: 13 10 3 A :iRcun SIZE DIM.B DIM. C DIM. D I3.90 .547 I8.90 .744 23.90 .941 28.90 1.138 33.90 1.335 35.90 1.413 38.90 1.531 43.90 1.728 45.90 1.807 48.90 1.925 53.90 2.122 58.90 2.319 63.90 2.516 9.00 .354 14.00 .551 19.00 .748 24.00 .945 29.00 1.142 31.00


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    SDA-71439-3* sda 5222 PDF