AB-40 INTEL Search Results
AB-40 INTEL Result Highlights (1)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
---|---|---|---|---|---|
EN80C188XL-20 |
![]() |
80C188XL - MPU Intel 186 CISC 16-Bit |
![]() |
![]() |
AB-40 INTEL Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
---|---|---|---|
stk*402-270
Abstract: stk408 STK402-270 Sanyo audio amplifier STK402-200 STK402-240 STK408-000 series TM-35 stk402-000 stk402 110
|
Original |
ENN7072 STK402-270 STK402-200 STK408-000 4191-SIP19 STK402-270] stk*402-270 stk408 STK402-270 Sanyo audio amplifier STK402-240 STK408-000 series TM-35 stk402-000 stk402 110 | |
AB-40Contextual Info: intel. AB-40 APPLICATION BRIEF 32-Bit Math Routines for the 8051 RICK SCHUE REGIONAL APPLICATIONS SPECIALIST INDIANAPOLIS, IN D IA N A October 1992 Order Number: 270530-002 Information in this document is provided in connection with Intel products. Intel assumes no liability whatsoev |
OCR Scan |
AB-40 32-Bit /xxxx/0296/B | |
eer3016
Abstract: EER3016 transformer ZD101 22V ZD101 Fuse 250V 2A 56k 1kv 5d-9 BD101 IC301 1k 275vac
|
Original |
AB-50 LC-40W-FSDM07652R FSDM07652R 240Vac V/80mA EER3016 MBRF10100 BD101 2KBP06M3N257 220rst eer3016 EER3016 transformer ZD101 22V ZD101 Fuse 250V 2A 56k 1kv 5d-9 BD101 IC301 1k 275vac | |
EER-5345
Abstract: CTV-217W-KA5Q1565RF KA5Q1565RF 10D-9 eer5345 10D9 VR201 L202 ctv circuit diagram EER53
|
Original |
AB-40 CTV-217W-KA5Q1565RF KA5Q1565RF EGP20D EER5345 RT101 10D-9 BD101 IC101 EER-5345 CTV-217W-KA5Q1565RF KA5Q1565RF 10D-9 eer5345 10D9 VR201 L202 ctv circuit diagram EER53 | |
transistor C3
Abstract: EC 401 TRANSISTOR
|
Original |
BLF6G20-40 BLF6G20-40 transistor C3 EC 401 TRANSISTOR | |
EER3530
Abstract: ST-40W-FSDM0565 LF102 EER-3530 FSDM0565 ST-40W BD101 FOD2741 FSDM0565R AB-55
|
Original |
AB-55 ST-40W-FSDM0565 FSDM0565R 240Vac V/80mA EER3530 EGP20D EER3530 ST-40W-FSDM0565 LF102 EER-3530 FSDM0565 ST-40W BD101 FOD2741 FSDM0565R | |
stk*404-070
Abstract: STK404-130 STK404-070 STK404-050 STK404-090 STK404-140 transistor ac 125 equivalent stk404-120
|
Original |
ENN7343 STK404-070 STK404-000 4198-SIP10 STK404-070] stk*404-070 STK404-130 STK404-070 STK404-050 STK404-090 STK404-140 transistor ac 125 equivalent stk404-120 | |
Contextual Info: Package outline HBGA672: plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink B D SOT835-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AK AH AF AD AB Y V T P M K H F D B AJ AG AE e AC heatsink AA W U e2 R N |
Original |
HBGA672: OT835-1 MS-034 | |
Contextual Info: Package outline HBGA1312: plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink B D SOT624-1 A ball A1 index area A E A2 A1 detail X C e1 AV AT AP AM AK AH AF AD AB Y V T P M K H F D B ∅w M C AW AU AR AN AL AJ AG |
Original |
HBGA1312: OT624-1 MS-034 | |
Contextual Info: Package outline HBGA600: plastic thermal enhanced ball grid array package; 600 balls; body 40 x 40 x 0.9 mm; heatsink B D SOT605-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AK AH AF AD AB Y F B AJ AG AE e AC heatsink AA e2 R M D AL U T P H N L J |
Original |
HBGA600: OT605-1 | |
Contextual Info: Package outline HBGA1092: plastic thermal enhanced ball grid array package; 1092 balls; body 40 x 40 x 1.75 mm; heatsink SOT948-1 B D D1 A ball A1 index area E1 j E A A2 A1 detail X e1 e AV AT AP AM AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b 1/2 e AU AR |
Original |
HBGA1092: OT948-1 MS-034 | |
AB-40
Abstract: 6 BIT MUL OF 8051 AB-40 intel B10M intel 8051 application intel 8051 application information
|
Original |
AB-40 32-Bit AB-40 6 BIT MUL OF 8051 AB-40 intel B10M intel 8051 application intel 8051 application information | |
Contextual Info: Package outline HBGA760: plastic thermal enhanced ball grid array package; 760 balls; body 40 x 40 x 1.75 mm; heatsink D D1 SOT846-1 B A ball A1 index area j E1 E A A2 A1 detail X C e1 e AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b 1/2 e M M AJ AG e AE AC |
Original |
HBGA760: OT846-1 | |
Contextual Info: Package outline HBGA624: plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm; heatsink D D1 SOT860-1 B A ball A1 index area j E1 E A A2 A1 detail X C e1 e AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b 1/2 e M M AJ AG e AE AC |
Original |
HBGA624: OT860-1 | |
|
|||
Contextual Info: Package outline HBGA564: plastic thermal enhanced ball grid array package; 564 balls; body 40 x 40 x 1.75 mm; heatsink SOT799-1 B D A D1 ball A1 index area A j A2 E1 E A1 detail X C e1 e 1/2 e y1 C ∅v M C A B b y ∅w M C AK AH AF AD AB Y V T P M K H F D |
Original |
HBGA564: OT799-1 MS-034 | |
Contextual Info: Package outline BGA956: plastic ball grid array package; 956 balls; body 40 x 40 x 1.75 mm SOT651-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AV AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U |
Original |
BGA956: OT651-1 MS-034 | |
Contextual Info: BLF6G10L-40BRN Power LDMOS transistor Rev. 3 — 16 November 2010 Product data sheet 1. Product profile 1.1 General description 40 W LDMOS power transistor for base station applications at frequencies from 700 MHz to 1 GHz. Table 1. Typical performance Typical RF performance at Tcase = 25 °C in a class-AB production test circuit. |
Original |
BLF6G10L-40BRN | |
Contextual Info: BLF6G10L-40BRN Power LDMOS transistor Rev. 2 — 27 August 2010 Preliminary data sheet 1. Product profile 1.1 General description 40 W LDMOS power transistor for base station applications at frequencies from 700 MHz to 1 GHz. Table 1. Typical performance Typical RF performance at Tcase = 25 °C in a class-AB production test circuit. |
Original |
BLF6G10L-40BRN | |
RO4350Contextual Info: BLF6G10L-40BRN Power LDMOS transistor Rev. 3 — 16 November 2010 Product data sheet 1. Product profile 1.1 General description 40 W LDMOS power transistor for base station applications at frequencies from 700 MHz to 1 GHz. Table 1. Typical performance Typical RF performance at Tcase = 25 °C in a class-AB production test circuit. |
Original |
BLF6G10L-40BRN RO4350 | |
810 souriau
Abstract: ATC100B RO4350 souriau 810
|
Original |
BLF6G10L-40BRN 810 souriau ATC100B RO4350 souriau 810 | |
Contextual Info: Package outline BGA564: plastic ball grid array package; 564 balls; body 40 x 40 x 1.75 mm SOT947-1 B D D1 A ball A1 index area E1 E A A1 A2 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E |
Original |
BGA564: OT947-1 MS-034 | |
Contextual Info: Package outline BGA760: plastic ball grid array package; 760 balls; body 40 x 40 x 1.75 mm SOT652-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E |
Original |
BGA760: OT652-1 MS-034 | |
Contextual Info: Package outline BGA656: plastic ball grid array package; 656 balls; body 40 x 40 x 1.75 mm SOT588-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E |
Original |
BGA656: OT588-1 MS-034 | |
Contextual Info: Package outline BGA658: plastic ball grid array package; 658 balls; body 40 x 40 x 1.75 mm SOT623-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AK AH AF AD AB Y V T P M K H F D B AJ e AG AE AC AA W U e2 R N |
Original |
BGA658: OT623-1 MS-034 |