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PCN0404

Abstract: SUMITOMO g700l sumitomo EME G700L G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700
Contextual Info: PROCESS CHANGE NOTICE PCN0404 ADDITIONAL MOLD COMPOUND FOR TQFP 144 PACKAGE Change Description: The Sumitomo G700L mold compound is being added as additional mold compound choice for selected Altera devices in thin quad flat pack TQFP 144 lead packages assembled by

AUS308

Abstract: AUS308 thermal kester 256 AUS303 AUS-308 aus5 kester 245 solder wire Lead Free reflow soldering profile BGA
Contextual Info: Challenges in Manufacturing Reliable Lead-Free and RoHS-Compliant Components WP-CHMFGRELLDFR-2.0 White Paper The push for lead-free or RoHS-compliant products is resulting in significant changes in packaging materials. Manufacturers of electronic equipment require materials that

ADV0501

Abstract: JESD97 JESD-97 marking tm altera marking advisory E2- marking marking code e3 marking code E4 JEDEC Code e3 MARKING CODE E2
Contextual Info: CUSTOMER ADVISORY ADV0501 Implementing Pb-Free Marking Codes and Indication on Labels Change Description: Altera will implement the RoHS compliant Pb-free eN category code device marking and revise the moisture-barrier bag and shipping-box label to contain eN category codes and

JEDEC J-STD-020d.1

Abstract: paste profile J-STD-020d.1 JEDEC SMT reflow profile Altera ROHS AN81 J-STD-020D J-STD-033
Contextual Info: Reflow Soldering Guidelines for Lead-Free and RoHS-Compliant Packages AN-353-3.0 Application Note This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow

BYTEBLASTER

Abstract: 7128s ByteBlasterMV EPM7064S EPM7128S EPM7256S max 7128S programmer jam player 7128AE
Contextual Info: In-System Programmability Guidelines May 1999, ver. 3 Introduction Application Note 100 As time-to-market pressures increase, design engineers require advanced system-level products to ensure problem-free development and manufacturing. Programmable logic devices PLDs with in-system

embedded c programming examples

Abstract: Agilent 3070 Tester ByteBlasterMV IN SYSTEM PROGRAMMING DATASHEET SPECIFICATION CAN ISP JTAG series termination resistors jam player
Contextual Info: 11. In-System Programmability Guidelines for MAX II Devices MII51013-1.7 Introduction As time-to-market pressure increases, design engineers require advanced systemlevel products to ensure problem-free development and manufacturing. Programmable logic devices PLDs with in-system programmability (ISP) can help

Agilent 3070 Tester

Abstract: jam player altera usb blaster
Contextual Info: Chapter 11. In-System Programmability Guidelines for MAX II Devices MII51013-1.5 Introduction As time-to-market pressure increases, design engineers require advanced system-level products to ensure problem-free development and manufacturing. Programmable logic devices PLDs with in-system

Contextual Info: Customer Interface Customer Interface • • Holtek provides the ASIC designer with four methods to ensure a smooth and trouble-free interface to the Holtek design process. Depending upon the design tools and methodology used by the designer, one of the following ways may

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

BITBLASTER

Abstract: jtag mhz
Contextual Info: In-System Programmability in MAX Devices September 2005, ver. 1.5 Application Note 95 Introduction MAX® devices are programmable logic devices PLDs , based on the Altera® Multiple Array MatriX (MAX) architecture that and supports the IEEE Std. 1149.1 Joint Test Action Group (JTAG) interface. MAX devices

d4564163-a80

Abstract: NEC D4564163-A80 d4564163 sdram controller MT48LC4M32B2-7 d456 MT48LC4M32B2 SDR100 MT48LC2M32B2 EP2S60F672C5
Contextual Info: 1. SDRAM Controller Core NII51005-7.1.0 Core Overview The SDRAM controller core with Avalon interface provides an Avalon Memory-Mapped Avalon-MM interface to off-chip SDRAM. The SDRAM controller allows designers to create custom systems in an Altera® FPGA that connect easily to SDRAM chips. The SDRAM

EPF10K10

Abstract: EPF10K10A EPF10K20 EPF10K30 EPF10K30A EPF10K40 EPF10K50
Contextual Info: In-System Programmability June 2000, ver. 1.03 in MAX Devices Application Note 95 Introduction MAX® devices are programmable logic devices PLDs , based on the Altera® Multiple Array MatriX (MAX) architecture that and supports the IEEE Std. 1149.1 Joint Test Action Group (JTAG) interface. MAX devices

BGA780

Contextual Info: 5. Reference and Ordering Information SIIGX51007-1.3 Software Stratix II GX devices are supported by the Altera® Quartus® II design software, which provides a comprehensive environment for system-on-a-programmable-chip SOPC design. The Quartus II software

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256FBGA

Abstract: 240-PQFP "CHIP EXPRESS" 144TQFP PACKAGE proteus CHIP EXPRESS EPF10K30 RA10K10AQ-C-208 CHIPX semiconductors replacement guide
Contextual Info: FPGA Replacement for Altera FLEX 10K Series Products Introduction Proteus for Altera FLEX 10K Series PLDs is the latest addition to the Proteus FPGA Replacement Program from Chip Express. Proteus devices are now available to replace OEM production FPGAs from Xilinx and

strapack s-669

Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Contextual Info: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,

Contextual Info: Enpirion Power Datasheet EY1602 40V, Low Quiescent Current, 50mA Linear Regulator DS-1046 Datasheet The Altera Enpirion® EY1602 is a wide input voltage range, low quiescent current linear regulator ideally suited for “always-on” and “keep alive” applications.

fbga Substrate design guidelines

Abstract: FR4 substrate epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 relative permittivity of fr4 FR4 epoxy dielectric constant 4.2 FR4 4.9 dielectric constant FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.9 FR4 dielectric constant and loss tangent at 2.4 G EP2S15
Contextual Info: Section VI. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:

8B10B

Abstract: ED8B10B
Contextual Info: Sign in/register Download Center Products End Markets Technology Home > Training Buy Online > Support About Altera Buy Online Literature myAltera Account Search View Cart Frequently Asked Questions Customer Service View Cart Order Status Terms and Conditions

Contextual Info: Buy On-Line - BuyAltera.com Download Center Products End Markets Frequently Asked Questions Technology Training Support About Altera Buy Online Literature Sign in/register myAltera Account Search Home > Buy Online > View Cart Customer Service View Cart

Application of dsp in military science

Abstract: TILE64 radar sensor specification Raytheon Company
Contextual Info: White Paper Assessing FPGA DSP Benchmarks at 40 nm Introduction Benchmarking the performance of algorithms, devices, and programming methodologies is a well-worn topic among developers and research of high-performance computing appliances. Independent and partisan benchmark results are

EPF6016TC144-3

Abstract: relay Re 04501 re 04501 relay USART 8251 lms algorithm using vhdl code C8251 NEC RELAY 10PIN 5V 8251 uart vhdl PDN9516 verilog code for Modified Booth algorithm
Contextual Info: Newsletter for Altera Customers ◆ Second Quarter ◆ May 1998 Altera Unveils FLEX 10KE Devices Altera recently unveiled enhanced versions of FLEX ␣ 10K embedded programmable logic devices— FLEX 10KE devices. Fabricated on a 0.25-µm, five-layer-metal process with a 2.5-V core, FLEX 10KE

EPM7128STC100-15

Abstract: EPF10K50RI240-4 ALTERA MAX EPM7128SQC100-15 EPF10K10LC84-3 qpsk modulation VHDL CODE 304 QFP amkor ALTERA EPF10K50RI240-4 MAX7000S EPF10K10LC84-4 EPF10K20A
Contextual Info: Newsletter for Altera Customers ◆ First Quarter ◆ February 1997 FLEX Devices: The Gate Array Alternative Altera’s FLEX 10K and FLEX 8000 devices combine the flexibility of programmable logic devices PLDs with the density and efficiency of gate arrays. As PLD unit

PCN0904

Abstract: EP3C16Q240C8N EP3C10E144C8N EP3C16F484C6 ep3C40F484C8N EP3C40F780I7N ep3c16 EP3C25F324C8N EP3C25E144I7N EP3C120F484I7N
Contextual Info: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0904 Cyclone III Family Process Shrink from 65-nm to 60-nm and Package Bill of Material Change Change Description This is an update to PCN0904, please see revision history table for information specific to this