acy smd
Abstract: No abstract text available
Text: Honeyw ell.com http://w w w .honeyw ell.com Test & Measurement (https://measurementsensors.honeyw ell.com/) Sensing and Control Search the entire website and product database (/) HOME ABOUT US (/about honeyw ell (/sensinghome) sensing and control) KEY INDUSTRIES
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173-501APC-301
acy smd
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Untitled
Abstract: No abstract text available
Text: 256Mb: x16, x32 2.5V VEXT, 1.8V VDD, 1.8V VDDQ, RLDRAM REDUCED LATENCY DRAM RLDRAM MT49H8M32 – 1 Meg x 32 x 8 Banks MT49H16M16 – 2 Meg x 16 x 8 Banks Features Figure 1: 144-Ball µFBGA • 256Mb • Organization 8 Meg x 32, 16 Meg x 16 in 8 banks
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256Mb:
MT49H8M32
MT49H16M16
144-Ball
256Mb
09005aef81121545/source:
09005aef810c0ffc
256Mbx16x32RLDRAM
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Untitled
Abstract: No abstract text available
Text: 256Mb: x16, x32 2.5V VEXT, 1.8V VDD, 1.8V VDDQ, RLDRAM REDUCED LATENCY DRAM RLDRAM MT49H8M32 – 1 Meg x 32 x 8 Banks MT49H16M16 – 2 Meg x 16 x 8 Banks Features Figure 1: 144-Ball µFBGA • 256Mb • Organization 8 Meg x 32, 16 Meg x 16 in 8 banks
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256Mb:
256Mb
09005aef81121545/source:
09005aef810c0ffc
256Mbx16x32RLDRAM
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smd transistor marking HT1
Abstract: 256Mb SMD d1c smd transistor d4d MT49H16M16 MT49H8M32 F1198 38P11
Text: 256Mb: x16, x32 2.5V VEXT, 1.8V VDD, 1.8V VDDQ, RLDRAM Features Reduced Latency DRAM RLDRAM MT49H8M32 – 1 Meg x 32 x 8 Banks MT49H16M16 – 2 Meg x 16 x 8 Banks For the latest data sheet, refer to Micron’s Web site: www.micron.com/products/dram/rldram/
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256Mb:
MT49H8M32
MT49H16M16
144-Ball
se-3900
09005aef81121545/source:
09005aef810c0ffc
256Mbx16x32RLDRAM
smd transistor marking HT1
256Mb
SMD d1c
smd transistor d4d
MT49H16M16
MT49H8M32
F1198
38P11
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Untitled
Abstract: No abstract text available
Text: 256Mb: x16, x32 2.5V VEXT, 1.8V VDD, 1.8V VDDQ, RLDRAM REDUCED LATENCY DRAM RLDRAM MT49H8M32 – 1 Meg x 32 x 8 Banks MT49H16M16 – 2 Meg x 16 x 8 Banks Features Figure 1: 144-Ball µFBGA • 256Mb • Organization 8 Meg x 32, 16 Meg x 16 in 8 banks
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PDF
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256Mb:
256Mb
09005aef81121545/source:
09005aef810c0ffc
256Mbx16x32RLDRAM
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BA6A
Abstract: marking code d2c smd
Text: 256Mb: x16, x32 2.5V VEXT, 1.8V VDD, 1.8V VDDQ, RLDRAM REDUCED LATENCY DRAM RLDRAM MT49H8M32 – 1 Meg x 32 x 8 Banks MT49H16M16 – 2 Meg x 16 x 8 Banks Features Figure 1: 144-Ball µFBGA • 256Mb • Organization 8 Meg x 32, 16 Meg x 16 in 8 banks
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256Mb:
256Mb
09005aef81121545/source:
09005aef810c0ffc
256Mbx16x32RLDRAM
BA6A
marking code d2c smd
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Untitled
Abstract: No abstract text available
Text: 256Mb: x16, x32 2.5V VEXT, 1.8V VDD, 1.8V VDDQ, RLDRAM Features Reduced Latency DRAM RLDRAM MT49H8M32 – 1 Meg x 32 x 8 banks MT49H16M16 – 2 Meg x 16 x 8 banks For the latest data sheet, refer to Micron’s Web site: www.micron.com/products/dram/rldram/
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256Mb:
MT49H8M32
MT49H16M16
09005aef81121545/source:
09005aef810c0ffc
256Mbx16x32RLDRAM
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WL 431
Abstract: 431 SMD CODE MARKING smd marking AB 6 PIN INFINEON PART MARKING smd transistor d4d RC-5 receiver transistor smd code marking 431 transistor SMD DK SMD CODE N10 smd code marking wl
Text: 256Mb: x16, x32 2.5V VEXT, 1.8V VDD, 1.8V VDDQ, RLDRAM Features REDUCED LATENCY DRAM RLDRAM MT49H8M32 – 1 Meg x 32 x 8 banks MT49H16M16 – 2 Meg x 16 x 8 banks For the latest data sheet, refer to Micron’s Web site: www.micron.com/rldram Features Figure 1:
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256Mb:
MT49H8M32
MT49H16M16
09005aef81121545/source:
09005aef810c0ffc
256Mbx16x32RLDRAM
WL 431
431 SMD CODE MARKING
smd marking AB 6 PIN
INFINEON PART MARKING
smd transistor d4d
RC-5 receiver
transistor smd code marking 431
transistor SMD DK
SMD CODE N10
smd code marking wl
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smd marking codes BA5
Abstract: MT49H16M18C
Text: ADVANCE‡ 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization - 16 Meg x 18, 32 Meg x 9 Separate I/O
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288Mb
288Mb
MT49H16M18C
smd marking codes BA5
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SMD d1c
Abstract: SMD MARKING CODE ACY qkx capacitor smd codes marking A21 MT49H16M18C
Text: ADVANCE‡ 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization - 16 Meg x 18, 32 Meg x 9 Separate I/O
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288Mb
288Mb
clo68-3900
MT49H16M18C
SMD d1c
SMD MARKING CODE ACY
qkx capacitor
smd codes marking A21
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MT49H16M18C
Abstract: No abstract text available
Text: 16 Meg x 18 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II Features 288Mb SIO Reduced Latency RLDRAM II MT49H16M18C For the latest data sheet, refer to Micron’s Web site: www.micron.com/rldram Features Figure 1: • 400 MHz DDR operation (800 Mb/s/pin data rate)
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288Mb
MT49H16M18C
09005aef80a41b59/Source:
09005aef811ba111
MT49H8M18C
MT49H16M18C
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15READ
Abstract: marking ba5 MT49H8M18C MT49H16M18C
Text: 288Mb: 16 Meg x 18 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II Features 288Mb SIO Reduced Latency RLDRAM II MT49H16M18C For the latest data sheet, refer to Micron’s Web site: www.micron.com/rldram Features Figure 1: • 400 MHz DDR operation (800 Mb/s/pin data rate)
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288Mb:
288Mb
MT49H16M18C
09005aef80a41b59/Source:
09005aef811ba111
MT49H8M18C
15READ
marking ba5
MT49H16M18C
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smd dk qk
Abstract: SMD MARKING CODE ACY smd marking codes BA5 smd marking codes BA2 RLDRAM MT49H16M18C
Text: ADVANCE‡ 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization - 16 Meg x 18, 32 Meg x 9 Separate I/O
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288Mb
288Mb
clo68-3900
MT49H16M18C
smd dk qk
SMD MARKING CODE ACY
smd marking codes BA5
smd marking codes BA2
RLDRAM
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MT49H16M18C
Abstract: No abstract text available
Text: PRELIMINARY‡ 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C Features Figure 1: 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization • 16 Meg x 18, 32 Meg x 9 Separate I/O
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288Mb
288Mb
MT49H8M18C
MT49H16M18C
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MT49H16M18C
Abstract: No abstract text available
Text: ADVANCE‡ 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C FEATURES Figure 1 144-Ball µBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization - 16 Meg x 18, 32 Meg x 9 Separate I/O
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288Mb
288Mb
clo68-3900
MT49H16M18C
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BA5 marking
Abstract: BA7 marking plastic BA5 marking code A53 SMD Marking Code ba7 transistor SMD MARKING CODE ACY MT49H16M18C smd cod RLDRAM A22 SMD MARKING CODE
Text: 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C Features Figure 1: 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization • 16 Meg x 18, 32 Meg x 9 Separate I/O
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PDF
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288Mb
MT49H16M18C
MT49H32M9C
144-Ball
288Mb
09005aef80a41b59/zip:
09005aef811ba111
MT49H8M18C
BA5 marking
BA7 marking
plastic BA5 marking code
A53 SMD Marking Code
ba7 transistor
SMD MARKING CODE ACY
MT49H16M18C
smd cod
RLDRAM
A22 SMD MARKING CODE
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MT49H16M18
Abstract: No abstract text available
Text: PRELIMINARY‡ 8 MEG x 36, 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM II 288MB CIO REDUCED LATENCY RLDRAM II MT49H8M36 MT49H16M18 MT49H32M9 Features Figure 1: 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization
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288MB
288Mb
09005aef809f284b
MT49H8M36
MT49H16M18
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09005aef809f284b
Abstract: No abstract text available
Text: 8 MEG x 36, 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM II 288MB CIO REDUCED LATENCY RLDRAM II MT49H8M36 MT49H16M18 MT49H32M9‡ Features Figure 1: 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization
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288MB
288Mb
MT49H8M36
MT49H16M18
09005aef80a41b46/zip:
09005aef809f284b
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hspice MT49H16M36
Abstract: MT49H16M36FM MT49H16M36 MT49H32M18FM
Text: Advance‡ 576Mb: x36, x18, x9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM II Features 576Mb CIO Reduced Latency RLDRAM II MT49H16M36 MT49H32M18 MT49H64M9 For the latest data sheet, refer to Micron’s Web site: www.micron.com/rldram Features Figure 1: • 533 MHz DDR operation (1,067 Mb/s/pin data rate)
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576Mb:
576Mb
MT49H16M36
MT49H32M18
MT49H64M9
09005aef81fe35b2/Source:
09005aef81f83d49
hspice MT49H16M36
MT49H16M36FM
MT49H32M18FM
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MT49H16M18
Abstract: No abstract text available
Text: PRELIMINARY‡ 8 MEG x 36, 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM II 288Mb CIO REDUCED LATENCY RLDRAM II MT49H8M36 MT49H16M18 MT49H32M9 Features Figure 1: 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization
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288Mb
288Mb
MT49H8M36
MT49H16M18
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MARKING H1 AMP
Abstract: MT49H16M18
Text: ADVANCE‡ 8 MEG x 36, 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM II 288Mb CIO REDUCED LATENCY RLDRAM II MT49H8M36 MT49H16M18 MT49H32M9 FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization
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PDF
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288Mb
288Mb
output0006,
MT49H8M36
MARKING H1 AMP
MT49H16M18
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plastic BA7 marking code
Abstract: No abstract text available
Text: ADVANCE‡ 8 MEG x 36, 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM II 288Mb CIO REDUCED LATENCY RLDRAM II MT49H8M36 MT49H16M18 MT49H32M9 FEATURES Figure 1 144-Ball µBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization
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PDF
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288Mb
288Mb
output0006,
MT49H8M36
plastic BA7 marking code
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MT49H16M18
Abstract: No abstract text available
Text: PRELIMINARY‡ 8 MEG x 36, 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM II 288MB CIO REDUCED LATENCY RLDRAM II MT49H8M36 MT49H16M18 MT49H32M9 Features Figure 1: 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization
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288MB
288Mb
MT49H8M36
MT49H16M18
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SAF-C515C
Abstract: No abstract text available
Text: • a53SbDS DQfl3SMb 3 1 7 Device Specifications C515C SIEMENS 10 Device Specifications 10.1 A bsolute M aximum Ratings Ambient temperature under bias TA . 0 'C to + 110 °C Storage temperature ( T St ) . - 65 "C to + 150 °C
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OCR Scan
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PDF
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a53SbDS
C515C
235b05
P-MQFP-80-1
CI80x
SAF-C515C
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